Patent search cpc:"H01L2224/05639" Page 1

1.

发明授权
Au系钎料模片接合半导体装置及其制造方法失效

公开(公告)号：CN104798185B

公开(公告)日：2018-04-10

申请号：CN201380059808.0

申请日：2013-11-13

Applicant: 日产自动车株式会社 , 三垦电气株式会社

Inventor： 谷本智 , 佐藤伸二 , 谷泽秀和 , 松井康平

IPC: H01L21/52

CPC classification number: H01L23/49513 , H01L21/4853 , H01L23/3735 , H01L23/4827 , H01L23/488 , H01L23/492 , H01L23/49548 , H01L23/49562 , H01L23/49582 , H01L24/03 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L2224/0345 , H01L2224/04026 , H01L2224/05082 , H01L2224/05155 , H01L2224/05166 , H01L2224/05639 , H01L2224/2732 , H01L2224/291 , H01L2224/29144 , H01L2224/32059 , H01L2224/3207 , H01L2224/32225 , H01L2224/32245 , H01L2224/32505 , H01L2224/7501 , H01L2224/75102 , H01L2224/75251 , H01L2224/75756 , H01L2224/83011 , H01L2224/83022 , H01L2224/83048 , H01L2224/83075 , H01L2224/8309 , H01L2224/83101 , H01L2224/8321 , H01L2224/83385 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/83457 , H01L2224/83815 , H01L2924/01322 , H01L2924/12042 , H01L2924/15747 , H01L2924/15787 , H01L2924/35121 , H01L2924/3651 , H01L2924/01032 , H01L2924/01014 , H01L2924/0105 , H01L2924/014 , H01L2924/00014 , H01L2924/01027 , H01L2924/01015 , H01L2924/00012 , H01L2924/00

Abstract: 本发明的半导体装置在半导体元件(1)和以Cu为主要原料的Cu基板(2)之间夹持有Au系钎料层(3)，且在Cu基板(2)和Au系钎料层(3)之间配设有具有以在俯视时成为规定形状的方式构图的微细槽(24)的致密金属膜(23)，分别在Cu基板(2)、Au系钎料层(3)及致密金属膜(23)的微细槽(24)埋设有以Cu和Au为主要元素的微小哑铃截面构造体(4)。

2.

发明授权
晶片封装体有权

公开(公告)号：CN104701285B

公开(公告)日：2018-03-23

申请号：CN201510063568.2

申请日：2011-01-13

Applicant: 精材科技股份有限公司

Inventor： 林佳升 , 蔡佳伦 , 徐长生 , 李柏汉

IPC: H01L23/485 , H01L21/60

CPC classification number: H01L21/76898 , H01L21/481 , H01L21/76897 , H01L23/3178 , H01L23/3192 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/19 , H01L24/94 , H01L27/14618 , H01L27/14636 , H01L2224/02372 , H01L2224/0345 , H01L2224/0401 , H01L2224/04026 , H01L2224/04105 , H01L2224/05548 , H01L2224/05567 , H01L2224/05624 , H01L2224/05639 , H01L2224/05647 , H01L2224/05655 , H01L2224/06181 , H01L2224/1132 , H01L2224/11462 , H01L2224/11849 , H01L2224/13022 , H01L2224/131 , H01L2224/20 , H01L2224/94 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/00

Abstract: 提供一种晶片封装体，晶片封装体包括半导体基底，具有第一表面和相对的第二表面。间隔层设置在半导体基底的第二表面下方，并且盖板设置在间隔层下方。形成凹陷部邻接半导体基底的侧壁，由半导体基底的第一表面至少延伸至间隔层。然后，保护层设置在半导体基底的第一表面之上以及凹陷部内。本发明可提升晶片封装体的信赖性，并避免导线层产生脱层现象。

3.

发明授权
形成嵌入式SOP扇出型封装的半导体器件和方法有权转让

公开(公告)号：CN103515252B

公开(公告)日：2018-01-30

申请号：CN201310158510.7

申请日：2013-05-02

Applicant: 新科金朋有限公司

Inventor： 林耀剑 , 陈康

IPC: H01L21/56 , H01L21/60 , H05K3/34 , H01L23/31 , H01L23/538

CPC classification number: H01L23/49827 , H01L21/4853 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/78 , H01L23/3114 , H01L23/3121 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/5389 , H01L23/562 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/27 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/03 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05082 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06131 , H01L2224/06133 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/11849 , H01L2224/11901 , H01L2224/12105 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16225 , H01L2224/2101 , H01L2224/215 , H01L2224/2401 , H01L2224/24011 , H01L2224/2402 , H01L2224/245 , H01L2224/27334 , H01L2224/32225 , H01L2224/32245 , H01L2224/45147 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48245 , H01L2224/48247 , H01L2224/48811 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/73253 , H01L2224/73265 , H01L2224/73267 , H01L2224/81191 , H01L2224/82101 , H01L2224/82104 , H01L2224/82106 , H01L2224/83132 , H01L2224/83191 , H01L2224/83192 , H01L2224/83856 , H01L2224/85411 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/92147 , H01L2224/92244 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2924/00011 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H01L2924/3512 , H01L2924/00014 , H01L2924/00 , H01L2224/03 , H01L2924/00012 , H01L2224/83 , H01L2224/85 , H01L2224/27 , H01L2924/014 , H01L2924/01082 , H01L2924/0105 , H01L2224/81805 , H01L2924/01005

Abstract: 本发明涉及形成嵌入式SoP扇出型封装的半导体器件和方法。一种半导体器件，包括球栅阵列（BGA）封装，球栅阵列（BGA）封装包括第一凸块。在第一凸块之间将第一半导体管芯安装至BGA封装。将BGA封装和第一半导体管芯安装至载体。将第一密封剂沉积在载体之上以及BGA封装和第一半导体管芯周围。移除载体，以暴露第一凸块和第一半导体管芯。将互连结构电连接至第一凸块和第一半导体管芯。BGA封装还包括衬底和第二半导体管芯，第二半导体管芯被安装且电连接至衬底。将第二密封剂沉积在第二半导体管芯和衬底之上。在衬底之上与第二半导体管芯相对地形成第一凸块。在BGA封装之上形成翘曲平衡层。

4.

发明授权
基板、其制造方法及其应用有权转让

公开(公告)号：CN104425394B

公开(公告)日：2018-01-12

申请号：CN201410436888.3

申请日：2014-08-29

Applicant: 财团法人工业技术研究院

Inventor： 蔡曜骏 , 许镇鹏 , 温士逸 , 杨季瑾 , 胡鸿烈

IPC: H01L23/14 , H01L23/60 , H01L21/48

CPC classification number: H01L23/481 , G02B6/12 , G02B6/34 , G02B2006/12061 , H01L21/30604 , H01L21/486 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/49827 , H01L23/60 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/80 , H01L25/167 , H01L27/0255 , H01L29/861 , H01L33/20 , H01L33/62 , H01L2224/04 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/06102 , H01L2224/08148 , H01L2224/08238 , H01L2224/16148 , H01L2224/16238 , H01L2224/29294 , H01L2224/32148 , H01L2224/32238 , H01L2224/48091 , H01L2224/48105 , H01L2224/48148 , H01L2224/48229 , H01L2224/73265 , H01L2224/80801 , H01L2224/80805 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83805 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2924/00014 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1434 , H01L2933/0066 , H01S5/0208 , H01S5/02469 , H01S5/026 , H01S5/34 , H01L2924/00 , H01L2224/80 , H01L2924/00012 , H01L2224/45099

Abstract: 本发明公开一种基板、其制造方法及其应用，该基板包括基材、两个导体结构以及至少一二极管。两个导体结构分别从基材的第一表面，经由贯穿基材的两个穿孔，延伸到基材的第二表面。至少一二极管埋入于所述穿孔其中之一的一侧壁的基材中。

5.

发明授权
电子部件安装基板及其制造方法有权

公开(公告)号：CN103855037B

公开(公告)日：2018-01-09

申请号：CN201310625260.3

申请日：2013-11-28

Applicant: 同和金属技术有限公司

Inventor： 砂地直也 , 小山内英世 , 栗田哲

IPC: H01L21/48 , H01L21/60 , H01L23/488

CPC classification number: H01L21/4857 , C23C24/106 , H01L23/3735 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/29006 , H01L2224/29294 , H01L2224/29339 , H01L2224/2949 , H01L2224/32013 , H01L2224/32225 , H01L2224/83009 , H01L2224/83075 , H01L2224/83192 , H01L2224/83203 , H01L2224/83385 , H01L2224/83395 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83455 , H01L2224/83464 , H01L2224/8384 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/15787 , H01L2924/203 , Y10T428/12472 , H01L2924/00012 , H01L2924/00015 , H01L2924/01015 , H01L2924/00014 , H01L2924/01014 , H01L2924/01005 , H01L2924/00 , H01L2924/0002

Abstract: 本发明提供一种电子部件安装基板，包括：大致具有矩形平面形状的铝或铝合金的（用于安装电子部件的）金属板（10），该金属板（10）的一个主面经表面处理从而具有不低于0.2微米的表面粗糙度；形成在金属板（10）的一个主面上的镍或镍合金的镀膜（20）；通过（含有银的烧结体的）银粘接层（12）与镀膜（20）相接合的电子部件（14）；大致具有矩形平面形状的陶瓷基板（16），该陶瓷基板（16）的一个主面与金属板（10）的另一主面相接合；以及与陶瓷基板（16）的另一主面相接合的散热金属板（金属底板）（18）。