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公开(公告)号：CN108461474A
公开(公告)日：2018-08-28
申请号：CN201810105995.6
申请日：2018-02-02
Applicant: 英飞凌科技股份有限公司
IPC: H01L23/498 , H01L21/48
CPC classification number: H01L24/13 , H01L21/304 , H01L21/31053 , H01L21/32115 , H01L23/3157 , H01L24/03 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/40 , H01L24/48 , H01L24/73 , H01L24/84 , H01L2224/03002 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/06181 , H01L2224/1146 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/13193 , H01L2224/13564 , H01L2224/1357 , H01L2224/16104 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/40227 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/73263 , H01L2224/73265 , H01L2224/84801 , H01L2224/94 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/1033 , H01L2924/1431 , H01L2924/1434 , H01L2924/014 , H01L2924/00014 , H01L2924/00012 , H01L2224/03
Abstract: 本发明涉及半导体器件、制作其的方法和加强其中的管芯的方法。一种半导体器件可包括：管芯，所述管芯包括第一主面、第二主面和侧面，所述侧面连接第一主面和第二主面；至少一个传导柱，所述至少一个传导柱布置在所述管芯的第一主面上并且电耦合到所述管芯；以及绝缘体，所述绝缘体布置在所述管芯的第一主面上，所述绝缘体包括上主面和侧面，其中所述至少一个传导柱被暴露在所述绝缘体的上主面上，并且其中所述管芯的侧面和所述绝缘体的侧面是共面的。
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公开(公告)号：CN103493200B
公开(公告)日：2016-06-22
申请号：CN201180070201.3
申请日：2011-04-18
Applicant: 三菱电机株式会社
IPC: H01L23/31 , H01L23/495 , H01L23/492 , B60L11/18 , B60L15/00
CPC classification number: H01L25/07 , B60L11/1803 , B60L15/007 , H01L23/3107 , H01L23/49524 , H01L23/49551 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/02166 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/05553 , H01L2224/05567 , H01L2224/05571 , H01L2224/0603 , H01L2224/06181 , H01L2224/27013 , H01L2224/291 , H01L2224/32245 , H01L2224/33181 , H01L2224/3701 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/40247 , H01L2224/40249 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48699 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/84385 , H01L2224/84801 , H01L2224/8485 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01082 , H01L2924/014 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H02K11/33 , H02M7/537 , Y02T10/645 , Y02T10/7005 , H01L2924/00 , H01L2924/00012 , H01L2224/05552
Abstract: 本发明的半导体装置包括：通过焊料（61）与第一基板（11）接合的第一MOS-FET（21）、通过焊料（64）与第二基板（12）接合的第二MOS-FET（22）、将第一基板（11）与第二MOS-FET（22）接合的第一引线（31）、以及将第二MOS-FET（22）与电流路径构件（13）接合的第二引线（32），该电流路径构件（13）从外部接受两个MOS-FET（21、22）的导通电流或将两个MOS-FET（21、22）的导通电流传输到外部，第二基板12的刚性高于两条引线（31、32）的刚性，而且，包含由两个MOS-FET（21、22）相对的间隙部（52）、并向两个MOS-FET（21、22）不相对的方向延伸的边界线（D-D）与第二基板（12）相交，而不与两条引线（31、32）相交。
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公开(公告)号：CN105304596A
公开(公告)日：2016-02-03
申请号：CN201510329026.5
申请日：2015-06-15
Applicant: 罗伯特·博世有限公司
IPC: H01L23/48
CPC classification number: H01L22/32 , H01L22/14 , H01L2224/04034 , H01L2224/04042 , H01L2224/05599 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
Abstract: 一种层状结构型式的用于确定功率半导体(31)的电流的构件(30)，构件具有：第一接触面(33)，第一接触面的上侧能够与连接元件、尤其是键合引线(32)连接并且第一接触面的下侧与功率半导体(31)连接；第二接触面(35)和具有焊料的层(34)，具有焊料的层设置在功率半导体的下侧上和第二接触面的上侧上，其中，具有焊料的层(34)将功率半导体和第二接触面相互连接，其特征在于，第二接触面具有至少两个部分面(36、37)；其中，第一接触面和第二接触面(35)的第一部分面(36)能够与电流源电连接；第一接触面和第二接触面的第二部分面(37)能够与电压测量装置电连接；从而能够实施三线电流检测。
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公开(公告)号：CN104885218A
公开(公告)日：2015-09-02
申请号：CN201280078050.0
申请日：2012-12-28
Applicant: 三菱电机株式会社
CPC classification number: H03L1/022 , H01L23/34 , H01L23/58 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/40 , H01L24/48 , H01L24/73 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/06181 , H01L2224/291 , H01L2224/32225 , H01L2224/40137 , H01L2224/48091 , H01L2224/48247 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/014 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/37099
Abstract: 具有：半导体元件，其具有栅极，并由栅极电压进行控制；栅极驱动电路，其控制该栅极电压；电极，其与该半导体元件连接，流过该半导体元件的主电流；温度检测部，其检测该电极的温度；生成部，其基于由该温度检测部检测出的温度，生成在该电极的温度不超过预定的温度的范围内向该半导体元件提供最大的通电量的第1控制信号；以及比较部，其将该第1控制信号与为了控制该栅极电压而从外部传送的第2控制信号进行比较，选择能够抑制该电极的温度一方的控制信号即选择控制信号。而且，该栅极驱动电路根据该选择控制信号控制该栅极电压。
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公开(公告)号：CN104377138A
公开(公告)日：2015-02-25
申请号：CN201410393889.4
申请日：2014-08-12
Applicant: 英飞凌科技股份有限公司
CPC classification number: H01L23/49575 , H01L21/561 , H01L21/568 , H01L23/36 , H01L23/49562 , H01L24/24 , H01L24/25 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L24/96 , H01L27/14618 , H01L2224/04034 , H01L2224/04042 , H01L2224/04105 , H01L2224/06181 , H01L2224/2518 , H01L2224/32245 , H01L2224/40247 , H01L2224/45014 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2224/73273 , H01L2224/73277 , H01L2224/85 , H01L2224/96 , H01L2924/12043 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/18162 , H01L2924/19107 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/82 , H01L2924/00014
Abstract: 本发明涉及具有背面管芯金属化的模制的半导体封装。通过提供在管芯的第一侧处具有端子的半导体管芯，提供在该管芯的相对的第二侧处耦合到该管芯的材料，并且把该管芯嵌入到模制复合物中以便该管芯在除了第一侧外的所有侧上由该模制复合物所覆盖，来制造半导体封装。该模制复合物在邻近该管芯的第二侧的模制复合物的侧处被减薄，以在不暴露该管芯的第二侧的情况下暴露该管芯的第二侧处的材料。形成到该管芯的第一侧处的端子的电连接。在晶体管管芯的情况下，该端子能够是源端子，并且该晶体管管芯能够源极向下附接到金属块，诸如引线框的管芯座。
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Patent Agency Ranking
公开(公告)号：CN103515260A
公开(公告)日：2014-01-15
申请号：CN201310261023.3
申请日：2013-06-26
Applicant: 英飞凌科技奥地利有限公司
CPC classification number: H01L23/3135 , H01L21/561 , H01L21/568 , H01L23/3107 , H01L23/49537 , H01L23/49541 , H01L23/49548 , H01L23/49575 , H01L23/5389 , H01L24/05 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/25 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/83 , H01L24/85 , H01L24/96 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/04105 , H01L2224/05184 , H01L2224/05187 , H01L2224/05611 , H01L2224/05618 , H01L2224/05624 , H01L2224/05638 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05684 , H01L2224/211 , H01L2224/24011 , H01L2224/24137 , H01L2224/245 , H01L2224/2518 , H01L2224/27318 , H01L2224/291 , H01L2224/29116 , H01L2224/2919 , H01L2224/29294 , H01L2224/29339 , H01L2224/32225 , H01L2224/40095 , H01L2224/40105 , H01L2224/40227 , H01L2224/40247 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45499 , H01L2224/48091 , H01L2224/48105 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/48472 , H01L2224/48476 , H01L2224/48499 , H01L2224/48611 , H01L2224/48618 , H01L2224/48624 , H01L2224/48638 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48684 , H01L2224/48711 , H01L2224/48718 , H01L2224/48724 , H01L2224/48738 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48784 , H01L2224/48811 , H01L2224/48818 , H01L2224/48824 , H01L2224/48838 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/48884 , H01L2224/73263 , H01L2224/73265 , H01L2224/73267 , H01L2224/82101 , H01L2224/82104 , H01L2224/82106 , H01L2224/83815 , H01L2224/8385 , H01L2224/83851 , H01L2224/83862 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85815 , H01L2224/92136 , H01L2224/92137 , H01L2224/92247 , H01L2924/00011 , H01L2924/01322 , H01L2924/014 , H01L2924/12032 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/01022 , H01L2924/01073 , H01L2924/01044 , H01L2924/01074 , H01L2924/04941 , H01L2924/04953 , H01L2924/0498 , H01L2924/0496 , H01L2924/0474 , H01L2924/0475 , H01L2924/0478 , H01L2924/0476 , H01L2924/0454 , H01L2924/0455 , H01L2924/0458 , H01L2924/0456 , H01L2924/00012 , H01L2924/01013 , H01L2924/01047 , H01L2924/01079 , H01L2924/01046 , H01L2924/01029 , H01L2924/01028 , H01L2924/01042 , H01L2924/01015 , H01L2924/0105 , H01L2924/0509 , H01L2924/01006 , H01L2924/01014 , H01L2924/0103 , H01L2924/01078 , H01L2924/0665 , H01L2924/01082 , H01L2924/01049 , H01L2924/01083 , H01L2924/00 , H01L2924/20759 , H01L2924/2076 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/2075 , H01L2924/20754 , H01L2224/83205
Abstract: 本发明涉及封装内封装及其形成方法。根据本发明的实施方式，半导体器件包括具有多个引线和小片焊盘的引线框、以及被连接到所述引线框的小片焊盘的半导体模块。所述半导体模块包括配置在第一密封剂中的第一半导体芯片。所述半导体模块具有耦接到所述第一半导体芯片的多个接触垫。所述半导体器件进一步包括将所述多个接触垫与多个引线耦接的多个互连件、以及被配置在所述半导体模块和引线框的第二密封剂。
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公开(公告)号：CN103493200A
公开(公告)日：2014-01-01
申请号：CN201180070201.3
申请日：2011-04-18
Applicant: 三菱电机株式会社
CPC classification number: H01L25/07 , B60L11/1803 , B60L15/007 , H01L23/3107 , H01L23/49524 , H01L23/49551 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/02166 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/05553 , H01L2224/05567 , H01L2224/05571 , H01L2224/0603 , H01L2224/06181 , H01L2224/27013 , H01L2224/291 , H01L2224/32245 , H01L2224/33181 , H01L2224/3701 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/40247 , H01L2224/40249 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48699 , H01L2224/73215 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/84385 , H01L2224/84801 , H01L2224/8485 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01082 , H01L2924/014 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/1815 , H01L2924/3511 , H02K11/33 , H02M7/537 , Y02T10/645 , Y02T10/7005 , H01L2924/00 , H01L2924/00012 , H01L2224/05552
Abstract: 本发明的半导体装置包括：通过焊料（61）与第一基板（11）接合的第一MOS-FET（21）、通过焊料（64）与第二基板（12）接合的第二MOS-FET（22）、将第一基板（11）与第二MOS-FET（22）接合的第一引线（31）、以及将第二MOS-FET（22）与电流路径构件（13）接合的第二引线（32），该电流路径构件（13）从外部接受两个MOS-FET（21、22）的导通电流或将两个MOS-FET（21、22）的导通电流传输到外部，第二基板12的刚性高于两条引线（31、32）的刚性，而且，包含由两个MOS-FET（21、22）相对的间隙部（52）、并向两个MOS-FET（21、22）不相对的方向延伸的边界线（D-D）与第二基板（12）相交，而不与两条引线（31、32）相交。
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公开(公告)号：CN103178030A
公开(公告)日：2013-06-26
申请号：CN201210568793.8
申请日：2012-12-24
Applicant: 英飞凌科技股份有限公司
CPC classification number: H01L23/48 , H01L23/24 , H01L23/3107 , H01L23/3135 , H01L23/3735 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L23/49811 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/0603 , H01L2224/06181 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/37124 , H01L2224/37147 , H01L2224/37155 , H01L2224/3716 , H01L2224/37639 , H01L2224/37647 , H01L2224/37655 , H01L2224/3766 , H01L2224/4005 , H01L2224/40095 , H01L2224/40137 , H01L2224/40227 , H01L2224/40247 , H01L2224/4103 , H01L2224/41051 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48464 , H01L2224/4847 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48766 , H01L2224/48769 , H01L2224/48771 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8381 , H01L2224/8382 , H01L2224/8385 , H01L2224/83851 , H01L2224/84801 , H01L2224/8482 , H01L2224/8485 , H01L2224/85447 , H01L2224/92247 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/141 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2924/15787 , H01L2924/181 , H01L2924/19105 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/0105 , H01L2924/01049 , H01L2924/01014 , H01L2924/01028 , H01L2924/01015 , H01L2924/20759
Abstract: 本发明涉及一种包括安装在DCB衬底上的分立器件的模块及用于制造该模块的方法，该模块包括DCB衬底以及安装在DCB衬底上的分立器件，其中，分立器件包括：引线框架；安装在引线框架上的半导体芯片；以及覆盖半导体芯片的封装材料。
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公开(公告)号：CN104603934B
公开(公告)日：2018-01-16
申请号：CN201380044807.9
申请日：2013-08-09
Applicant: 三菱电机株式会社
CPC classification number: H05K1/0203 , H01L23/13 , H01L23/36 , H01L23/3735 , H01L23/492 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/04026 , H01L2224/04034 , H01L2224/04042 , H01L2224/0603 , H01L2224/06181 , H01L2224/29111 , H01L2224/32245 , H01L2224/37012 , H01L2224/37147 , H01L2224/4005 , H01L2224/40105 , H01L2224/4024 , H01L2224/4118 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4824 , H01L2224/48472 , H01L2224/49175 , H01L2224/73263 , H01L2224/73265 , H01L2224/83424 , H01L2224/83447 , H01L2224/8346 , H01L2224/83801 , H01L2224/84447 , H01L2224/84801 , H01L2224/85205 , H01L2224/92247 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/15724 , H01L2924/15747 , H01L2924/1576 , H01L2924/16152 , H01L2924/16172 , H01L2924/16251 , H01L2924/181 , H01L2924/19107 , H01L2224/48247 , H01L2924/00012 , H01L2224/291 , H01L2924/014 , H01L2924/00014 , H01L2224/92252 , H01L2224/85 , H01L2224/40499 , H01L2224/8546 , H01L2224/85424 , H01L2224/85447 , H01L2924/01074 , H01L2224/3716 , H01L2224/37124 , H01L2924/01083 , H01L2924/01051 , H01L2924/00 , H01L2924/207 , H01L2224/48624 , H01L2924/00011 , H01L2224/48647 , H01L2224/4866 , H01L2224/48824 , H01L2224/4886 , H01L2224/48747 , H01L2224/48847 , H01L2224/48724 , H01L2224/4876 , H01L2924/013 , H01L2924/01029 , H01L2924/01047 , H01L2924/00013 , H01L2924/2076
Abstract: 本发明具备：传热板(4)，隔着绝缘层(8)接合散热部件(9)；印制基板(3)，相对传热板(4)隔开规定的间隔地配置，在外侧面形成了的电极图案(32)的附近设置了开口部(3a)；电力用半导体元件(2)，配置于传热板(4)与印制基板(3)之间，背面与传热板(4)接合；以及布线部件(5)，一端与在电力用半导体元件(2)的表面形成了的主电力用电极(21C)的第1接合部接合，另一端与第2接合部(32p)接合，构成为在从主电力用电极(21C)朝向印制基板(3)地在垂直方向上延伸的空间中放入第2接合部(32p)的至少一部分，并且在从开口部(3a)起在垂直方向上延伸的空间中包含第1接合部。
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公开(公告)号：CN107431058A
公开(公告)日：2017-12-01
申请号：CN201680015610.6
申请日：2016-02-15
Applicant: 派克泰克封装技术有限公司
IPC: H01L23/482 , H01L21/60 , H01L21/283 , H01L23/49 , H01L21/268
CPC classification number: H01L24/48 , B23K26/20 , H01L24/03 , H01L24/05 , H01L24/16 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/77 , H01L24/81 , H01L24/84 , H01L24/85 , H01L2224/04034 , H01L2224/04042 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/16225 , H01L2224/37026 , H01L2224/37147 , H01L2224/40091 , H01L2224/40225 , H01L2224/40491 , H01L2224/40992 , H01L2224/40997 , H01L2224/4112 , H01L2224/45005 , H01L2224/45147 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/48247 , H01L2224/48839 , H01L2224/48847 , H01L2224/73255 , H01L2224/77263 , H01L2224/77281 , H01L2224/77601 , H01L2224/77611 , H01L2224/77704 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81464 , H01L2224/84214 , H01L2224/84424 , H01L2224/84439 , H01L2224/84444 , H01L2224/84447 , H01L2224/84455 , H01L2224/84464 , H01L2224/8484 , H01L2224/8485 , H01L2224/84986 , H01L2224/85051 , H01L2224/85203 , H01L2224/85214 , H01L2224/85379 , H01L2224/8584 , H01L2924/00014 , H01L2924/10253 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/1579 , H01L2224/13099
Abstract: 本发明涉及一种芯片装置(10)以及一种用于在芯片(18)和导体材料带(14)之间构成接触连接部(11)的方法，所述芯片尤其是功率晶体管等，其中导体材料带在不导电的衬底(12)上构成，其中芯片设置在衬底或导体材料带(15)上，其中分别在芯片的芯片接触面(25)和导体材料带(28)上施加银膏(29)或者铜膏，其中接触导体(30)浸入到芯片接触面上的银膏或铜膏中并且浸入到导体材料带上的银膏或铜膏中，其中包含在银膏或铜膏中的溶剂通过加热至少部分地蒸发，其中接触连接部通过如下方式构成：银膏或铜膏借助于激光能量烧结。
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