Patent search cpc:"H01L2224/2949" Page 1

1.

发明公开
工程聚合物类电子材料有权

公开(公告)号：CN107771354A

公开(公告)日：2018-03-06

申请号：CN201680018886.X

申请日：2016-03-31

Applicant: 爱法组装材料公司

Inventor： R·H·温卡塔吉利亚帕 , M·迪阿维拉里巴斯 , B·达斯 , H·H·西达帕 , S·穆克尔基 , S·萨卡尔 , B·辛格 , R·劳特 , R·潘德尔

IPC: H01L23/488 , H01L23/29 , H01L21/60 , H01L21/48 , B23K1/00 , B23K1/20 , B23K35/02 , B23K35/36 , C08K3/00 , C08K3/04 , C08K5/00 , C08K5/092 , C08K5/18 , C08K5/49 , C08K7/02 , C08L63/00 , C08L83/04

CPC classification number: C08K3/04 , B23K1/0016 , B23K1/20 , B23K35/00 , B23K35/0244 , B23K35/025 , B23K35/3602 , B23K2101/42 , C08K3/013 , C08K3/042 , C08K5/00 , C08K7/02 , H01L23/295 , H01L23/296 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/1131 , H01L2224/11312 , H01L2224/1132 , H01L2224/1141 , H01L2224/11418 , H01L2224/11422 , H01L2224/1301 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/1329 , H01L2224/133 , H01L2224/13311 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13386 , H01L2224/13387 , H01L2224/13393 , H01L2224/13439 , H01L2224/13444 , H01L2224/13447 , H01L2224/13486 , H01L2224/13487 , H01L2224/1349 , H01L2224/13499 , H01L2224/2731 , H01L2224/27312 , H01L2224/2732 , H01L2224/2741 , H01L2224/27418 , H01L2224/27422 , H01L2224/27436 , H01L2224/27602 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29386 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29486 , H01L2224/29487 , H01L2224/2949 , H01L2224/29499 , H01L2224/73204 , H01L2224/8184 , H01L2224/81856 , H01L2224/81862 , H01L2224/81874 , H01L2224/8321 , H01L2224/83851 , H01L2224/83856 , H01L2224/83862 , H01L2224/83874 , H01L2924/12041 , H01L2924/3841 , C08L63/00 , C08L83/04 , C08K5/092 , C08K5/18 , C08K5/49 , C08L2205/025 , H01L2924/014 , H01L2924/00014 , H01L2924/0105 , H01L2924/01047 , H01L2924/01029 , H01L2924/01006 , H01L2924/00012 , H01L2924/05341 , H01L2924/07001 , H01L2924/0715 , H01L2924/0675 , H01L2924/0665 , H01L2924/06 , H01L2924/01079 , H01L2924/053 , H01L2924/01102 , H01L2924/01103 , H01L2924/01109 , H01L2924/01009 , H01L2924/0503 , H01L2924/01005 , H01L2924/066 , H01L2924/0635 , H01L2924/061 , H01L2924/05432 , H01L2924/04642 , H01L2924/05032 , H01L2924/05442 , H01L2924/0542 , H01L2924/0103 , C08K3/00

Abstract: 一种用于电子组装方法的组合物，该组合物包含分散在有机介质中的填料，其中：该有机介质包含聚合物；该填料包含石墨烯、官能化石墨烯、氧化石墨烯、多面体低聚倍半硅氧烷、石墨、二维材料、氧化铝、氧化锌、氮化铝、氮化硼、银、纳米纤维、碳纤维、金刚石、碳纳米管、二氧化硅和金属涂布的颗粒中的一种或多种，并且，基于组合物的总重量，该组合物包含0.001～40重量％的填料。

2.

发明授权
金属粒子膏糊、使用了其的固化物及半导体装置有权

公开(公告)号：CN104425055B

公开(公告)日：2017-08-15

申请号：CN201410452753.6

申请日：2014-09-05

Applicant: 株式会社东芝

Inventor： 平塚大祐 , 井口知洋 , 内田雅之

IPC: H01B1/22 , C09K5/10 , H01L23/29

CPC classification number: B23K35/025 , B22F1/0003 , B22F1/0018 , B22F1/0074 , B22F2999/00 , B23K35/24 , B23K35/262 , B23K35/264 , B23K35/282 , B23K35/286 , B23K35/30 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/3033 , B23K35/32 , B23K35/322 , B23K35/325 , B23K35/3601 , B23K35/362 , C22C1/0491 , C22C5/06 , H01L21/4867 , H01L23/3737 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/0381 , H01L2224/04026 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/27003 , H01L2224/271 , H01L2224/2732 , H01L2224/2741 , H01L2224/2744 , H01L2224/29006 , H01L2224/29294 , H01L2224/29313 , H01L2224/29318 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2936 , H01L2224/29364 , H01L2224/29369 , H01L2224/29371 , H01L2224/29372 , H01L2224/29373 , H01L2224/29376 , H01L2224/29378 , H01L2224/2938 , H01L2224/2949 , H01L2224/32225 , H01L2224/32245 , H01L2224/325 , H01L2224/32503 , H01L2224/32507 , H01L2224/83075 , H01L2224/83192 , H01L2224/832 , H01L2224/83203 , H01L2224/83205 , H01L2224/8322 , H01L2224/83411 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/83464 , H01L2224/83469 , H01L2224/8384 , H01L2924/01102 , H01L2924/10253 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1067 , H01L2924/12044 , H01L2924/15787 , H01L2924/0543 , H01L2924/01031 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , B22F1/0022

Abstract: 根据本发明，可提供含有极性溶剂、和分散在上述极性溶剂中且包含第一金属的粒子的金属粒子膏糊。在上述极性溶剂中，溶解有与上述第一金属不同的第二金属。本发明还提供了使用了该金属粒子膏糊的固化物及半导体装置。

3.

发明公开
低压力烧结粉末有权

公开(公告)号：CN106457383A

公开(公告)日：2017-02-22

申请号：CN201580026546.7

申请日：2015-04-10

Applicant: 阿尔法金属公司

Inventor： S·戈沙尔 , N·K·查基 , P·S·罗伊 , S·萨卡尔 , A·拉斯托吉

IPC: B22F1/00 , B22F7/04 , B22F9/24

CPC classification number: H01L24/29 , B22F1/0003 , B22F1/0014 , B22F1/0074 , B22F1/025 , B22F7/04 , B22F2007/047 , B22F2301/255 , B22F2302/45 , B23K1/0016 , B23K35/025 , B23K35/3006 , B23K35/3601 , B23K35/3613 , B23K35/3618 , B23K35/365 , B23K2101/40 , B23K2103/56 , H01B1/22 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/50 , H01L51/5246 , H01L2224/0401 , H01L2224/04026 , H01L2224/05155 , H01L2224/05644 , H01L2224/11003 , H01L2224/1132 , H01L2224/11334 , H01L2224/131 , H01L2224/13339 , H01L2224/13347 , H01L2224/13355 , H01L2224/13387 , H01L2224/1339 , H01L2224/13439 , H01L2224/1349 , H01L2224/13499 , H01L2224/16227 , H01L2224/27003 , H01L2224/271 , H01L2224/27332 , H01L2224/27436 , H01L2224/27505 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/2939 , H01L2224/29439 , H01L2224/2949 , H01L2224/29499 , H01L2224/32145 , H01L2224/32146 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/81075 , H01L2224/81192 , H01L2224/81203 , H01L2224/8121 , H01L2224/8184 , H01L2224/81948 , H01L2224/83075 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/8321 , H01L2224/83439 , H01L2224/83447 , H01L2224/8384 , H01L2224/83948 , H01L2224/92247 , H01L2224/94 , H01L2924/00014 , H01L2924/0665 , H01L2924/12041 , H01L2924/12044 , H01L2924/1461 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/206 , H01L2924/2064 , H05K3/321 , H01L2924/00012 , H01L2224/83 , H01L2924/0105 , H01L2924/01046 , H01L2924/01047 , H01L2924/01029 , H01L2924/01028 , H01L2924/0103 , H01L2924/0493 , H01L2924/01004 , H01L2224/27 , H01L2924/01074 , H01L2224/81 , H01L2224/11436 , H01L2224/11 , H01L2224/45099 , H01L2924/00 , B22F1/0062 , B22F1/0007 , B22F9/24

Abstract: 一种烧结粉末，其包含：具有从100nm至50μm的平均最长尺寸的第一类型的金属颗粒。

4.

发明授权
连接装置、连接构造体的制造方法、芯片堆叠部件的制造方法及电子部件的安装方法有权

公开(公告)号：CN104025273B

公开(公告)日：2016-12-21

申请号：CN201280054633.X

申请日：2012-10-31

Applicant: 迪睿合电子材料有限公司

Inventor： 斋藤崇之

IPC: H01L21/60

CPC classification number: H01L24/742 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/50 , H01L2224/16145 , H01L2224/16225 , H01L2224/16238 , H01L2224/27003 , H01L2224/27334 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29371 , H01L2224/29386 , H01L2224/29388 , H01L2224/2939 , H01L2224/29411 , H01L2224/29416 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29457 , H01L2224/2946 , H01L2224/29471 , H01L2224/29486 , H01L2224/2949 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/75252 , H01L2224/75301 , H01L2224/75315 , H01L2224/7598 , H01L2224/81 , H01L2224/81193 , H01L2224/81203 , H01L2224/81903 , H01L2224/83101 , H01L2224/83192 , H01L2224/83203 , H01L2224/8385 , H01L2224/83851 , H01L2224/83862 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2225/06565 , H01L2924/01029 , H01L2924/07802 , H01L2924/07811 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012 , H01L2924/0665 , H01L2924/053 , H01L2924/00 , H01L2224/83 , H01L2924/069 , H01L2924/0635

Abstract: 防止电子部件的破裂。具有：载放部（5），载放与热固化性的粘接剂层（6）层叠的电子部件2、12）；加热按压头（7），对电子部件（2、12）进行加热按压；第1弹性体（8），配置于电子部件（2、12）与加热按压头（7）的按压面（7a）之间，对电子部件（2、12）的上表面进行按压；以及支撑构件9），配置于电子部件（2、12）的周围，并且支撑第1弹性体。

5.

发明授权
粘接剂以及使用该粘接剂的连接结构体失效

公开(公告)号：CN102977798B

公开(公告)日：2015-04-29

申请号：CN201210425130.0

申请日：2008-08-29

Applicant: 日立化成株式会社

Inventor： 宫泽笑 , 加藤木茂树 , 伊泽弘行 , 白坂敏明 , 富泽惠子

IPC: C09J4/00 , C09J4/02 , C09J9/02 , H01L23/488

CPC classification number: H05K3/323 , C09J4/00 , C09J9/02 , H01B1/24 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/16 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/2949 , H01L2224/32227 , H01L2224/8385 , H01L2224/83851 , H01L2224/83855 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H05K2201/0129 , H01L2924/00

Abstract: 本发明提供粘接剂以及使用该粘接剂的连接结构体。本发明提供一种电路部件连接用粘接剂，其含有（a）热塑性树脂、（b）30℃以下为固体的自由基聚合性化合物、（c）自由基聚合引发剂、（d）在分子内具有至少一个以上磷酸基的乙烯系化合物、以及尿烷（甲基）丙烯酸酯低聚物，（b）30℃以下为固体的自由基聚合性化合物包含环氧基丙烯酸酯，（b）30℃以下为固体的自由基聚合性化合物的含量相对于100质量份的（a）热塑性树脂为5~100质量份。

6.

发明公开
各向异性导电粘合剂及连接结构体有权

公开(公告)号：CN104520398A

公开(公告)日：2015-04-15

申请号：CN201380041395.3

申请日：2013-09-17

Applicant: 迪睿合电子材料有限公司

Inventor： 波木秀次 , 蟹泽士行 , 石神明

IPC: C09J9/02 , H01L21/60 , H01L23/36 , H01L33/00 , H05K7/20

CPC classification number: C09J163/00 , C08G59/24 , C08K3/08 , C08K3/10 , C08K9/02 , C08K9/12 , C09J9/02 , C09J11/00 , C09K5/14 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L33/486 , H01L33/62 , H01L33/641 , H01L2224/0401 , H01L2224/06102 , H01L2224/13144 , H01L2224/1403 , H01L2224/16225 , H01L2224/16227 , H01L2224/29144 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29369 , H01L2224/2939 , H01L2224/29418 , H01L2224/29444 , H01L2224/29455 , H01L2224/29487 , H01L2224/2949 , H01L2224/3201 , H01L2224/32225 , H01L2224/32501 , H01L2224/48091 , H01L2224/49107 , H01L2224/73204 , H01L2224/73265 , H01L2224/81444 , H01L2224/81805 , H01L2224/81903 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2924/01322 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/12042 , H01L2924/15788 , H01L2924/3841 , H05K3/323 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/05341 , H01L2924/0665 , H01L2924/00012 , H01L2224/48 , H01L2924/00015 , H01L2924/0105 , H01L2924/01046 , H01L2924/00

Abstract: 一种各向异性导电粘合剂包含：导电性粒子、导热性粒子、及使导电性粒子和导热性粒子分散的粘合剂成分。该导电性粒子含有树脂粒子和在该树脂粒子的表面上形成的导电性金属层。该导热性粒子是平均粒径小于导电性粒子的金属粒子，或是含有金属粒子和在该金属粒子的表面上形成的绝缘层且平均粒径小于导电性粒子的绝缘被覆粒子。

7.

发明公开
电器件、其制造方法和放射线检查装置失效

公开(公告)号：CN104241303A

公开(公告)日：2014-12-24

申请号：CN201410235013.7

申请日：2014-05-30

Applicant: 佳能株式会社

Inventor： 竹田慎市 , 井上正人 , 泽田觉 , 石井孝昌 , 武井大希 , 西部航太

IPC: H01L27/146 , A61B6/00

CPC classification number: H01L23/564 , G01T1/2018 , H01L21/76877 , H01L24/29 , H01L24/32 , H01L24/83 , H01L27/14634 , H01L27/14636 , H01L27/14663 , H01L27/14676 , H01L2224/04026 , H01L2224/2929 , H01L2224/29344 , H01L2224/29355 , H01L2224/29486 , H01L2224/2949 , H01L2224/32225 , H01L2224/83203 , H01L2224/83851

Abstract: 本发明涉及电器件、其制造方法和放射线检查装置。电器件包含：导电性保护环，沿基板的外周形成于基板上；电极，在基板上形成于保护环内侧；以及连接部分，形成于电极之上，用于连接外部装置与电极，其中，连接部分包含用于电连接外部装置与电极的导电性部件、以及形成于导电性部件的下表面上的绝缘部件，以及绝缘部件露出导电性部件的位于电极正上方的部分，并且绝缘部件的端部在平面图中位于保护环内侧，使得导电性部件与保护环不相互接触。