-
公开(公告)号：CN102292280A
公开(公告)日：2011-12-21
申请号：CN201080005182.1
申请日：2010-01-13
Applicant: 飞思卡尔半导体公司
Inventor： 鲁本·B·蒙特兹 , 亚历克斯·P·帕马塔特
CPC classification number: H01L23/10 , B81B2207/097 , B81C1/00269 , B81C2203/0109 , B81C2203/019 , H01L21/50 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L2224/02 , H01L2224/022 , H01L2224/036 , H01L2224/0391 , H01L2224/04026 , H01L2224/05558 , H01L2224/05572 , H01L2224/05638 , H01L2224/2745 , H01L2224/27452 , H01L2224/2746 , H01L2224/276 , H01L2224/29013 , H01L2224/29016 , H01L2224/29083 , H01L2224/29111 , H01L2224/29117 , H01L2224/29124 , H01L2224/29138 , H01L2224/29144 , H01L2224/29155 , H01L2224/29157 , H01L2224/29166 , H01L2224/29169 , H01L2224/29181 , H01L2224/29184 , H01L2224/32145 , H01L2224/32225 , H01L2224/32502 , H01L2224/32506 , H01L2224/83193 , H01L2224/83203 , H01L2224/83411 , H01L2224/83424 , H01L2224/83444 , H01L2224/83455 , H01L2224/83457 , H01L2224/83466 , H01L2224/83469 , H01L2224/83481 , H01L2224/83484 , H01L2224/83805 , H01L2224/94 , H01L2924/10157 , H01L2924/15159 , H01L2924/164 , H01L2924/01032 , H01L2924/01014 , H01L2924/01029 , H01L2924/00014 , H01L2924/00012 , H01L2224/83
Abstract: 在一个实施例中，一种用于将第一衬底(103)接合至第二衬底(303)的方法包括在第一衬底之上形成包括金属的层。在一个实施例中，包括金属的层包围半导体器件，其可为微电子机械系统(MEMS)器件。在第二衬底(303)上，形成包括硅(401)的第一层。在第一层上形成包括锗和硅的第二层(403)。在第二层上形成包括锗的第三层(405)。使得第三层与包括金属的层接触。向第三层和包括金属的层施加热量(一些实施例中还有压力)，以在第一衬底和第二衬底之间形成机械接合材料，其中，机械接合材料是导电性的。在机械接合物包围诸如MEMS的半导体器件的情况下，机械接合物用作保护MEMS的气密性密封是特别有利的。
-
公开(公告)号：CN102543775A
公开(公告)日：2012-07-04
申请号：CN201110276346.0
申请日：2011-09-16
Applicant: 株式会社东芝
CPC classification number: H01L25/50 , H01L21/6836 , H01L21/78 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/93 , H01L25/0657 , H01L2221/68327 , H01L2224/27312 , H01L2224/27848 , H01L2224/27901 , H01L2224/29016 , H01L2224/29017 , H01L2224/29018 , H01L2224/32014 , H01L2224/32057 , H01L2224/32059 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/33183 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/73215 , H01L2224/73265 , H01L2224/83 , H01L2224/85 , H01L2224/92247 , H01L2224/93 , H01L2224/94 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06593 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01057 , H01L2924/181 , H01L2924/00012 , H01L2224/27 , H01L2924/00 , H01L2224/05599
Abstract: 根据实施方式的半导体装置的制造方法，在半导体晶片的芯片区域的第1面形成粘接层。沿着切割区域将半导体芯片单片化，并经由粘接层阶梯状地层叠半导体芯片。在粘接层的形成中，在第1面中的不以层叠的状态与其它半导体芯片接触的第1区域的至少一部分设置粘接层形成为比与其它半导体芯片接触的第2区域厚的凸部。
-
公开(公告)号：CN106560917A
公开(公告)日：2017-04-12
申请号：CN201610725268.0
申请日：2016-08-25
Applicant: 联发科技股份有限公司
IPC: H01L23/31 , H01L23/52 , H01L23/528
CPC classification number: H01L23/544 , H01L21/561 , H01L21/568 , H01L23/562 , H01L24/19 , H01L24/20 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2224/29016 , H01L2224/2919 , H01L2224/32225 , H01L2224/73267 , H01L2224/9222 , H01L2225/1035 , H01L2225/1041 , H01L2924/1431 , H01L2924/1432 , H01L2924/1436 , H01L2924/3511 , H01L2924/3512 , H01L2924/35121 , H01L2924/37001 , H01L23/31 , H01L23/3107 , H01L23/52 , H01L23/528
Abstract: 本发明提供了一种半导体封装结构。其包括：模塑料，具有切割道区域；半导体晶粒，设置在该模塑料中并且该切割道区域围绕该半导体晶粒，其中，半导体晶粒具有第一表面和相对于该第一表面的第二表面；以及重分布层结构，设置在该半导体晶粒的该第一表面上并且覆盖该模塑料，其中该重分布层结构具有对齐该切割道区域的第一开口。本发明实施例的半导体封装结构，具有较好的可靠性。
-
公开(公告)号：CN104094387A
公开(公告)日：2014-10-08
申请号：CN201380008409.1
申请日：2013-01-25
Applicant: 罗伯特·博世有限公司
IPC: H01L21/60
CPC classification number: H01L24/32 , B23K1/0008 , B23K1/19 , B23K35/025 , B23K35/3006 , B23K2103/08 , B23K2103/56 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/83 , H01L2224/26125 , H01L2224/26155 , H01L2224/27013 , H01L2224/2732 , H01L2224/29016 , H01L2224/29105 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29147 , H01L2224/30515 , H01L2224/32013 , H01L2224/32014 , H01L2224/32225 , H01L2224/32245 , H01L2224/32507 , H01L2224/83101 , H01L2224/83192 , H01L2224/83194 , H01L2224/83801 , H01L2224/83825 , H01L2224/8384 , H01L2224/8392 , H01L2224/83948 , H01L2224/83951 , H01L2924/01013 , H01L2924/0103 , H01L2924/01031 , H01L2924/0105 , H01L2924/01083 , H01L2924/01327 , H01L2924/10253 , H01L2924/1203 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/15747 , H01L2924/3512 , H01L2924/00
Abstract: 本发明涉及一种连接装置(100、200、300、400)，包括至少一个电气元件和/或电子元件(1)。所述至少一个电气元件和/或电子元件(10)具有至少一个连接面(11)，所述连接面借助于连接层(20)以材料连接的方式与接合配对件(40)连接。所述连接层(20)例如可以是在形成材料连接的条件下将接合配对件连接的粘接、钎焊、熔焊、烧结连接部或者其它已知的连接部。此外，以材料连接的方式与所述连接层(20)邻接地设有加强层(30’)。所述加强层(30’)具有比所述连接层(20)更高的弹性模量。因此，如果所述加强层(30’)通过外边界和内边界(36、35)被设计成框架状并且至少以它的外边界(36)包围所述至少一个电气元件和/或电子元件(10)的连接面(11)，则得到特别大的保护作用。
-
Patent Agency Ranking
公开(公告)号：CN102543775B
公开(公告)日：2015-02-04
申请号：CN201110276346.0
申请日：2011-09-16
Applicant: 株式会社东芝
CPC classification number: H01L25/50 , H01L21/6836 , H01L21/78 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/93 , H01L25/0657 , H01L2221/68327 , H01L2224/27312 , H01L2224/27848 , H01L2224/27901 , H01L2224/29016 , H01L2224/29017 , H01L2224/29018 , H01L2224/32014 , H01L2224/32057 , H01L2224/32059 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/33183 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/73215 , H01L2224/73265 , H01L2224/83 , H01L2224/85 , H01L2224/92247 , H01L2224/93 , H01L2224/94 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06593 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01057 , H01L2924/181 , H01L2924/00012 , H01L2224/27 , H01L2924/00 , H01L2224/05599
Abstract: 根据实施方式的半导体装置的制造方法，在半导体晶片的芯片区域的第1面形成粘接层。沿着切割区域将半导体芯片单片化，并经由粘接层阶梯状地层叠半导体芯片。在粘接层的形成中，在第1面中的不以层叠的状态与其它半导体芯片接触的第1区域的至少一部分设置粘接层形成为比与其它半导体芯片接触的第2区域厚的凸部。
-
公开(公告)号：CN103681542A
公开(公告)日：2014-03-26
申请号：CN201310396680.9
申请日：2013-09-04
Applicant: 英飞凌科技股份有限公司
IPC: H01L23/367 , H01L23/31 , H01L21/50 , H01L21/56
CPC classification number: H01L23/13 , H01L23/142 , H01L23/36 , H01L23/492 , H01L23/49513 , H01L23/49562 , H01L24/05 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/80 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/04105 , H01L2224/05556 , H01L2224/0556 , H01L2224/05568 , H01L2224/05611 , H01L2224/05618 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0566 , H01L2224/05664 , H01L2224/05666 , H01L2224/12105 , H01L2224/131 , H01L2224/2101 , H01L2224/2105 , H01L2224/211 , H01L2224/2745 , H01L2224/27462 , H01L2224/29006 , H01L2224/29016 , H01L2224/29023 , H01L2224/29026 , H01L2224/29109 , H01L2224/29111 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/2916 , H01L2224/29164 , H01L2224/29166 , H01L2224/3201 , H01L2224/32057 , H01L2224/32106 , H01L2224/32225 , H01L2224/32237 , H01L2224/32245 , H01L2224/32257 , H01L2224/45111 , H01L2224/45118 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/48091 , H01L2224/48611 , H01L2224/48618 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/4866 , H01L2224/48664 , H01L2224/48666 , H01L2224/48711 , H01L2224/48718 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/4876 , H01L2224/48764 , H01L2224/48766 , H01L2224/48811 , H01L2224/48818 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/4886 , H01L2224/48864 , H01L2224/48866 , H01L2224/73265 , H01L2224/73267 , H01L2224/80903 , H01L2224/821 , H01L2224/82101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/83438 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/8382 , H01L2224/83902 , H01L2224/9202 , H01L2224/92247 , H01L2924/00014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/01015 , H01L2924/01079 , H01L2924/01047 , H01L2924/01029 , H01L2924/01028 , H01L2924/01082 , H01L2924/01051 , H01L2924/00012 , H01L2924/014 , H01L2224/05552
Abstract: 芯片封装和用于制作芯片封装的方法。提供一种芯片封装，所述芯片封装包括：包括至少一个腔体的载体；至少部分地设置在至少一个腔体内的芯片；设置在芯片的至少一个侧壁上的至少一个中间层；其中至少一个中间层被配置为将来自芯片的热量热传导到载体。
-
公开(公告)号：CN104094387B
公开(公告)日：2017-08-08
申请号：CN201380008409.1
申请日：2013-01-25
Applicant: 罗伯特·博世有限公司
IPC: H01L21/60
CPC classification number: H01L24/32 , B23K1/0008 , B23K1/19 , B23K35/025 , B23K35/3006 , B23K2103/08 , B23K2103/56 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/83 , H01L2224/26125 , H01L2224/26155 , H01L2224/27013 , H01L2224/2732 , H01L2224/29016 , H01L2224/29105 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29147 , H01L2224/30515 , H01L2224/32013 , H01L2224/32014 , H01L2224/32225 , H01L2224/32245 , H01L2224/32507 , H01L2224/83101 , H01L2224/83192 , H01L2224/83194 , H01L2224/83801 , H01L2224/83825 , H01L2224/8384 , H01L2224/8392 , H01L2224/83948 , H01L2224/83951 , H01L2924/01013 , H01L2924/0103 , H01L2924/01031 , H01L2924/0105 , H01L2924/01083 , H01L2924/01327 , H01L2924/10253 , H01L2924/1203 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/15747 , H01L2924/3512 , H01L2924/00
Abstract: 本发明涉及一种连接装置(100、200、300、400)，包括至少一个电气元件和/或电子元件(1)。所述至少一个电气元件和/或电子元件(10)具有至少一个连接面(11)，所述连接面借助于连接层(20)以材料连接的方式与接合配对件(40)连接。所述连接层(20)例如可以是在形成材料连接的条件下将接合配对件连接的粘接、钎焊、熔焊、烧结连接部或者其它已知的连接部。此外，以材料连接的方式与所述连接层(20)邻接地设有加强层(30’)。所述加强层(30’)具有比所述连接层(20)更高的弹性模量。因此，如果所述加强层(30’)通过外边界和内边界(36、35)被设计成框架状并且至少以它的外边界(36)包围所述至少一个电气元件和/或电子元件(10)的连接面(11)，则得到特别大的保护作用。
-
公开(公告)号：CN103681542B
公开(公告)日：2016-11-23
申请号：CN201310396680.9
申请日：2013-09-04
Applicant: 英飞凌科技股份有限公司
IPC: H01L23/367 , H01L23/31 , H01L21/50 , H01L21/56
CPC classification number: H01L23/13 , H01L23/142 , H01L23/36 , H01L23/492 , H01L23/49513 , H01L23/49562 , H01L24/05 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/80 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/04105 , H01L2224/05556 , H01L2224/0556 , H01L2224/05568 , H01L2224/05611 , H01L2224/05618 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0566 , H01L2224/05664 , H01L2224/05666 , H01L2224/12105 , H01L2224/131 , H01L2224/2101 , H01L2224/2105 , H01L2224/211 , H01L2224/2745 , H01L2224/27462 , H01L2224/29006 , H01L2224/29016 , H01L2224/29023 , H01L2224/29026 , H01L2224/29109 , H01L2224/29111 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/2916 , H01L2224/29164 , H01L2224/29166 , H01L2224/3201 , H01L2224/32057 , H01L2224/32106 , H01L2224/32225 , H01L2224/32237 , H01L2224/32245 , H01L2224/32257 , H01L2224/45111 , H01L2224/45118 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/4516 , H01L2224/45164 , H01L2224/45166 , H01L2224/48091 , H01L2224/48611 , H01L2224/48618 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/4866 , H01L2224/48664 , H01L2224/48666 , H01L2224/48711 , H01L2224/48718 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/4876 , H01L2224/48764 , H01L2224/48766 , H01L2224/48811 , H01L2224/48818 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/4886 , H01L2224/48864 , H01L2224/48866 , H01L2224/73265 , H01L2224/73267 , H01L2224/80903 , H01L2224/821 , H01L2224/82101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83385 , H01L2224/83438 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/8382 , H01L2224/83902 , H01L2224/9202 , H01L2224/92247 , H01L2924/00014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/00 , H01L2924/01015 , H01L2924/01079 , H01L2924/01047 , H01L2924/01029 , H01L2924/01028 , H01L2924/01082 , H01L2924/01051 , H01L2924/00012 , H01L2924/014 , H01L2224/05552
Abstract: 芯片封装和用于制作芯片封装的方法。提供一种芯片封装，所述芯片封装包括：包括至少一个腔体的载体；至少部分地设置在至少一个腔体内的芯片；设置在芯片的至少一个侧壁上的至少一个中间层；其中至少一个中间层被配置为将来自芯片的热量热传导到载体。
-
公开(公告)号：CN102292280B
公开(公告)日：2015-09-23
申请号：CN201080005182.1
申请日：2010-01-13
Applicant: 飞思卡尔半导体公司
Inventor： 鲁本·B·蒙特兹 , 亚历克斯·P·帕马塔特
CPC classification number: H01L23/10 , B81B2207/097 , B81C1/00269 , B81C2203/0109 , B81C2203/019 , H01L21/50 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L2224/02 , H01L2224/022 , H01L2224/036 , H01L2224/0391 , H01L2224/04026 , H01L2224/05558 , H01L2224/05572 , H01L2224/05638 , H01L2224/2745 , H01L2224/27452 , H01L2224/2746 , H01L2224/276 , H01L2224/29013 , H01L2224/29016 , H01L2224/29083 , H01L2224/29111 , H01L2224/29117 , H01L2224/29124 , H01L2224/29138 , H01L2224/29144 , H01L2224/29155 , H01L2224/29157 , H01L2224/29166 , H01L2224/29169 , H01L2224/29181 , H01L2224/29184 , H01L2224/32145 , H01L2224/32225 , H01L2224/32502 , H01L2224/32506 , H01L2224/83193 , H01L2224/83203 , H01L2224/83411 , H01L2224/83424 , H01L2224/83444 , H01L2224/83455 , H01L2224/83457 , H01L2224/83466 , H01L2224/83469 , H01L2224/83481 , H01L2224/83484 , H01L2224/83805 , H01L2224/94 , H01L2924/10157 , H01L2924/15159 , H01L2924/164 , H01L2924/01032 , H01L2924/01014 , H01L2924/01029 , H01L2924/00014 , H01L2924/00012 , H01L2224/83
Abstract: 在一个实施例中，一种用于将第一衬底(103)接合至第二衬底(303)的方法包括在第一衬底之上形成包括金属的层。在一个实施例中，包括金属的层包围半导体器件，其可为微电子机械系统(MEMS)器件。在第二衬底(303)上，形成包括硅(401)的第一层。在第一层上形成包括锗和硅的第二层(403)。在第二层上形成包括锗的第三层(405)。使得第三层与包括金属的层接触。向第三层和包括金属的层施加热量(一些实施例中还有压力)，以在第一衬底和第二衬底之间形成机械接合材料，其中，机械接合材料是导电性的。在机械接合物包围诸如MEMS的半导体器件的情况下，机械接合物用作保护MEMS的气密性密封是特别有利的。
-
-
-
-
-
-
-
-
Search Results
9
records
(took 0.01 seconds)
