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公开(公告)号：CN104659019A
公开(公告)日：2015-05-27
申请号：CN201410032176.5
申请日：2014-01-23
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L23/538 , H01L21/768
CPC classification number: H01L24/05 , H01L21/56 , H01L21/76801 , H01L21/76805 , H01L21/76895 , H01L23/3114 , H01L23/3171 , H01L23/3192 , H01L23/5226 , H01L23/525 , H01L23/528 , H01L23/53223 , H01L23/53238 , H01L23/53252 , H01L24/03 , H01L24/13 , H01L24/19 , H01L24/24 , H01L24/82 , H01L24/96 , H01L2224/0345 , H01L2224/0346 , H01L2224/0401 , H01L2224/04105 , H01L2224/05124 , H01L2224/05548 , H01L2224/05567 , H01L2224/05647 , H01L2224/05666 , H01L2224/08113 , H01L2224/08235 , H01L2224/11334 , H01L2224/1134 , H01L2224/12105 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/16235 , H01L2224/2405 , H01L2224/24137 , H01L2224/821 , H01L2224/96 , H01L2924/0002 , H01L2924/00 , H01L2924/00014 , H01L2224/82 , H01L2224/03 , H01L2224/11 , H01L2924/014
Abstract: 本发明的一个实施例是一种结构，包括管芯以及至少横向地密封管芯的密封剂，在该管芯的表面上具有焊盘。穿过密封剂露出焊盘。该结构进一步包括位于密封剂和管芯上方的第一介电层、位于第一介电层上方的第一导电图案、以及位于第一导电图案和第一介电层上方的第二介电层。第一介电层和第二介电层对于管芯的焊盘有第一开口。该结构进一步包括位于第二介电层上方和第一开口内的第二导电图案。第二导电图案邻接第一开口内的第一介电层的侧壁和第一开口内的第二介电层的侧壁。本发明还包括扇出式封装结构及其形成方法。
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公开(公告)号：CN102593046A
公开(公告)日：2012-07-18
申请号：CN201110463335.3
申请日：2011-12-22
Applicant: 通用电气公司
IPC: H01L21/768 , H01L23/522
CPC classification number: H01L24/82 , H01L21/486 , H01L24/06 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/92 , H01L25/0655 , H01L25/072 , H01L2224/04105 , H01L2224/0603 , H01L2224/06181 , H01L2224/2405 , H01L2224/2413 , H01L2224/24225 , H01L2224/27416 , H01L2224/27436 , H01L2224/2919 , H01L2224/32225 , H01L2224/73217 , H01L2224/73267 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2224/83862 , H01L2224/83865 , H01L2224/83874 , H01L2224/92144 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/13026 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/18162 , H01L2924/00
Abstract: 提供制造半导体器件封装件的方法。该方法包括：提供叠层，其包括设置在第一金属层上的介电膜，所述叠层具有介电膜外表面和第一金属层外表面；根据预定图案形成多个延伸通过该叠层的通孔；将一个或多个半导体器件附连到该介电膜外表面使得半导体器件在附连后接触一个或多个通孔；在该第一金属层外表面和多个通孔的内表面上设置导电层来形成互连层，其包括该第一金属层和所述导电层；以及根据预定电路配置图案化该互连层来形成图案化的互连层，其中该图案化的互连层的一部分延伸通过一个或多个通孔来形成与半导体器件的电接触。还提供半导体器件封装件。
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公开(公告)号：CN102446884A
公开(公告)日：2012-05-09
申请号：CN201110262924.5
申请日：2011-09-07
Applicant: 财团法人工业技术研究院
IPC: H01L23/498 , H01L23/485 , H01L21/60
CPC classification number: H01L23/5389 , H01L24/13 , H01L24/24 , H01L24/32 , H01L24/82 , H01L24/92 , H01L25/105 , H01L2224/11849 , H01L2224/12105 , H01L2224/24011 , H01L2224/2405 , H01L2224/24226 , H01L2224/244 , H01L2224/245 , H01L2224/32225 , H01L2224/73267 , H01L2224/821 , H01L2224/82101 , H01L2224/82104 , H01L2224/82106 , H01L2224/82399 , H01L2224/8281 , H01L2224/82815 , H01L2224/8284 , H01L2224/8385 , H01L2224/92144 , H01L2225/1035 , H01L2225/1058 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/014 , H01L2924/0105 , H01L2924/06 , H01L2924/00
Abstract: 本发明公开一种封装单元及其堆叠结构与制造方法，其包括提供一基板；形成一第一图案化线路层及一第一导电柱，第一图案化线路层设置于基板的一表面，第一导电柱贯穿基板并连接第一图案线路层；设置一半导体元件于基板上，半导体元件包括至少一芯片；形成一绝缘层于半导体元件及基板上；形成一第二导电柱、一第三导电柱及一第二图案化线路，第二导电柱贯穿绝缘层并电连接第一导电柱，第三导电柱贯穿绝缘层并连接半导体元件，第二图案化线路层设置于绝缘层上并连接第二导电柱及第三导电柱。
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公开(公告)号：CN103340022A
公开(公告)日：2013-10-02
申请号：CN201180066789.5
申请日：2011-12-02
Applicant: 应用科学研究TNO荷兰组织
Inventor： J·范登布兰德 , R·H·L·科斯特司 , A·H·迪策尔
CPC classification number: H05K3/32 , H01L23/4985 , H01L24/24 , H01L24/76 , H01L24/82 , H01L2224/2405 , H01L2224/24051 , H01L2224/24226 , H01L2224/25171 , H01L2224/25175 , H01L2224/76155 , H01L2224/76261 , H01L2224/766 , H01L2224/767 , H01L2224/82102 , H01L2224/82104 , H01L2224/82106 , H01L2224/82874 , H01L2224/9202 , H01L2224/92144 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H05K1/0283 , H05K1/189 , H05K3/12 , H05K3/305 , H05K2201/10674 , H05K2203/107 , H05K2203/1469 , H05K2203/1545 , H05K2203/175 , Y10T29/49133 , Y10T29/53178 , H01L2924/00
Abstract: 本发明提供一种用于装配组件（30）与挠性基板（10）的方法，该组件具有电触点（31）。该方法包括以下步骤：将组件（30）放置在基板的第一主侧（11）上；应用机器视觉步骤来估计电触点的位置；沉积导电材料或其前体的一个或多个层（32），所述层在由组件限定的基板区域上延伸至横向超出所述区域；根据电触点的估计位置计算分割线；通过沿着所述分割线从所述层中局部地移除材料来将层分割成相互绝缘的区域（32d）。还提供一种适于执行该方法的装置。另外，提供一种可通过根据本发明的方法和装置获得的组合件。
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公开(公告)号：CN102386113A
公开(公告)日：2012-03-21
申请号：CN201110271021.3
申请日：2011-09-02
Applicant: 新科金朋有限公司
IPC: H01L21/60 , H01L21/56 , H01L23/498 , H01L23/31 , H01L25/00
CPC classification number: H01L25/50 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/295 , H01L23/3107 , H01L23/3121 , H01L23/3128 , H01L23/3157 , H01L23/49827 , H01L23/49833 , H01L23/5384 , H01L23/5389 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/25 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/97 , H01L25/03 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L2221/68345 , H01L2221/68381 , H01L2221/68386 , H01L2223/54426 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/03464 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06131 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/11849 , H01L2224/11901 , H01L2224/12105 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16225 , H01L2224/21 , H01L2224/2105 , H01L2224/215 , H01L2224/22 , H01L2224/221 , H01L2224/24011 , H01L2224/2405 , H01L2224/24101 , H01L2224/24226 , H01L2224/24227 , H01L2224/245 , H01L2224/25171 , H01L2224/27002 , H01L2224/29 , H01L2224/2902 , H01L2224/29101 , H01L2224/29144 , H01L2224/2919 , H01L2224/29298 , H01L2224/32155 , H01L2224/32225 , H01L2224/48091 , H01L2224/48105 , H01L2224/48175 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/73267 , H01L2224/82101 , H01L2224/82104 , H01L2224/82106 , H01L2224/83005 , H01L2224/83191 , H01L2224/8385 , H01L2224/94 , H01L2224/95001 , H01L2224/97 , H01L2225/06548 , H01L2225/1035 , H01L2225/1041 , H01L2225/1052 , H01L2225/107 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H05K1/186 , H05K3/007 , H05K2201/10674 , H01L2224/81 , H01L2924/01014 , H01L2224/82 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/03 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 一种半导体器件具有安装于载体上的第一半导体小片。插入框架具有在插入框架中的开口和形成于插入框架上的多个导电柱。将插入器安装于载体和第一小片上，其中导电柱安置于该小片周围。可在插入框架中形成腔，以包含所述第一小片的一部分。通过在插入框架中的开口在载体和第一小片上沉积密封剂。可替换地，密封剂沉积于载体和第一小片上并将插入框架压靠在密封剂上。过量的密封剂通过在插入框架中的开口引出。移除载体。在密封剂和第一小片上形成互连结构。可在第一小片上或在插入框架上安装第二半导体小片。
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Patent Agency Ranking
公开(公告)号：CN102376595A
公开(公告)日：2012-03-14
申请号：CN201110234097.9
申请日：2011-08-16
Applicant: 新科金朋有限公司
IPC: H01L21/56 , H01L21/60 , H01L21/768 , H01L23/31 , H01L23/498 , H01L23/538
CPC classification number: H01L23/5384 , H01L21/486 , H01L21/50 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/768 , H01L23/3107 , H01L23/3128 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/25 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/82 , H01L24/97 , H01L25/105 , H01L2221/68345 , H01L2221/68359 , H01L2221/68363 , H01L2221/68381 , H01L2221/68386 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/03464 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06131 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/11849 , H01L2224/11901 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16225 , H01L2224/21 , H01L2224/2105 , H01L2224/215 , H01L2224/22 , H01L2224/221 , H01L2224/24011 , H01L2224/2405 , H01L2224/24105 , H01L2224/24226 , H01L2224/245 , H01L2224/25171 , H01L2224/29144 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48105 , H01L2224/48175 , H01L2224/48227 , H01L2224/48228 , H01L2224/48599 , H01L2224/48611 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/73265 , H01L2224/73267 , H01L2224/82005 , H01L2224/92244 , H01L2224/95001 , H01L2224/97 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H05K1/186 , H05K3/007 , H05K3/4602 , H05K3/4608 , H05K2201/0195 , H05K2201/10674 , H01L2924/00014 , H01L2924/01014 , H01L2924/0665 , H01L2924/0105 , H01L2224/82 , H01L2924/00012 , H01L2924/00 , H01L2224/83
Abstract: 本发明涉及形成具有导电层和导电通孔的FO-WLCSP的方法和半导体器件。Fo-WLCSP具有在半导体管芯周围形成的第一聚合物层。通过第一聚合物层的第一导电通孔在半导体管芯的周界周围形成。第一互连结构在第一聚合物层的第一表面上面形成且电连接到第一导电通孔。第一互连结构具有第二聚合物层和通过第二聚合物层形成的多个第二通孔。第二互连结构在第一聚合物层的第二表面上面形成且电连接到第一导电通孔。第二互连结构具有第三聚合物层和通过第三聚合物层形成的多个第三通孔。半导体封装可以以PoP布置安装到WLCSP。半导体封装通过第一互连结构或第二互连结构而电连接到WLCSP。
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公开(公告)号：CN102282661A
公开(公告)日：2011-12-14
申请号：CN201080004594.3
申请日：2010-01-26
Applicant: 松下电工株式会社
IPC: H01L21/60 , H01L23/52 , H01L25/065 , H01L25/07 , H01L25/18
CPC classification number: H05K1/11 , G11B5/486 , H01L21/565 , H01L22/12 , H01L23/3121 , H01L24/03 , H01L24/05 , H01L24/24 , H01L24/25 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/82 , H01L24/83 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2224/04042 , H01L2224/05554 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/24011 , H01L2224/2405 , H01L2224/24051 , H01L2224/24137 , H01L2224/24146 , H01L2224/24226 , H01L2224/245 , H01L2224/25175 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73267 , H01L2224/82009 , H01L2224/82039 , H01L2224/82101 , H01L2224/82931 , H01L2224/82947 , H01L2224/8385 , H01L2224/85 , H01L2224/92244 , H01L2225/06524 , H01L2225/06551 , H01L2225/06565 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H05K1/111 , H05K1/117 , H05K1/181 , H05K3/184 , H05K2201/0376 , H05K2201/09472 , Y02P70/611 , Y10T428/1171 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
Abstract: 本发明是一种半导体芯片的安装方法，包括：在连接半导体芯片(2)表面的接合垫(2a)与形成在绝缘基材(1)的表面的电极垫(1a)的路径的表面形成树脂覆膜(3)的工序；沿着用于连接接合垫(2a)与电极垫(1a)的路径，通过激光加工而形成深度等于或大于树脂覆膜(3)的厚度的布线槽(4)的工序；使电镀催化剂(5)沉积于布线槽(4)的表面的工序；去除树脂覆膜(3)的工序；以及仅在残留电镀催化剂(5)的部位形成非电解镀膜(6)的工序。本发明又是一种立体结构物，其在表面设有布线，其特征在于：在立体结构物的表面，形成跨及立体结构物的彼此交叉的相邻面间而延伸的布线用凹槽，将布线用导体的至少一部分埋入所述布线用凹槽中。
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公开(公告)号：CN102386113B
公开(公告)日：2016-06-22
申请号：CN201110271021.3
申请日：2011-09-02
Applicant: 新科金朋有限公司
IPC: H01L21/60 , H01L21/56 , H01L23/498 , H01L23/31 , H01L25/00
CPC classification number: H01L25/50 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/295 , H01L23/3107 , H01L23/3121 , H01L23/3128 , H01L23/3157 , H01L23/49827 , H01L23/49833 , H01L23/5384 , H01L23/5389 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/25 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/97 , H01L25/03 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L2221/68345 , H01L2221/68381 , H01L2221/68386 , H01L2223/54426 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/03464 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06131 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/11849 , H01L2224/11901 , H01L2224/12105 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16225 , H01L2224/21 , H01L2224/2105 , H01L2224/215 , H01L2224/22 , H01L2224/221 , H01L2224/24011 , H01L2224/2405 , H01L2224/24101 , H01L2224/24226 , H01L2224/24227 , H01L2224/245 , H01L2224/25171 , H01L2224/27002 , H01L2224/29 , H01L2224/2902 , H01L2224/29101 , H01L2224/29144 , H01L2224/2919 , H01L2224/29298 , H01L2224/32155 , H01L2224/32225 , H01L2224/48091 , H01L2224/48105 , H01L2224/48175 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/73267 , H01L2224/82101 , H01L2224/82104 , H01L2224/82106 , H01L2224/83005 , H01L2224/83191 , H01L2224/8385 , H01L2224/94 , H01L2224/95001 , H01L2224/97 , H01L2225/06548 , H01L2225/1035 , H01L2225/1041 , H01L2225/1052 , H01L2225/107 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H05K1/186 , H05K3/007 , H05K2201/10674 , H01L2224/81 , H01L2924/01014 , H01L2224/82 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/03 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 一种半导体器件具有安装于载体上的第一半导体小片。插入框架具有在插入框架中的开口和形成于插入框架上的多个导电柱。将插入器安装于载体和第一小片上，其中导电柱安置于该小片周围。可在插入框架中形成腔，以包含所述第一小片的一部分。通过在插入框架中的开口在载体和第一小片上沉积密封剂。可替换地，密封剂沉积于载体和第一小片上并将插入框架压靠在密封剂上。过量的密封剂通过在插入框架中的开口引出。移除载体。在密封剂和第一小片上形成互连结构。可在第一小片上或在插入框架上安装第二半导体小片。
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公开(公告)号：CN105321903A
公开(公告)日：2016-02-10
申请号：CN201410844501.8
申请日：2014-12-30
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L23/48 , H01L25/065 , H01L21/768
CPC classification number: H01L25/0657 , H01L21/76802 , H01L21/76805 , H01L21/7681 , H01L21/76877 , H01L21/76898 , H01L23/481 , H01L23/5226 , H01L24/02 , H01L24/04 , H01L24/24 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/80 , H01L24/82 , H01L24/83 , H01L24/91 , H01L25/50 , H01L2224/02372 , H01L2224/02377 , H01L2224/02381 , H01L2224/04042 , H01L2224/05548 , H01L2224/05572 , H01L2224/2405 , H01L2224/24146 , H01L2224/24147 , H01L2224/32146 , H01L2224/451 , H01L2224/48463 , H01L2224/73227 , H01L2224/80896 , H01L2224/82031 , H01L2224/92 , H01L2224/9202 , H01L2224/9212 , H01L2225/0651 , H01L2225/06524 , H01L2225/06544 , H01L2225/06565 , H01L2924/00014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/80001 , H01L2224/82 , H01L2224/8203 , H01L2224/821
Abstract: 本发明提供了一种集成电路结构，其包括第一和第二半导体芯片。第一半导体芯片包括第一衬底和位于第一衬底下面的多个第一介电层。第二半导体芯片包括第二衬底和位于第二衬底上方的多个第二介电层，其中多个第一介电层和多个第二介电层彼此接合。金属焊盘位于多个第二介电层中。重分布线位于第一衬底的上方。导电插塞电连接至重分布线。导电插塞包括从第一衬底的顶面延伸至第一衬底的底面的第一部分和从第一衬底的底面延伸至金属焊盘的第二部分。第二部分的底面接触金属焊盘的顶面。本发明涉及具有重分布线的堆叠集成电路。
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公开(公告)号：CN104124319A
公开(公告)日：2014-10-29
申请号：CN201410171732.7
申请日：2014-04-25
Applicant: 日亚化学工业株式会社
CPC classification number: H01L33/62 , H01L21/6835 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/85 , H01L24/96 , H01L33/24 , H01L33/38 , H01L33/387 , H01L33/40 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L2021/60 , H01L2221/6835 , H01L2221/68368 , H01L2221/68372 , H01L2221/68381 , H01L2221/68386 , H01L2224/04105 , H01L2224/05644 , H01L2224/05647 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/2101 , H01L2224/2105 , H01L2224/211 , H01L2224/215 , H01L2224/2401 , H01L2224/24011 , H01L2224/2405 , H01L2224/2413 , H01L2224/245 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48095 , H01L2224/48101 , H01L2224/4813 , H01L2224/48644 , H01L2224/48647 , H01L2224/48844 , H01L2224/48847 , H01L2224/821 , H01L2224/82106 , H01L2224/85947 , H01L2224/96 , H01L2924/0002 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/3511 , H01L2933/0016 , H01L2933/005 , H01L2933/0066 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2924/01079 , H01L2924/01047 , H01L2924/01029 , H01L2924/0105 , H01L2924/00014 , H01L2224/82
Abstract: 本发明的课题在于，提供一种小型且具有充分的强度并且具备高量产性的发光装置。为此，本发明的发光装置具有：半导体芯片，其包含p型半导体层和n型半导体层，在该p型半导体层与该n型半导体层之间发光；p侧衬垫电极，其位于所述半导体芯片的上表面侧且配置在所述p型半导体层上；n侧衬垫电极，其位于所述半导体芯片的上表面侧且配置在所述n型半导体层上；树脂层，其配置为覆盖所述半导体芯片的上表面；和p侧连接电极以及n侧连接电极，其配置在所述树脂层的外表面，且位于所述半导体芯片的上表面侧，所述p侧衬垫电极与所述p侧连接电极之间以及所述n侧衬垫电极与所述n侧连接电极之间的至少一方通过配置在所述树脂内的金属丝而连接。
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