Patent search ap:("费查尔德半导体有限公司") AND inv:"C-L·吴" Page 1

1.

发明授权
用于将半导体衬底键合到金属衬底的方法有权

公开(公告)号：CN101432846B

公开(公告)日：2011-11-16

申请号：CN200780011770.4

申请日：2007-03-12

Applicant: 费查尔德半导体有限公司

Inventor： 王琦 , H·耶尔马兹 , 励敏华 , C-L·吴

IPC: H01L21/00

CPC classification number: H01L21/76251 , H01L21/6835 , H01L24/28 , H01L29/78603 , H01L2224/16 , H01L2224/29111 , H01L2224/2919 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/10253 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/157 , H01L2924/19041 , H01L2924/19043 , H01L2924/3011 , H01L2924/351 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2924/0665

Abstract: 公开了一种将半导体衬底键合到金属衬底的方法。在一些实施例中该方法包括在半导体衬底中形成半导体器件，该半导体器件包括第一表面。该方法还包括获得金属衬底。将该金属衬底键合到该半导体器件的第一表面，其中该金属衬底的至少一部分形成该半导体器件的电气端子。

2.

发明公开
用于功率器件的晶片级别芯片级封装的半导体管芯结构、使用其的封装及系统、以及其制造方法无效

公开(公告)号：CN102217063A

公开(公告)日：2011-10-12

申请号：CN200980146718.9

申请日：2009-10-23

Applicant: 费查尔德半导体有限公司

Inventor： M·D·格林哈根 , 金洙丘 , J·J·墨菲 , I·何 , E·缇贾 , C-L·吴 , M·拉森 , R·迪克西特

IPC: H01L23/48

CPC classification number: H01L29/7802 , H01L23/3114 , H01L23/36 , H01L23/482 , H01L24/16 , H01L24/19 , H01L24/31 , H01L29/0657 , H01L2224/04105 , H01L2224/20 , H01L2224/73253 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/1461 , H01L2924/351 , H01L2924/00

Abstract: 公开了允许具有垂直功率器件的管芯被封装到晶片级别芯片级封装中的半导体管芯结构，其中电流传导端子呈现在管芯的一个表面处且器件具有极低导通状态电阻。在示例性实施例中，沟槽和孔径形成在管芯背侧中，其中孔径接触管芯顶表面处的导电区。导电层和/或导电体可置于沟槽和孔径上，以便将器件的背侧电流传导电极电耦合到导电区。还公开了使用具有根据本发明的管芯结构的管芯的封装和系统，以及制造具有根据本发明的管芯结构的管芯的方法。

3.

发明授权
半导体管芯封装及其制作方法失效复审申请

公开(公告)号：CN101807533B

公开(公告)日：2016-03-09

申请号：CN201010147483.X

申请日：2006-06-19

Applicant: 费查尔德半导体有限公司

Inventor： O·全 , Y·崔 , B·H·古伊 , M·C·B·伊斯塔西欧 , D·钟 , T·T·肯恩 , S·南 , R·约什 , C-L·吴 , V·伊尔 , L·Y·里姆 , B-O·李

IPC: H01L21/50 , H01L21/56 , H01L25/00 , H01L23/495 , H01L23/28

CPC classification number: H01L24/29 , H01L21/561 , H01L23/3121 , H01L23/4951 , H01L23/49558 , H01L23/49562 , H01L23/49575 , H01L23/49861 , H01L24/32 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L25/0655 , H01L2223/54406 , H01L2223/54486 , H01L2224/16 , H01L2224/291 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32057 , H01L2224/32225 , H01L2224/40245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/45565 , H01L2224/456 , H01L2224/45644 , H01L2224/45669 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/4943 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2224/83385 , H01L2224/83801 , H01L2224/8385 , H01L2224/85013 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/19043 , H01L2924/30107 , H01L2224/85 , H01L2924/00 , H01L2924/0105 , H01L2924/01082 , H01L2924/00012 , H01L2224/13111 , H01L2924/0665 , H01L2224/29099 , H01L2224/29199 , H01L2224/37099

Abstract: 公开了半导体管芯封装。一种示例性半导体管芯封装包括预模制衬底。该预模制衬底可具有附连到其的半导体，并且可在该半导体管芯上设置包封材料。

4.

发明授权
半导体管芯封装及其制作方法失效

公开(公告)号：CN101213663B

公开(公告)日：2010-05-19

申请号：CN200680024215.0

申请日：2006-06-19

Applicant: 费查尔德半导体有限公司

Inventor： O·全 , Y·崔 , B·H·古伊 , M·C·B·伊斯塔西欧 , D·钟 , T·T·肯恩 , S·南 , R·约什 , C-L·吴 , V·伊尔 , L·Y·里姆 , B-O·李

IPC: H01L23/495 , H01L23/28

CPC classification number: H01L24/29 , H01L21/561 , H01L23/3121 , H01L23/4951 , H01L23/49558 , H01L23/49562 , H01L23/49575 , H01L23/49861 , H01L24/32 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L25/0655 , H01L2223/54406 , H01L2223/54486 , H01L2224/16 , H01L2224/291 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32057 , H01L2224/32225 , H01L2224/40245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/45565 , H01L2224/456 , H01L2224/45644 , H01L2224/45669 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/4943 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2224/83385 , H01L2224/83801 , H01L2224/8385 , H01L2224/85013 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/19043 , H01L2924/30107 , H01L2224/85 , H01L2924/00 , H01L2924/0105 , H01L2924/01082 , H01L2924/00012 , H01L2224/13111 , H01L2924/0665 , H01L2224/29099 , H01L2224/29199 , H01L2224/37099

Abstract: 公开了半导体管芯封装。一种示例性半导体管芯封装包括预模制衬底。该预模制衬底可具有附连到其的半导体，并且可在该半导体管芯上设置包封材料。

5.

发明公开
半导体管芯封装及其制作方法失效复审申请

公开(公告)号：CN101807533A

公开(公告)日：2010-08-18

申请号：CN201010147483.X

申请日：2006-06-19

Applicant: 费查尔德半导体有限公司

Inventor： O·全 , Y·崔 , B·H·古伊 , M·C·B·伊斯塔西欧 , D·钟 , T·T·肯恩 , S·南 , R·约什 , C-L·吴 , V·伊尔 , L·Y·里姆 , B-O·李

IPC: H01L21/50 , H01L21/56 , H01L25/00 , H01L23/495 , H01L23/28

CPC classification number: H01L24/29 , H01L21/561 , H01L23/3121 , H01L23/4951 , H01L23/49558 , H01L23/49562 , H01L23/49575 , H01L23/49861 , H01L24/32 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L25/0655 , H01L2223/54406 , H01L2223/54486 , H01L2224/16 , H01L2224/291 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32057 , H01L2224/32225 , H01L2224/40245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/45565 , H01L2224/456 , H01L2224/45644 , H01L2224/45669 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/4943 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2224/83385 , H01L2224/83801 , H01L2224/8385 , H01L2224/85013 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/19043 , H01L2924/30107 , H01L2224/85 , H01L2924/00 , H01L2924/0105 , H01L2924/01082 , H01L2924/00012 , H01L2224/13111 , H01L2924/0665 , H01L2224/29099 , H01L2224/29199 , H01L2224/37099

Abstract: 公开了半导体管芯封装。一种示例性半导体管芯封装包括预模制衬底。该预模制衬底可具有附连到其的半导体，并且可在该半导体管芯上设置包封材料。

6.

发明公开
用于将半导体衬底键合到金属衬底的方法有权

公开(公告)号：CN101432846A

公开(公告)日：2009-05-13

申请号：CN200780011770.4

申请日：2007-03-12

Applicant: 费查尔德半导体有限公司

Inventor： 王琦 , H·耶尔马兹 , 励敏华 , C-L·吴

IPC: H01L21/00

CPC classification number: H01L21/76251 , H01L21/6835 , H01L24/28 , H01L29/78603 , H01L2224/16 , H01L2224/29111 , H01L2224/2919 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/10253 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/157 , H01L2924/19041 , H01L2924/19043 , H01L2924/3011 , H01L2924/351 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2924/0665

Abstract: 公开了一种将半导体衬底键合到金属衬底的方法。在一些实施例中该方法包括在半导体衬底中形成半导体器件，该半导体器件包括第一表面。该方法还包括获得金属衬底。将该金属衬底键合到该半导体器件的第一表面，其中该金属衬底的至少一部分形成该半导体器件的电气端子。

7.

发明公开
半导体管芯封装及其制作方法失效

公开(公告)号：CN101213663A

公开(公告)日：2008-07-02

申请号：CN200680024215.0

申请日：2006-06-19

Applicant: 费查尔德半导体有限公司

Inventor： O·全 , Y·崔 , B·H·古伊 , M·C·B·伊斯塔西欧 , D·钟 , T·T·肯恩 , S·南 , R·约什 , C-L·吴 , V·伊尔 , L·Y·里姆 , B-O·李

IPC: H01L23/495 , H01L23/28

CPC classification number: H01L24/29 , H01L21/561 , H01L23/3121 , H01L23/4951 , H01L23/49558 , H01L23/49562 , H01L23/49575 , H01L23/49861 , H01L24/32 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L25/0655 , H01L2223/54406 , H01L2223/54486 , H01L2224/16 , H01L2224/291 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32057 , H01L2224/32225 , H01L2224/40245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/45565 , H01L2224/456 , H01L2224/45644 , H01L2224/45669 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/4943 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2224/83385 , H01L2224/83801 , H01L2224/8385 , H01L2224/85013 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/19043 , H01L2924/30107 , H01L2224/85 , H01L2924/00 , H01L2924/0105 , H01L2924/01082 , H01L2924/00012 , H01L2224/13111 , H01L2924/0665 , H01L2224/29099 , H01L2224/29199 , H01L2224/37099

Abstract: 公开了半导体管芯封装。一种示例性半导体管芯封装包括预模制衬底。该预模制衬底可具有附连到其的半导体，并且可在该半导体管芯上设置包封材料。

Patent Agency Ranking