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公开(公告)号：CN101807533B
公开(公告)日：2016-03-09
申请号：CN201010147483.X
申请日：2006-06-19
Applicant: 费查尔德半导体有限公司
Inventor： O·全 , Y·崔 , B·H·古伊 , M·C·B·伊斯塔西欧 , D·钟 , T·T·肯恩 , S·南 , R·约什 , C-L·吴 , V·伊尔 , L·Y·里姆 , B-O·李
IPC: H01L21/50 , H01L21/56 , H01L25/00 , H01L23/495 , H01L23/28
CPC classification number: H01L24/29 , H01L21/561 , H01L23/3121 , H01L23/4951 , H01L23/49558 , H01L23/49562 , H01L23/49575 , H01L23/49861 , H01L24/32 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L25/0655 , H01L2223/54406 , H01L2223/54486 , H01L2224/16 , H01L2224/291 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32057 , H01L2224/32225 , H01L2224/40245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/45565 , H01L2224/456 , H01L2224/45644 , H01L2224/45669 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/4943 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2224/83385 , H01L2224/83801 , H01L2224/8385 , H01L2224/85013 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/19043 , H01L2924/30107 , H01L2224/85 , H01L2924/00 , H01L2924/0105 , H01L2924/01082 , H01L2924/00012 , H01L2224/13111 , H01L2924/0665 , H01L2224/29099 , H01L2224/29199 , H01L2224/37099
Abstract: 公开了半导体管芯封装。一种示例性半导体管芯封装包括预模制衬底。该预模制衬底可具有附连到其的半导体，并且可在该半导体管芯上设置包封材料。
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Patent Agency Ranking
公开(公告)号：CN101213663B
公开(公告)日：2010-05-19
申请号：CN200680024215.0
申请日：2006-06-19
Applicant: 费查尔德半导体有限公司
Inventor： O·全 , Y·崔 , B·H·古伊 , M·C·B·伊斯塔西欧 , D·钟 , T·T·肯恩 , S·南 , R·约什 , C-L·吴 , V·伊尔 , L·Y·里姆 , B-O·李
IPC: H01L23/495 , H01L23/28
CPC classification number: H01L24/29 , H01L21/561 , H01L23/3121 , H01L23/4951 , H01L23/49558 , H01L23/49562 , H01L23/49575 , H01L23/49861 , H01L24/32 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L25/0655 , H01L2223/54406 , H01L2223/54486 , H01L2224/16 , H01L2224/291 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32057 , H01L2224/32225 , H01L2224/40245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/45565 , H01L2224/456 , H01L2224/45644 , H01L2224/45669 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/4943 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2224/83385 , H01L2224/83801 , H01L2224/8385 , H01L2224/85013 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/19043 , H01L2924/30107 , H01L2224/85 , H01L2924/00 , H01L2924/0105 , H01L2924/01082 , H01L2924/00012 , H01L2224/13111 , H01L2924/0665 , H01L2224/29099 , H01L2224/29199 , H01L2224/37099
Abstract: 公开了半导体管芯封装。一种示例性半导体管芯封装包括预模制衬底。该预模制衬底可具有附连到其的半导体，并且可在该半导体管芯上设置包封材料。
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公开(公告)号：CN102272920B
公开(公告)日：2014-05-21
申请号：CN200980154823.7
申请日：2009-12-09
Applicant: 费查尔德半导体有限公司
Inventor： M·C·Y·基尼奥内斯 , M·C·B·伊斯塔西欧
CPC classification number: H01L24/40 , H01L23/3107 , H01L23/4334 , H01L23/49524 , H01L23/49562 , H01L24/31 , H01L24/37 , H01L2224/29111 , H01L2224/2929 , H01L2224/29293 , H01L2224/32245 , H01L2224/371 , H01L2224/37147 , H01L2224/37155 , H01L2224/40247 , H01L2224/73263 , H01L2224/83101 , H01L2224/83191 , H01L2224/83801 , H01L2224/84801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0781 , H01L2924/10253 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00 , H01L2924/0665 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00012
Abstract: 一种半导体管芯封装。该半导体管芯封装包括半导体管芯和模制夹结构，该模制夹结构包括夹结构和覆盖该夹结构的至少一部分的第一模制材料。第一模制材料暴露夹结构的外表面。夹结构电耦合至半导体管芯。半导体管芯封装还包括引线框结构，该引线框结构包括管芯附连焊盘以及从管芯附连焊盘延伸出的多条引线。半导体管芯位于引线框结构的管芯附连焊盘上。第二模制材料覆盖半导体管芯和引线框结构的至少一部分。该半导体管芯封装还包括散热块以及将散热块耦合到夹结构的所暴露表面的导热材料。
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公开(公告)号：CN102272920A
公开(公告)日：2011-12-07
申请号：CN200980154823.7
申请日：2009-12-09
Applicant: 费查尔德半导体有限公司
Inventor： M·C·Y·基尼奥内斯 , M·C·B·伊斯塔西欧
CPC classification number: H01L24/40 , H01L23/3107 , H01L23/4334 , H01L23/49524 , H01L23/49562 , H01L24/31 , H01L24/37 , H01L2224/29111 , H01L2224/2929 , H01L2224/29293 , H01L2224/32245 , H01L2224/371 , H01L2224/37147 , H01L2224/37155 , H01L2224/40247 , H01L2224/73263 , H01L2224/83101 , H01L2224/83191 , H01L2224/83801 , H01L2224/84801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0781 , H01L2924/10253 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00 , H01L2924/0665 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00012
Abstract: 一种半导体管芯封装。该半导体管芯封装包括半导体管芯和模制夹结构，该模制夹结构包括夹结构和覆盖该夹结构的至少一部分的第一模制材料。第一模制材料暴露夹结构的外表面。夹结构电耦合至半导体管芯。半导体管芯封装还包括引线框结构，该引线框结构包括管芯附连焊盘以及从管芯附连焊盘延伸出的多条引线。半导体管芯位于引线框结构的管芯附连焊盘上。第二模制材料覆盖半导体管芯和引线框结构的至少一部分。该半导体管芯封装还包括散热块以及将散热块耦合到夹结构的所暴露表面的导热材料。
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公开(公告)号：CN101807533A
公开(公告)日：2010-08-18
申请号：CN201010147483.X
申请日：2006-06-19
Applicant: 费查尔德半导体有限公司
Inventor： O·全 , Y·崔 , B·H·古伊 , M·C·B·伊斯塔西欧 , D·钟 , T·T·肯恩 , S·南 , R·约什 , C-L·吴 , V·伊尔 , L·Y·里姆 , B-O·李
IPC: H01L21/50 , H01L21/56 , H01L25/00 , H01L23/495 , H01L23/28
CPC classification number: H01L24/29 , H01L21/561 , H01L23/3121 , H01L23/4951 , H01L23/49558 , H01L23/49562 , H01L23/49575 , H01L23/49861 , H01L24/32 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L25/0655 , H01L2223/54406 , H01L2223/54486 , H01L2224/16 , H01L2224/291 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32057 , H01L2224/32225 , H01L2224/40245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/45565 , H01L2224/456 , H01L2224/45644 , H01L2224/45669 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/4943 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2224/83385 , H01L2224/83801 , H01L2224/8385 , H01L2224/85013 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/19043 , H01L2924/30107 , H01L2224/85 , H01L2924/00 , H01L2924/0105 , H01L2924/01082 , H01L2924/00012 , H01L2224/13111 , H01L2924/0665 , H01L2224/29099 , H01L2224/29199 , H01L2224/37099
Abstract: 公开了半导体管芯封装。一种示例性半导体管芯封装包括预模制衬底。该预模制衬底可具有附连到其的半导体，并且可在该半导体管芯上设置包封材料。
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公开(公告)号：CN101213663A
公开(公告)日：2008-07-02
申请号：CN200680024215.0
申请日：2006-06-19
Applicant: 费查尔德半导体有限公司
Inventor： O·全 , Y·崔 , B·H·古伊 , M·C·B·伊斯塔西欧 , D·钟 , T·T·肯恩 , S·南 , R·约什 , C-L·吴 , V·伊尔 , L·Y·里姆 , B-O·李
IPC: H01L23/495 , H01L23/28
CPC classification number: H01L24/29 , H01L21/561 , H01L23/3121 , H01L23/4951 , H01L23/49558 , H01L23/49562 , H01L23/49575 , H01L23/49861 , H01L24/32 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L25/0655 , H01L2223/54406 , H01L2223/54486 , H01L2224/16 , H01L2224/291 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32057 , H01L2224/32225 , H01L2224/40245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/45565 , H01L2224/456 , H01L2224/45644 , H01L2224/45669 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/4943 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2224/83385 , H01L2224/83801 , H01L2224/8385 , H01L2224/85013 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/19043 , H01L2924/30107 , H01L2224/85 , H01L2924/00 , H01L2924/0105 , H01L2924/01082 , H01L2924/00012 , H01L2224/13111 , H01L2924/0665 , H01L2224/29099 , H01L2224/29199 , H01L2224/37099
Abstract: 公开了半导体管芯封装。一种示例性半导体管芯封装包括预模制衬底。该预模制衬底可具有附连到其的半导体，并且可在该半导体管芯上设置包封材料。
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