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公开(公告)号：CN1266765C
公开(公告)日：2006-07-26
申请号：CN01104552.3
申请日：2001-02-15
Applicant: 三洋电机株式会社
Abstract: 以印刷电路板、陶瓷板、软性板等作为支持基板装配半导体元件的BGA型的半导体装置。但这些支持基板是多余的，支持基板的厚度使半导体装置大型化，并使组装到其中的半导体元件难于散热。本发明通过将导电图形11A～11D埋入到绝缘性树脂10中而且导电箔20进行半蚀刻后而形成，使其厚度充分薄。由于设置了散热用的电极11D，可提供散热性能优异的半导体装置。
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公开(公告)号：CN1265451C
公开(公告)日：2006-07-19
申请号：CN01104553.1
申请日：2001-02-15
Applicant: 三洋电机株式会社
CPC classification number: H01L24/83 , H01L21/4828 , H01L21/4832 , H01L23/3107 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2221/68377 , H01L2224/05554 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/83192 , H01L2224/83385 , H01L2224/8385 , H01L2224/85001 , H01L2224/92 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/351 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2924/01026 , H01L2924/01028 , H01L2224/92247 , H01L2924/3512 , H01L2224/05599
Abstract: 以印刷电路板、陶瓷板、软性板等作为支持基板来装配半导体元件的BGA型的半导体装置。但这些支持基板是多余的材料，支持基板的厚度将使半导体装置大型化，从而成为组装到其中的半导体元件的热难于放热的结构。本发明是将导电图形(11A～11D)埋入到绝缘性树脂(10)中而且导电箔(20)通过半蚀刻而形成，可以充分地减小其厚度。由于设置了放热用的电极(11D)，可以提供散热性能优异的半导体装置。
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公开(公告)号：CN1244139C
公开(公告)日：2006-03-01
申请号：CN01112389.3
申请日：2001-02-15
Applicant: 三洋电机株式会社
CPC classification number: H01L24/05 , H01L21/4821 , H01L21/4832 , H01L23/3107 , H01L23/49548 , H01L23/49575 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/04042 , H01L2224/05556 , H01L2224/10175 , H01L2224/16 , H01L2224/32057 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48599 , H01L2224/48639 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/73265 , H01L2224/83385 , H01L2224/85439 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
Abstract: 采用薄型、轻量的封装。但是，因薄型而产生封装弯曲，因与安装基片的热膨胀系数不同而引起问题，例如发生半导体器件中设置的导电通路的断线，与金属细线的连接不良，半导体器件的可靠性存在问题。提供在绝缘树脂(44)中埋置比Z轴方向大的X轴-Y轴方向结晶所构成的导电通路(40)，导电通路(40)的背面从绝缘树脂(44)露出地封装的半导体器件。由此，可以抑制绝缘树脂(44)中埋置的导电通路(40)的断线。
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公开(公告)号：CN1237610C
公开(公告)日：2006-01-18
申请号：CN01103213.8
申请日：2001-02-05
Applicant: 三洋电机株式会社
CPC classification number: H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/566 , H01L23/49541 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/50 , H01L2221/68377 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/014 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
Abstract: 通过形成第1焊盘(55)，芯片焊盘(59)等导电覆盖膜的板状体(50)或经第1焊盘(55)，芯片焊盘(59)等导电覆盖膜形成半刻蚀的板状体(50)，可以利用半导体厂的后工序制造混合IC。而且因为可以不采用支撑底板制造，所以作为混合IC，可以制造薄型，散热性优良的混合IC。
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公开(公告)号：CN1402320A
公开(公告)日：2003-03-12
申请号：CN02123032.3
申请日：2002-06-12
Applicant: 三洋电机株式会社
CPC classification number: H01L21/4832 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L24/97 , H01L2221/68377 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L2224/78 , H01L2224/85001 , H01L2224/85203 , H01L2224/85205 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19106 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
Abstract: 以往有以陶瓷衬底、挠性片等为支承衬底安装电路元件的电路装置。但是其存在在电路装置小型化时未能确立实现大批量生产的制造方法的问题。本发明提供一种电路装置的制造方法，这种制造方法用箝位器(70)按压导电箔60的块62的周端，一并进行块62内的搭载部65的电路元件52A和所需的导电图形51B的线接合，从而，可高效地进行线接合。在进行线接合时，自设于箝位器70的通路75、76向导电箔60喷射氮气，由此，防止导电箔60的氧化。
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Patent Agency Ranking
公开(公告)号：CN1342037A
公开(公告)日：2002-03-27
申请号：CN01111941.1
申请日：2001-02-15
Applicant: 三洋电机株式会社
CPC classification number: H01L23/3107 , H01L21/4832 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2221/68377 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49111 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 问题是没有改善由于MOSFET芯片上面的电极取出依赖于线焊接而由影响最大的MOSFET芯片的源电极取出电阻引起的通态电阻的解决办法。通过使用MOSFET的保护电路装置,不需要共用漏电极的引回而且源电极直接被固定于导电电路,实现了低的通态电阻,其中,该MOSFET配备有:在电气上分离的多个导电电路、在所希望的该导电电路上把固定栅电极和源电极的2个功率MOSFET集成在一个芯片上的MOSFET芯片、设置该MOSFET芯片的共用漏电极的导电材料、覆盖所述MOSFET芯片并且一体地支持所述导电电路的绝缘树脂。
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公开(公告)号：CN1323065A
公开(公告)日：2001-11-21
申请号：CN01103214.6
申请日：2001-02-05
Applicant: 三洋电机株式会社
IPC: H01L23/495 , H01L21/50
CPC classification number: H01L24/97 , H01L21/4832 , H01L21/561 , H01L21/565 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/16245 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10161 , H01L2924/12041 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19043 , H01L2224/85 , H01L2224/81 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
Abstract: 利用在第2表面53上形成引线图形的导电覆盖膜51的板状体,或利用第2表面53具有有引线56的图形的凸部的引线框,形成引线的间隔更微细的图形。此外,与板状体50一体地形成引线56,不需要系杆。
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公开(公告)号：CN1323064A
公开(公告)日：2001-11-21
申请号：CN01103213.8
申请日：2001-02-05
Applicant: 三洋电机株式会社
CPC classification number: H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/566 , H01L23/49541 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/50 , H01L2221/68377 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/014 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
Abstract: 通过形成第1垫55,系垫59等导电膜的板状体50或经第1垫55,系垫59等导电膜形成半刻蚀的板状体50,可以利用半导体厂的后工序制造混合IC。而且因为可以不采用支撑底板制造,所以作为混合IC,可以制造薄型,散热性优良的混合IC。
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公开(公告)号：CN1805136A
公开(公告)日：2006-07-19
申请号：CN200510136193.4
申请日：2005-12-20
Applicant: 三洋电机株式会社
IPC: H01L23/488 , H05K1/02
CPC classification number: H01L21/4832 , H01L21/561 , H01L23/3107 , H01L23/49575 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2221/68377 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/83805 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H01L2224/85 , H01L2924/00 , H01L2924/01026 , H01L2924/00012 , H01L2224/05599
Abstract: 本发明公开了一种在安装方向上没有制约的电路装置(10)。本发明的电路装置(10)包括：导电图案(11)，其具有管芯垫(11A)、第一接合焊盘(11B)以及第二接合焊盘(11C)；半导体元件(TR)，其固定在导电图案上。另外，还具有使导电图案(11)的背面露出并覆盖半导体元件(TR)和导电图案(11)的密封树脂(13)、将从密封树脂(13)露出的导电图案(11)的背面覆盖的覆盖树脂(16)。另外，使导电图案(11)的背面从设于覆盖树脂(16)上的开口部露出，将开口部相对电路装置的中心点旋转对称地配置。
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公开(公告)号：CN1184684C
公开(公告)日：2005-01-12
申请号：CN01117311.4
申请日：2001-02-10
Applicant: 三洋电机株式会社
CPC classification number: H01L24/32 , G11B5/4853 , H01L21/4832 , H01L21/563 , H01L23/3114 , H01L23/3135 , H01L23/4334 , H01L24/48 , H01L24/97 , H01L2224/05599 , H01L2224/16 , H01L2224/32013 , H01L2224/32059 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/73203 , H01L2224/73204 , H01L2224/83385 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/12042 , H01L2924/12044 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/3011 , H01L2924/351 , H05K1/0204 , H05K1/021 , H05K1/182 , H05K1/189 , H05K2201/10416 , H05K2201/10727 , H01L2924/01026 , H01L2924/01028 , H01L2924/00 , H01L2224/81 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
Abstract: 在硬盘中安装有固定粘接了读写放大用IC的FCA，但是，因为读写放大用IC的散热性不好，所以该读写放大用IC的温度上升，读写速度大大降低。而且硬盘本身的特性受大的影响。散热用的电极(15)露出在绝缘性树脂13的背面，金属板(23)固定粘接在该散热用的电极(15)上，该金属板(23)的背面与柔性片的背面实质上处于同一平面，能够与第二支持件(24)简单地固定粘接在一起。因此，半导体元件产生的热能够经散热用的电极(15)、金属板(23 )、第二支持件(24)良好地散出。
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