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公开(公告)号：CN1482658A
公开(公告)日：2004-03-17
申请号：CN03142736.7
申请日：1998-07-29
Applicant: 株式会社日立制作所 , 日立北海半导体株式会社
CPC classification number: H01L24/32 , H01L21/565 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/83194 , H01L2224/83385 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/10162 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/15183 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2224/13116 , H01L2224/45015 , H01L2924/207
Abstract: 一种网格焊球阵列型半导体封装件，用粘接材料将半导体芯片安装在柔性膜衬底的表面上，在上述衬底的背面将多个突块电极排列成矩阵，并用树脂密封半导体芯片。具体地说，制作一个绝缘层来覆盖制作在衬底表面上的导电体层图形，并用粘接材料将半导体芯片安装在绝缘层上。上述绝缘层在上述半导体芯片下方的区域中被分割成多个互不相连的部分，利用这种被分割的绝缘层，防止了上述半导体芯片与上述导电体层图形之间的短路，并抑制了含有上述柔性膜的衬底的变形。
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公开(公告)号：CN100382260C
公开(公告)日：2008-04-16
申请号：CN03142736.7
申请日：1998-07-29
Applicant: 株式会社日立制作所 , 日立北海半导体株式会社
CPC classification number: H01L24/32 , H01L21/565 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/83194 , H01L2224/83385 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/10162 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/15183 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2224/13116 , H01L2224/45015 , H01L2924/207
Abstract: 一种网格焊球阵列型半导体封装件，用粘接材料将半导体芯片安装在柔性膜衬底的表面上，在上述衬底的背面将多个突块电极排列成矩阵，并用树脂密封半导体芯片。具体地说，制作一个绝缘层来覆盖制作在衬底表面上的导电体层图形，并用粘接材料将半导体芯片安装在绝缘层上。上述绝缘层在上述半导体芯片下方的区域中被分割成多个互不相连的部分，利用这种被分割的绝缘层，防止了上述半导体芯片与上述导电体层图形之间的短路，并抑制了含有上述柔性膜的衬底的变形。
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公开(公告)号：CN1148795C
公开(公告)日：2004-05-05
申请号：CN00118472.5
申请日：1998-07-29
Applicant: 株式会社日立制作所 , 日立北海半导体株式会社
CPC classification number: H01L24/32 , H01L21/565 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/83194 , H01L2224/83385 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/10162 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/15183 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2224/13116 , H01L2224/45015 , H01L2924/207
Abstract: 一种网格焊球阵列型半导体封装件，用粘接材料将半导体芯片安装在柔性膜衬底的表面上，在上述衬底的背面将多个突块电极排列成矩阵，并用树脂密封半导体芯片。具体地说，制作一个绝缘层来覆盖制作在衬底表面上的导电体层图形，并用粘接材料将半导体芯片安装在绝缘层上。上述绝缘层在上述半导体芯片下方的区域中被分割成多个互不相连的部分，利用这种被分割的绝缘层，防止了上述半导体芯片与上述导电体层图形之间的短路，并抑制了含有上述柔性膜的衬底的变形。
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Patent Agency Ranking
公开(公告)号：CN1282983A
公开(公告)日：2001-02-07
申请号：CN00118473.3
申请日：1998-07-29
Applicant: 株式会社日立制作所 , 日立北海半导体株式会社
CPC classification number: H01L24/32 , H01L21/565 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/83194 , H01L2224/83385 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/10162 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/15183 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2224/13116 , H01L2224/45015 , H01L2924/207
Abstract: 一种网格焊球阵列型半导体封装件,用粘接材料将半导体芯片安装在柔性膜衬底的表面上,在上述衬底的背面将多个突块电极排列成矩阵,并用树脂密封半导体芯片。具体地说,制作一个绝缘层来覆盖制作在衬底表面上的导电体层图形,并用粘接材料将半导体芯片安装在绝缘层上。上述绝缘层在上述半导体芯片下方的区域中被分割成多个互不相连的部分,利用这种被分割的绝缘层,防止了上述半导体芯片与上述导电体层图形之间的短路,并抑制了含有上述柔性膜的衬底的变形。
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公开(公告)号：CN1167122C
公开(公告)日：2004-09-15
申请号：CN98116654.7
申请日：1998-07-29
Applicant: 株式会社日立制作所 , 日立北海半导体株式会社
CPC classification number: H01L24/32 , H01L21/565 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/83194 , H01L2224/83385 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/10162 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/15183 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2224/13116 , H01L2224/45015 , H01L2924/207
Abstract: 一种网格焊球阵列型半导体封装件，用粘接材料将半导体芯片安装在柔性膜衬底的表面上，在上述衬底的背面将多个突块电极排列成矩阵，并用树脂密封半导体芯片。具体地说，制作一个绝缘层来覆盖制作在衬底表面上的导体层图形，并用粘接材料将半导体芯片安装在绝缘层上。上述绝缘层在上述半导体芯片下方的区域中被分割成多个互不相连的部分，利用这种被分割的绝缘层，防止了上述半导体芯片与上述导体层图形之间的短路，并抑制了含有上述柔性膜的衬底的变形。
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公开(公告)号：CN1282982A
公开(公告)日：2001-02-07
申请号：CN00118472.5
申请日：1998-07-29
Applicant: 株式会社日立制作所 , 日立北海半导体株式会社
CPC classification number: H01L24/32 , H01L21/565 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/83194 , H01L2224/83385 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/10162 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/15183 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2224/13116 , H01L2224/45015 , H01L2924/207
Abstract: 一种网格焊球阵列型半导体封装件,用粘接材料将半导体芯片安装在柔性膜衬底的表面上,在上述衬底的背面将多个突块电极排列成矩阵,并用树脂密封半导体芯片。具体地说,制作一个绝缘层来覆盖制作在衬底表面上的导电体层图形,并用粘接材料将半导体芯片安装在绝缘层上。上述绝缘层在上述半导体芯片下方的区域中被分割成多个互不相连的部分,利用这种被分割的绝缘层,防止了上述半导体芯片与上述导电体层图形之间的短路,并抑制了含有上述柔性膜的衬底的变形。
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公开(公告)号：CN1206936A
公开(公告)日：1999-02-03
申请号：CN98116654.7
申请日：1998-07-29
Applicant: 株式会社日立制作所 , 日立北海半导体株式会社
CPC classification number: H01L24/32 , H01L21/565 , H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/83194 , H01L2224/83385 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/10162 , H01L2924/12042 , H01L2924/14 , H01L2924/15151 , H01L2924/15183 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00 , H01L2224/13116 , H01L2224/45015 , H01L2924/207
Abstract: 一种网格焊球阵列型半导体封装件,用粘接材料将半导体芯片安装在柔性膜衬底的表面上,在上述衬底的背面将多个突块电极排列成矩阵,并用树脂密封半导体芯片。具体地说,制作一个绝缘层来覆盖制作在衬底表面上的导电体层图形,并用粘接材料将半导体芯片安装在绝缘层上。上述绝缘层在上述半导体芯片下方的区域中被分割成多个互不相连的部分,利用这种被分割的绝缘层,防止了上述半导体芯片与上述导电体层图形之间的短路,并抑制了含有上述柔性膜的衬底的变形。
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公开(公告)号：CN1202983A
公开(公告)日：1998-12-23
申请号：CN96198629.8
申请日：1996-09-27
Applicant: 株式会社日立制作所
CPC classification number: H01L24/50 , H01L23/13 , H01L23/16 , H01L23/24 , H01L23/293 , H01L23/3128 , H01L23/34 , H01L23/36 , H01L23/3672 , H01L23/3675 , H01L23/3732 , H01L23/3735 , H01L23/3736 , H01L23/3737 , H01L23/49572 , H01L23/49816 , H01L23/4985 , H01L24/48 , H01L24/73 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/29144 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2224/73269 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195 , H01L2924/181 , H01L2924/30107 , H01L2924/351 , H01L2924/0105 , H01L2924/00012 , H01L2924/00 , H01L2924/01014 , H01L2224/45099
Abstract: 一种半导体器件,其特征是:半导体芯片(1)是用接合金属(2)粘接到由热膨胀系数与半导体芯片(1)相近的材料构成的热沉(4)的一个面上的;热沉(4)是用弹性模数小于10MPa的硅有机树脂(硅酮)粘接剂(5)粘接到框体(3)上的;在框体(3)上中介环氧树脂粘接剂(6)粘接有TAB载带(9);半导体芯片(1)由弹性模数大于10GPa的密封环氧树脂(8)密封,以保护其不受环境的影响。
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