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公开(公告)号：CN1126823C
公开(公告)日：2003-11-05
申请号：CN99813254.3
申请日：1999-09-14
Applicant: 库利克及索发投资有限公司
Inventor： T·W·艾利斯
CPC classification number: H01L24/43 , C22C5/02 , C22C9/00 , H01L24/45 , H01L2224/43 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01037 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01045 , H01L2924/01047 , H01L2924/01052 , H01L2924/01055 , H01L2924/01057 , H01L2924/01072 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/30107 , Y10T428/1216 , Y10T428/12222 , H01L2924/00015 , H01L2224/48 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/01201 , H01L2924/01204 , H01L2924/013 , H01L2924/00013
Abstract: 一种金属合金复合材料包括一基质形态的高电导基底金属相和一处于该基质内的另一金属相，所述基底金属以主要量存在，另一金属以次要量存在，该合金复合材料可被成形为非常细的金属丝，用于半导体场合，包括终端组件，所述组件包括一个与传导部件传导接触的导电终端和另一个与半导体传导接触的导电终端，所述终端均通过所述合金复合材料金属丝连接，基底金属的实例有金、铜和铝。
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公开(公告)号：CN1329752A
公开(公告)日：2002-01-02
申请号：CN99814138.0
申请日：1999-10-05
Applicant: 库利克及索发投资有限公司
IPC: H01L21/60 , H01L23/498
CPC classification number: H05K3/282 , H01L21/4846 , H01L23/49894 , H01L24/05 , H01L24/11 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05073 , H01L2224/05647 , H01L2224/13099 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48647 , H01L2224/48699 , H01L2224/48747 , H01L2224/48847 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01057 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01105 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/15787 , H01L2924/3025 , Y10T29/4913 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2075 , H01L2924/20754
Abstract: 保护铜电路的非绝缘部分的表面免受环境污染对该表面到另一金属表面的连接的损害的方法,所述方法的特征在于用厚度适合于不用助熔剂的焊接的陶瓷材料层涂敷该表面的步骤,并且当该表面被接合以获得表面之间的金属对金属的接触时容易拆卸。还公开了被涂敷的包括半导体晶片的电子封装件。
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Patent Agency Ranking
公开(公告)号：CN1318011A
公开(公告)日：2001-10-17
申请号：CN99810940.1
申请日：1999-09-16
Applicant: 库利克及索发投资有限公司
Inventor： J·M·佐伊恩蒂恩斯
CPC classification number: H01L24/48 , B21C37/042 , H01B1/02 , H01L24/43 , H01L24/45 , H01L2224/4312 , H01L2224/4321 , H01L2224/43848 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/48247 , H01L2224/48455 , H01L2224/4847 , H01L2924/00011 , H01L2924/01005 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01202 , H01L2924/01204 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/0102 , H01L2924/01004 , H01L2924/013 , H01L2924/00 , H01L2924/00014 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/00013 , H01L2924/01006
Abstract: 本发明公开了一种复合金属线，其特征在于：一个贵金属环形部分焊接到包含导电非贵金属的金属线芯部上。本发明还公开了一种制造复合金属线的方法和一种具有至少一个与复合金属线相连的导线的半导体封装组件。
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公开(公告)号：CN1187189C
公开(公告)日：2005-02-02
申请号：CN99810940.1
申请日：1999-09-16
Applicant: 库利克及索发投资有限公司
Inventor： J·M·佐伊恩蒂恩斯
CPC classification number: H01L24/48 , B21C37/042 , H01B1/02 , H01L24/43 , H01L24/45 , H01L2224/4312 , H01L2224/4321 , H01L2224/43848 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/48247 , H01L2224/48455 , H01L2224/4847 , H01L2924/00011 , H01L2924/01005 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01202 , H01L2924/01204 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/0102 , H01L2924/01004 , H01L2924/013 , H01L2924/00 , H01L2924/00014 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/00013 , H01L2924/01006
Abstract: 本发明公开了一种复合金属线，其特征在于：一个贵金属环形部分焊接到包含导电非贵金属的金属线芯部上。本发明还公开了一种制造复合金属线的方法和一种具有至少一个与复合金属线相连的导线的半导体封装组件。
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公开(公告)号：CN1553492A
公开(公告)日：2004-12-08
申请号：CN200410063254.4
申请日：1999-10-05
Applicant: 库利克及索发投资有限公司
IPC: H01L21/60 , H01L23/498
CPC classification number: H01L2224/05647 , H01L2224/45144 , H01L2224/85375 , H01L2924/01005 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01057 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01105 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/00
Abstract: 保护铜电路的非绝缘部分的表面免受环境污染对该表面到另一金属表面的连接的损害的方法，所述方法的特征在于用厚度适合于不用助熔剂的焊接的陶瓷材料层涂敷该表面的步骤，并且当该表面被接合以获得表面之间的金属对金属的接触时容易拆卸。还公开了被涂敷的包括半导体晶片的电子封装件。
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公开(公告)号：CN1326516A
公开(公告)日：2001-12-12
申请号：CN99813254.3
申请日：1999-09-14
Applicant: 库利克及索发投资有限公司
Inventor： T·W·艾利斯
CPC classification number: H01L24/43 , C22C5/02 , C22C9/00 , H01L24/45 , H01L2224/43 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01037 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01045 , H01L2924/01047 , H01L2924/01052 , H01L2924/01055 , H01L2924/01057 , H01L2924/01072 , H01L2924/01073 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/30107 , Y10T428/1216 , Y10T428/12222 , H01L2924/00015 , H01L2224/48 , H01L2924/00 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/01201 , H01L2924/01204 , H01L2924/013 , H01L2924/00013
Abstract: 一种金属合金复合材料包括一基质形态的高电导基底金属相和一处于该基质内的另一金属相,所述基底金属以主要量存在,另一金属以次要量存在,该合金复合材料可被成形为非常细的金属丝,用于半导体场合,包括终端组件,所述组件包括一个与传导部件传导接触的导电终端和另一个与半导体传导接触的导电终端,所述终端均通过所述合金复合材料金属丝连接,基底金属的实例有金、铜和铝。
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公开(公告)号：CN1163954C
公开(公告)日：2004-08-25
申请号：CN99814138.0
申请日：1999-10-05
Applicant: 库利克及索发投资有限公司
IPC: H01L21/60 , H01L23/498
CPC classification number: H05K3/282 , H01L21/4846 , H01L23/49894 , H01L24/05 , H01L24/11 , H01L24/45 , H01L24/48 , H01L2224/0401 , H01L2224/04042 , H01L2224/05073 , H01L2224/05647 , H01L2224/13099 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48647 , H01L2224/48699 , H01L2224/48747 , H01L2224/48847 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01057 , H01L2924/01058 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01105 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/15787 , H01L2924/3025 , Y10T29/4913 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2075 , H01L2924/20754
Abstract: 保护铜电路的非绝缘部分的表面免受环境污染对该表面到另一金属表面的连接的损害的方法，所述方法的特征在于用厚度适合于不用助熔剂的焊接的陶瓷材料层涂敷该表面的步骤，并且当该表面被接合以获得表面之间的金属对金属的接触时容易拆卸。还公开了被涂敷的包括半导体晶片的电子封装件。
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