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公开(公告)号：CN1717156A
公开(公告)日：2006-01-04
申请号：CN200410097882.4
申请日：2004-11-30
Applicant: 株式会社日立制作所
CPC classification number: H05K3/328 , H01L23/24 , H01L23/66 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/83 , H01L25/072 , H01L25/16 , H01L2223/6644 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/11332 , H01L2224/11505 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/16225 , H01L2224/27505 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/29344 , H01L2224/32225 , H01L2224/371 , H01L2224/3754 , H01L2224/40095 , H01L2224/40225 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/81191 , H01L2224/81192 , H01L2224/81205 , H01L2224/8121 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8384 , H01L2224/85205 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01061 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10272 , H01L2924/12041 , H01L2924/12044 , H01L2924/1301 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/351 , H05K1/183 , H05K3/102 , H05K3/321 , H05K2201/0218 , H05K2201/0257 , H05K2201/10636 , H05K2201/10674 , H05K2203/1131 , Y02P70/611 , H01L2924/00 , H01L2924/01014 , H01L2924/00015 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/2076 , H01L2224/83205 , H01L2924/00012 , H01L2924/01028 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: 提供可实现缩小安装面积及薄形化的电子部件的安装方法、半导体模块及半导体器件。本发明的一个课题解决手段是将形成于基板上的电极和形成于电子部件上的电极进行接合的电子部件的安装方法，所述接合通过凝聚了至少一种金属粒子的金属层来进行接合。而且，所述金属粒子以平均粒径为1～50nm构成。另外，最好是构成其厚度为5～100μm的金属层。
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公开(公告)号：CN1717156B
公开(公告)日：2011-04-06
申请号：CN200410097882.4
申请日：2004-11-30
Applicant: 株式会社日立制作所
CPC classification number: H05K3/328 , H01L23/24 , H01L23/66 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/83 , H01L25/072 , H01L25/16 , H01L2223/6644 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/11332 , H01L2224/11505 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/16225 , H01L2224/27505 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/29144 , H01L2224/2919 , H01L2224/29344 , H01L2224/32225 , H01L2224/371 , H01L2224/3754 , H01L2224/40095 , H01L2224/40225 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/81191 , H01L2224/81192 , H01L2224/81205 , H01L2224/8121 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8384 , H01L2224/85205 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01061 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/10272 , H01L2924/12041 , H01L2924/12044 , H01L2924/1301 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/351 , H05K1/183 , H05K3/102 , H05K3/321 , H05K2201/0218 , H05K2201/0257 , H05K2201/10636 , H05K2201/10674 , H05K2203/1131 , Y02P70/611 , H01L2924/00 , H01L2924/01014 , H01L2924/00015 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/2076 , H01L2224/83205 , H01L2924/00012 , H01L2924/01028 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: 本发明提供可实现缩小安装面积及薄形化的电子部件的安装方法、半导体模块及半导体器件。本发明的一个课题解决手段是将形成于基板上的电极和形成于电子部件上的电极进行接合的电子部件的安装方法，所述接合通过凝聚了至少一种金属粒子的金属层来进行接合。而且，所述金属粒子以平均粒径为1～50nm构成。另外，最好是构成其厚度为5～100μm的金属层。
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公开(公告)号：CN100343871C
公开(公告)日：2007-10-17
申请号：CN200410083556.8
申请日：2004-10-08
Applicant: 株式会社日立制作所
IPC: G06K19/077
CPC classification number: G06K19/07749 , G06K19/07728 , G06K19/07764
Abstract: 本发明涉及提高RFID芯片插入物的耐久性的问题。作为该问题的代表性的解决方法有：通过用带有粘合剂的聚酰亚胺胶带(7)覆盖把RFID芯片(5)安装在天线单元(6)上的安装结构体的表面，形成RFID插入物，进而用进行了脱膜处理的基材(4)的进行了脱膜处理的面覆盖RFID插入物的外周部分。对于橡胶制品，则接着在该状态下配置在橡胶制品的橡胶基材(2)上，用未硫化的橡胶材料(8)覆盖其露出面，通过加压和加热处理将其内包在橡胶基材中。
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公开(公告)号：CN1606037A
公开(公告)日：2005-04-13
申请号：CN200410083556.8
申请日：2004-10-08
Applicant: 株式会社日立制作所
IPC: G06K19/077
CPC classification number: G06K19/07749 , G06K19/07728 , G06K19/07764
Abstract: 本发明涉及提高RFID芯片插入物的耐久性的问题。作为该问题的代表性的解决方法有：通过用带有粘合剂的聚酰亚胺胶带(7)覆盖把RFID芯片(5)安装在天线单元(6)上的安装结构体的表面，形成RFID插入物，进而用进行了脱膜处理的基材(4)的进行了脱膜处理的面覆盖RFID插入物的外周部分。对于橡胶制品，则接着在该状态下配置在橡胶制品的橡胶基材(2)上，用未硫化的橡胶材料(8)覆盖其露出面，通过加压和加热处理将其内包在橡胶基材中。
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