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公开(公告)号:CN1329362A
公开(公告)日:2002-01-02
申请号:CN01104551.5
申请日:2001-02-15
Applicant: 三洋电机株式会社
CPC classification number: H01L25/16 , H01L21/4832 , H01L23/3107 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2221/68377 , H01L2224/04042 , H01L2224/05556 , H01L2224/05624 , H01L2224/05647 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48472 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/49171 , H01L2224/73265 , H01L2224/85201 , H01L2224/85205 , H01L2224/85424 , H01L2224/85447 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12035 , H01L2924/12036 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/2076 , H05K1/185 , H05K3/06 , H05K3/202 , H01L2924/00 , H01L2924/00012 , H01L2924/20754 , H01L2924/00015
Abstract: 已存在有在印刷电路板、陶瓷板、软性板等上装配电路装置的混合集成电路装置。但其中具有大量电路元件,其中的半导体元件要用多种金属细线来焊接。例如将小信号系列的电路用的半导体元件和连接它们的Au线形成1个组件,作为半导体装置(30A等)。这就省略Au的焊接,仅进行小直径的Al线和大直径的Al线的焊接,即可完成金属细线的连接。这些半导体装置是以多个电路元件形成1个组件,所以也大幅度减少向装配基板上的固定次数。
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公开(公告)号:CN1222995C
公开(公告)日:2005-10-12
申请号:CN01104551.5
申请日:2001-02-15
Applicant: 三洋电机株式会社
CPC classification number: H01L25/16 , H01L21/4832 , H01L23/3107 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2221/68377 , H01L2224/04042 , H01L2224/05556 , H01L2224/05624 , H01L2224/05647 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48472 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/49171 , H01L2224/73265 , H01L2224/85201 , H01L2224/85205 , H01L2224/85424 , H01L2224/85447 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12035 , H01L2924/12036 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/2076 , H05K1/185 , H05K3/06 , H05K3/202 , H01L2924/00 , H01L2924/00012 , H01L2924/20754 , H01L2924/00015
Abstract: 已存在有在印刷电路板、陶瓷板、软性板等上装配电路装置的混合集成电路装置。但其中具有大量电路元件,其中的半导体元件要用多种金属细线来焊接。例如将小信号系列的电路用的半导体元件和连接它们的Au线形成1个组件,作为半导体装置(30A等)。这就省略Au的焊接,仅进行小直径的A1线和大直径的A1线的焊接,即可完成金属细线的连接。这些半导体装置是以多个电路元件形成1个组件,所以也大幅度减少向装配基板上的固定次数。
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