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公开(公告)号：CN1315823A
公开(公告)日：2001-10-03
申请号：CN01110969.6
申请日：2001-03-08
Applicant: 三洋电机株式会社
IPC: H05K3/32
CPC classification number: H05K1/188 , H01L21/4832 , H01L23/3107 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2221/68377 , H01L2224/05554 , H01L2224/16 , H01L2224/16245 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/09701 , H01L2924/10161 , H01L2924/12042 , H01L2924/13055 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K3/20 , H01L2924/00 , H01L2224/05599 , H01L2924/00012 , H01L2924/01005 , H01L2924/01004 , H01L2924/01033 , H01L2224/45147
Abstract: 在第一导电箔60A上形成分离槽54后,安装电路元件,将该层叠导电箔60作为支撑基板被覆绝缘性树脂50,翻转后,此次将绝缘性树脂50作为支撑基板,对第二导电箔60B进行刻蚀,分离成导电路径。因此不使用支撑基板,就能实现导电路径51、电路元件52被支撑在绝缘性树脂50上的电路装置。而且电路中有必要的布线L1~L3,有弯曲结构59或遮挡层,所以能防止拉脱。
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公开(公告)号：CN1244139C
公开(公告)日：2006-03-01
申请号：CN01112389.3
申请日：2001-02-15
Applicant: 三洋电机株式会社
CPC classification number: H01L24/05 , H01L21/4821 , H01L21/4832 , H01L23/3107 , H01L23/49548 , H01L23/49575 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/04042 , H01L2224/05556 , H01L2224/10175 , H01L2224/16 , H01L2224/32057 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48599 , H01L2224/48639 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/73265 , H01L2224/83385 , H01L2224/85439 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
Abstract: 采用薄型、轻量的封装。但是，因薄型而产生封装弯曲，因与安装基片的热膨胀系数不同而引起问题，例如发生半导体器件中设置的导电通路的断线，与金属细线的连接不良，半导体器件的可靠性存在问题。提供在绝缘树脂(44)中埋置比Z轴方向大的X轴-Y轴方向结晶所构成的导电通路(40)，导电通路(40)的背面从绝缘树脂(44)露出地封装的半导体器件。由此，可以抑制绝缘树脂(44)中埋置的导电通路(40)的断线。
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公开(公告)号：CN1237610C
公开(公告)日：2006-01-18
申请号：CN01103213.8
申请日：2001-02-05
Applicant: 三洋电机株式会社
CPC classification number: H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/566 , H01L23/49541 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/50 , H01L2221/68377 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/014 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
Abstract: 通过形成第1焊盘(55)，芯片焊盘(59)等导电覆盖膜的板状体(50)或经第1焊盘(55)，芯片焊盘(59)等导电覆盖膜形成半刻蚀的板状体(50)，可以利用半导体厂的后工序制造混合IC。而且因为可以不采用支撑底板制造，所以作为混合IC，可以制造薄型，散热性优良的混合IC。
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公开(公告)号：CN1323065A
公开(公告)日：2001-11-21
申请号：CN01103214.6
申请日：2001-02-05
Applicant: 三洋电机株式会社
IPC: H01L23/495 , H01L21/50
CPC classification number: H01L24/97 , H01L21/4832 , H01L21/561 , H01L21/565 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/16245 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10161 , H01L2924/12041 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19043 , H01L2224/85 , H01L2224/81 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
Abstract: 利用在第2表面53上形成引线图形的导电覆盖膜51的板状体,或利用第2表面53具有有引线56的图形的凸部的引线框,形成引线的间隔更微细的图形。此外,与板状体50一体地形成引线56,不需要系杆。
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公开(公告)号：CN1323064A
公开(公告)日：2001-11-21
申请号：CN01103213.8
申请日：2001-02-05
Applicant: 三洋电机株式会社
CPC classification number: H01L21/4832 , H01L21/561 , H01L21/565 , H01L21/566 , H01L23/49541 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/50 , H01L2221/68377 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/48599 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/014 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
Abstract: 通过形成第1垫55,系垫59等导电膜的板状体50或经第1垫55,系垫59等导电膜形成半刻蚀的板状体50,可以利用半导体厂的后工序制造混合IC。而且因为可以不采用支撑底板制造,所以作为混合IC,可以制造薄型,散热性优良的混合IC。
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Patent Agency Ranking
公开(公告)号：CN1245854C
公开(公告)日：2006-03-15
申请号：CN01103320.7
申请日：2001-01-31
Applicant: 三洋电机株式会社
CPC classification number: H01L21/6835 , H01L21/4846 , H01L2221/68377 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/19041 , H05K3/045 , H05K3/06 , H05K3/107 , H05K3/202 , H05K2201/2072 , H05K2203/0369 , H05K2203/1476 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 当在导电箔70上形成分离沟72之后，将该导电箔70作为支持底板覆盖绝缘树脂50，翻转后，将绝缘树脂50作为支持底板对导电箔进行研磨分离出导电线路。因此，可以使用最小限度的必要的材料来进行构成和制造。此外，将导电线路51埋入绝缘树脂50中，使导电线路51的侧面弯曲，或设置遮檐，由此可以实现能够防止导电线路51脱出的底板。
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公开(公告)号：CN1237611C
公开(公告)日：2006-01-18
申请号：CN01103214.6
申请日：2001-02-05
Applicant: 三洋电机株式会社
IPC: H01L23/495 , H01L21/60
CPC classification number: H01L24/97 , H01L21/4832 , H01L21/561 , H01L21/565 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/16245 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10161 , H01L2924/12041 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19043 , H01L2224/85 , H01L2224/81 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
Abstract: 利用在第2表面(53)上形成引线图形的导电覆盖膜(51)的板状体，或利用第2表面(53)具有有引线(56)的图形的凸部的引线框，形成引线的间隔更微细的图形。此外，与板状体(50)一体地形成引线(56)，不需要系杆。
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公开(公告)号：CN1191632C
公开(公告)日：2005-03-02
申请号：CN01119471.5
申请日：2001-05-31
Applicant: 三洋电机株式会社
CPC classification number: H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/0102 , H01L2924/01029 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
Abstract: 提供散热性良好的光照射装置(68)，该装置(68)具备：至少在上表面形成的导电覆盖膜；电分离的多个导电通路(51)；固定于规定的导电通路(51)上的光半导体元件(65)；以及树脂(67)，覆盖该光半导体元件(65)且成为一体地支持上述导电通路(51)的透镜、并可使光透过。
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公开(公告)号：CN1173400C
公开(公告)日：2004-10-27
申请号：CN01111672.2
申请日：2001-02-15
Applicant: 三洋电机株式会社
Abstract: 韧性层有一体形成的BGA，作为支持衬底。但是所述支持衬底是本来不必要的余料。而且韧性层自身价格高，韧性层的厚度是半导体器件薄型化的障碍。可通过形成由与第二焊盘17、布线18和引出外部用电极19实际相同的图形的导电覆盖膜11形成的板状体10、或形成经这个导电覆盖膜11半蚀刻的板状体30，使用半导体制造的后步骤制造BGA的结构的半导体器件23。
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公开(公告)号：CN1344014A
公开(公告)日：2002-04-10
申请号：CN01112389.3
申请日：2001-02-15
Applicant: 三洋电机株式会社
CPC classification number: H01L24/05 , H01L21/4821 , H01L21/4832 , H01L23/3107 , H01L23/49548 , H01L23/49575 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/04042 , H01L2224/05556 , H01L2224/10175 , H01L2224/16 , H01L2224/32057 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48599 , H01L2224/48639 , H01L2224/4903 , H01L2224/49051 , H01L2224/49171 , H01L2224/73265 , H01L2224/83385 , H01L2224/85439 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
Abstract: 采用薄型、轻量的封装。但是,因薄型而产生封装弯曲,因与安装基片的热膨胀系数不同而引起问题,例如发生半导体器件中设置的导电通路的断线,与金属细线的连接不良,半导体器件的可靠性存在问题。提供在绝缘树脂44中埋置比Z轴方向大的X轴－Y轴方向结晶所构成的导电通路40,导电通路40的里面从绝缘树脂44露出地封装的半导体器件。由此,可以抑制绝缘树脂44中埋置的导电通路40的断线。
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