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公开(公告)号：CN102420220A
公开(公告)日：2012-04-18
申请号：CN201110284769.7
申请日：2011-09-23
Applicant: 安森美半导体贸易公司
IPC: H01L25/07 , H01L23/31 , H01L23/367 , H01L23/495 , H01L21/50 , H01L21/56
CPC classification number: H02M7/537 , H01L21/4825 , H01L21/56 , H01L21/565 , H01L23/293 , H01L23/3121 , H01L23/4334 , H01L23/49531 , H01L23/49541 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/85 , H01L25/072 , H01L25/18 , H01L25/50 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48106 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/20753 , H05K1/0203 , H05K1/181 , Y10T29/4916 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00012
Abstract: 本发明公开了一种电路装置及其制造方法。该电路装置是具有良好的散热性的小型的电路装置。在本发明的混合集成电路装置(10)中，在电路基板(12)的上面固定安装有引线(18)及引线(20)。引线(18)具有岛部(28)、倾斜部(30)及引线部(32)，在岛部(28)的上面安装有晶体管(22)及二极管(24)。设置于晶体管(22)及二极管(24)的上面的电极经由金属细线(26)和接合部(34)相连接。引线(18)的接合部(34)被设置在相比岛部(28)位于上方的位置，从而与接合部(34)相连接的金属细线(26)彼此分开。
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公开(公告)号：CN102420223A
公开(公告)日：2012-04-18
申请号：CN201110285320.2
申请日：2011-09-23
Applicant: 安森美半导体贸易公司
IPC: H01L25/16 , H01L23/31 , H01L23/367 , H01L23/495 , H01L21/50 , H01L21/56
CPC classification number: H01L23/49531 , H01L21/565 , H01L23/4334 , H01L23/49541 , H01L23/49551 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/16 , H01L25/162 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48096 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/48472 , H01L2224/48699 , H01L2224/49109 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00 , H01L2924/00012 , H01L2224/48095 , H01L2224/85399 , H01L2224/05599
Abstract: 本发明公开了一种电路装置及其制造方法。该电路装置是具有良好的散热性的小型的装置。在混合集成电路装置(10)中，重叠设置固定安装有引线(18)的岛部(28)的电路基板(12)和安装有控制元件(42)等的控制基板(14)，电路基板(12)及控制基板(14)被密封树脂(16)一体地树脂密封。而且，设置在电路基板(12)的上面的晶体管(22)、安装在控制基板(14)的上面的控制元件(42)也被密封树脂覆盖。由此提供逆变电路和控制电路一体地被树脂密封的模块。
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