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公开(公告)号：CN102593044A
公开(公告)日：2012-07-18
申请号：CN201110433918.1
申请日：2011-12-21
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L21/768 , H01L21/28
CPC classification number: H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0345 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05027 , H01L2224/05166 , H01L2224/05181 , H01L2224/05186 , H01L2224/05572 , H01L2224/05647 , H01L2224/1145 , H01L2224/11452 , H01L2224/1146 , H01L2224/1147 , H01L2224/1181 , H01L2224/11824 , H01L2224/11827 , H01L2224/11849 , H01L2224/1308 , H01L2224/13083 , H01L2224/13109 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13565 , H01L2224/1357 , H01L2224/13583 , H01L2224/13693 , H01L2224/16225 , H01L2224/16227 , H01L2224/81191 , H01L2224/81815 , H01L2224/94 , H01L2924/00014 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/14 , H01L2924/01047 , H01L2924/01024 , H01L2924/01028 , H01L2924/0105 , H01L2924/01079 , H01L2924/04941 , H01L2924/04953 , H01L2924/01073 , H01L2924/01049 , H01L2924/0103 , H01L2924/01025 , H01L2924/01022 , H01L2924/01032 , H01L2924/01078 , H01L2924/01012 , H01L2924/01013 , H01L2924/0104 , H01L2924/01046 , H01L2924/01082 , H01L2924/01029 , H01L2924/01083 , H01L2924/01051 , H01L2224/03 , H01L2224/11 , H01L2924/00012 , H01L2924/00 , H01L2224/05552
Abstract: 本公开涉及金属柱的制造。制造半导体器件的示例性方法包括的步骤有：提供具有接触焊盘的衬底；形成钝化层，其在衬底上方延伸并且在接触焊盘上有开口；在接触焊盘和部分钝化层上形成金属柱；在金属柱上方形成焊接层；以及使金属柱的侧壁与有机化合物发生反应，以在金属柱的侧壁上形成该有机化合物的自组装单层或自组装多层。
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公开(公告)号：CN103515251A
公开(公告)日：2014-01-15
申请号：CN201310136202.4
申请日：2013-04-18
Applicant: 台湾积体电路制造股份有限公司
CPC classification number: H01L24/81 , H01L21/56 , H01L23/3107 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49833 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/13016 , H01L2224/13017 , H01L2224/13018 , H01L2224/13023 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13582 , H01L2224/13583 , H01L2224/13611 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/13664 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/16501 , H01L2224/16505 , H01L2224/32135 , H01L2224/32141 , H01L2224/32145 , H01L2224/81085 , H01L2224/811 , H01L2224/8112 , H01L2224/81121 , H01L2224/81193 , H01L2224/81232 , H01L2224/81355 , H01L2224/81359 , H01L2224/81801 , H01L2224/8192 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/1023 , H01L2225/1058 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/15311 , H01L2924/1533 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3841 , H01L2924/00014 , H01L2924/00012 , H01L2924/01005 , H01L2924/01074 , H01L2924/01015 , H01L2924/06 , H01L2924/00
Abstract: 一种方法包括将第一封装元件的第一电连接件与第二封装元件的第二电连接件对准。随着第一电连接件与第二电连接件对准，在第一电连接件和第二电连接件上镀金属层。该金属层将第一电连接件接合到第二电连接件。本发明公开了通过镀层接合封装元件。
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公开(公告)号：CN102832144A
公开(公告)日：2012-12-19
申请号：CN201110353089.6
申请日：2011-11-09
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L21/60
CPC classification number: H01L24/11 , H01L21/6836 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2221/68327 , H01L2224/11003 , H01L2224/111 , H01L2224/1133 , H01L2224/11462 , H01L2224/1147 , H01L2224/11825 , H01L2224/11849 , H01L2224/119 , H01L2224/13022 , H01L2224/13082 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/13655 , H01L2224/13671 , H01L2224/13672 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/81193 , H01L2224/94 , H01L2224/97 , H01L2924/00014 , H01L2924/00012 , H01L2924/01029 , H01L2924/01083 , H01L2924/0103 , H01L2924/01047 , H01L2924/01082 , H01L2224/11
Abstract: 提供了形成金属凸块的系统和方法。实施例包括将导电材料附接于载体介质，然后将导电材料与衬底的导电区相接触。采用接合工艺将导电材料的部分接合至导电区以在导电区上形成导电帽，并去除剩余的导电材料和载体介质。采用回流工艺将导电帽回流成导电凸块。本发明还提供了一种金属凸块的形成。
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Patent Agency Ranking
公开(公告)号：CN103123915B
公开(公告)日：2015-10-21
申请号：CN201210182090.1
申请日：2012-06-04
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L23/488 , H01L21/60
CPC classification number: G06F17/5077 , G06F17/5072 , H01L23/488 , H01L24/11 , H01L24/13 , H01L24/14 , H01L2224/034 , H01L2224/03912 , H01L2224/0401 , H01L2224/05016 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05552 , H01L2224/05572 , H01L2224/05666 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/13006 , H01L2224/13012 , H01L2224/13014 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14132 , H01L2924/00014 , H01L2924/00012 , H01L2924/01047 , H01L2924/01029
Abstract: 一种器件包括在封装组件(package component)的顶表面上的多个连接器。多个连接器包括具有第一横向尺寸的第一连接器、以及具有第二横向尺寸的第二连接器。第二横向尺寸大于第一横向尺寸。在平行于封装组件的主表面的方向上测量第一横向尺寸和第二横向尺寸。本发明还提供了一种调节封装组件的连接器的尺寸。
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公开(公告)号：CN103123915A
公开(公告)日：2013-05-29
申请号：CN201210182090.1
申请日：2012-06-04
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L23/488 , H01L21/60
CPC classification number: G06F17/5077 , G06F17/5072 , H01L23/488 , H01L24/11 , H01L24/13 , H01L24/14 , H01L2224/034 , H01L2224/03912 , H01L2224/0401 , H01L2224/05016 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05552 , H01L2224/05572 , H01L2224/05666 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/13006 , H01L2224/13012 , H01L2224/13014 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14132 , H01L2924/00014 , H01L2924/00012 , H01L2924/01047 , H01L2924/01029
Abstract: 一种器件包括在封装组件(package component)的顶表面上的多个连接器。多个连接器包括具有第一横向尺寸的第一连接器、以及具有第二横向尺寸的第二连接器。第二横向尺寸大于第一横向尺寸。在平行于封装组件的主表面的方向上测量第一横向尺寸和第二横向尺寸。本发明还提供了一种调节封装组件的连接器的尺寸。
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公开(公告)号：CN103515251B
公开(公告)日：2016-05-04
申请号：CN201310136202.4
申请日：2013-04-18
Applicant: 台湾积体电路制造股份有限公司
CPC classification number: H01L24/81 , H01L21/56 , H01L23/3107 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49833 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/13016 , H01L2224/13017 , H01L2224/13018 , H01L2224/13023 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13582 , H01L2224/13583 , H01L2224/13611 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/13664 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/16501 , H01L2224/16505 , H01L2224/32135 , H01L2224/32141 , H01L2224/32145 , H01L2224/81085 , H01L2224/811 , H01L2224/8112 , H01L2224/81121 , H01L2224/81193 , H01L2224/81232 , H01L2224/81355 , H01L2224/81359 , H01L2224/81801 , H01L2224/8192 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/1023 , H01L2225/1058 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/15311 , H01L2924/1533 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/3841 , H01L2924/00014 , H01L2924/00012 , H01L2924/01005 , H01L2924/01074 , H01L2924/01015 , H01L2924/06 , H01L2924/00
Abstract: 一种方法包括将第一封装元件的第一电连接件与第二封装元件的第二电连接件对准。随着第一电连接件与第二电连接件对准，在第一电连接件和第二电连接件上镀金属层。该金属层将第一电连接件接合到第二电连接件。本发明公开了通过镀层接合封装元件。
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公开(公告)号：CN102832144B
公开(公告)日：2015-10-07
申请号：CN201110353089.6
申请日：2011-11-09
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L21/60
CPC classification number: H01L24/11 , H01L21/6836 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2221/68327 , H01L2224/11003 , H01L2224/111 , H01L2224/1133 , H01L2224/11462 , H01L2224/1147 , H01L2224/11825 , H01L2224/11849 , H01L2224/119 , H01L2224/13022 , H01L2224/13082 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/13655 , H01L2224/13671 , H01L2224/13672 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/81193 , H01L2224/94 , H01L2224/97 , H01L2924/00014 , H01L2924/00012 , H01L2924/01029 , H01L2924/01083 , H01L2924/0103 , H01L2924/01047 , H01L2924/01082 , H01L2224/11
Abstract: 提供了形成金属凸块的系统和方法。实施例包括将导电材料附接于载体介质，然后将导电材料与衬底的导电区相接触。采用接合工艺将导电材料的部分接合至导电区以在导电区上形成导电帽，并去除剩余的导电材料和载体介质。采用回流工艺将导电帽回流成导电凸块。本发明还提供了一种金属凸块的形成。
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公开(公告)号：CN102593044B
公开(公告)日：2015-02-18
申请号：CN201110433918.1
申请日：2011-12-21
Applicant: 台湾积体电路制造股份有限公司
IPC: H01L21/768 , H01L21/28
CPC classification number: H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0345 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05027 , H01L2224/05166 , H01L2224/05181 , H01L2224/05186 , H01L2224/05572 , H01L2224/05647 , H01L2224/1145 , H01L2224/11452 , H01L2224/1146 , H01L2224/1147 , H01L2224/1181 , H01L2224/11824 , H01L2224/11827 , H01L2224/11849 , H01L2224/1308 , H01L2224/13083 , H01L2224/13109 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13565 , H01L2224/1357 , H01L2224/13583 , H01L2224/13693 , H01L2224/16225 , H01L2224/16227 , H01L2224/81191 , H01L2224/81815 , H01L2224/94 , H01L2924/00014 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/14 , H01L2924/01047 , H01L2924/01024 , H01L2924/01028 , H01L2924/0105 , H01L2924/01079 , H01L2924/04941 , H01L2924/04953 , H01L2924/01073 , H01L2924/01049 , H01L2924/0103 , H01L2924/01025 , H01L2924/01022 , H01L2924/01032 , H01L2924/01078 , H01L2924/01012 , H01L2924/01013 , H01L2924/0104 , H01L2924/01046 , H01L2924/01082 , H01L2924/01029 , H01L2924/01083 , H01L2924/01051 , H01L2224/03 , H01L2224/11 , H01L2924/00012 , H01L2924/00 , H01L2224/05552
Abstract: 本公开涉及金属柱的制造。制造半导体器件的示例性方法包括的步骤有：提供具有接触焊盘的衬底；形成钝化层，其在衬底上方延伸并且在接触焊盘上有开口；在接触焊盘和部分钝化层上形成金属柱；在金属柱上方形成焊接层；以及使金属柱的侧壁与有机化合物发生反应，以在金属柱的侧壁上形成该有机化合物的自组装单层或自组装多层。
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