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公开(公告)号：CN102959708B
公开(公告)日：2016-05-04
申请号：CN201180032811.4
申请日：2011-06-29
Applicant: 柯立芝照明有限公司
IPC: H01L29/02 , H01L23/488 , H01L29/40
CPC classification number: F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
Abstract: 根据特定实施例，利用压力激活的粘合剂将半导体芯片直接粘合至易弯曲基板，尽管半导体芯片的表面具有任意非平面性或半导体芯片触点非共面。
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公开(公告)号：CN104380464A
公开(公告)日：2015-02-25
申请号：CN201380016346.4
申请日：2013-01-24
Applicant: 柯立芝照明有限公司 , 迈克尔·艾伯特·蒂施勒
Inventor： 迈克尔·艾伯特·蒂施勒
IPC: H01L25/075
CPC classification number: H01L33/501 , H01L21/00 , H01L24/96 , H01L24/97 , H01L25/00 , H01L25/0753 , H01L27/14 , H01L27/15 , H01L27/156 , H01L29/00 , H01L31/0203 , H01L31/022425 , H01L31/02322 , H01L31/02327 , H01L31/048 , H01L31/055 , H01L33/00 , H01L33/005 , H01L33/10 , H01L33/44 , H01L33/486 , H01L33/50 , H01L33/502 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/16145 , H01L2224/73259 , H01L2924/01005 , H01L2924/07802 , H01L2924/07811 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/181 , H01L2924/1815 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H05B33/02 , H05B33/12 , Y02E10/52 , H01L2924/00
Abstract: 根据特定实施例，发光管芯，即半导体管芯(210)嵌入包含特定的磷光剂的聚合粘结剂(420；230)内以形成，例如嵌入单个体积的粘结剂(420；230)中的独立式白光发光管芯和/或包含多个发光管芯(210)的复合晶片。在方法的特定实施例中，半导体管芯(210)的触点保持至少部分未被粘结剂涂覆，或者在管芯被分离之前施加粘结剂(420；230)之后，再次暴露至外部环境。
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Patent Agency Ranking
公开(公告)号：CN105580144A
公开(公告)日：2016-05-11
申请号：CN201480052312.5
申请日：2014-07-23
Applicant: 柯立芝照明有限公司
Inventor： 迈克尔·A·蒂施勒
IPC: H01L33/00
Abstract: 诸如发光元件(LEE)的半导体管芯被涂覆聚合粘结剂，然后将聚合粘结剂固化以形成固体粘结剂材料的复合晶片并且管芯悬浮在聚合粘结剂中。复合晶片可以被分成独立的“白光管芯”，“白光管芯”分别包括管芯和至少部分地围绕管芯的固化粘结剂的一部分。粘结剂可以有利地包含波长转换材料，例如磷光剂或一些量子点。各个模具基板和/或模具可以用于保护半导体管芯和/或防止在涂覆过程中涂覆管芯的触点。
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公开(公告)号：CN102959708A
公开(公告)日：2013-03-06
申请号：CN201180032811.4
申请日：2011-06-29
Applicant: 柯立芝照明有限公司
IPC: H01L29/02 , H01L23/488 , H01L29/40
CPC classification number: F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
Abstract: 根据特定实施例，利用压力激活的粘合剂将半导体芯片直接粘合至易弯曲基板，尽管半导体芯片的表面具有任意非平面性或半导体芯片触点非共面。
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公开(公告)号：CN105579767A
公开(公告)日：2016-05-11
申请号：CN201480042960.2
申请日：2014-06-12
IPC: F21K9/65 , F21V19/00 , F21V23/00 , F21Y105/10 , F21Y115/10
CPC classification number: F21V21/14 , F21L4/00 , F21L4/08 , F21L2001/00 , F21V17/007 , F21V21/005 , F21V21/08 , F21V21/34 , F21V23/06 , F21V31/005 , F21V33/00 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , G06F1/1616 , G09F13/00
Abstract: 根据某些实施例，照明系统包括具有布置于其上的发光元件的柔性光片，该发光元件具有第一发光强度分布，并且该光片被弯曲或折叠以产生与第一发光强度分布不同的第二发光强度分布。
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公开(公告)号：CN104755835A
公开(公告)日：2015-07-01
申请号：CN201380046340.1
申请日：2013-08-26
Applicant: 柯立芝照明有限公司
CPC classification number: F21S4/22 , F21S2/00 , F21V21/005 , F21V21/14 , F21V23/003 , F21V23/005 , F21V23/02 , F21V23/06 , F21Y2101/00 , F21Y2105/10 , F21Y2105/12 , F21Y2115/10 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H05B33/08 , H05B33/0821 , H05B33/0824 , H05B33/0827 , H05B33/0845 , H05K1/00 , H01L2924/00
Abstract: 根据某些实施例，照明系统包括一个或多个光片，每个光片包括多个发光元件的串、控制元件，以及用于向发光元件和控制元件供电的电导体。
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