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公开(公告)号：CN101835866B
公开(公告)日：2013-01-02
申请号：CN200880113159.7
申请日：2008-11-28
Applicant: 日立化成工业株式会社
IPC: C09J201/00 , C09J11/04 , H01L21/60 , H05K1/14
CPC classification number: H01L21/6835 , C08K3/22 , C09J11/04 , H01L21/563 , H01L21/6836 , H01L23/295 , H01L24/11 , H01L24/27 , H01L24/29 , H01L24/81 , H01L24/83 , H01L24/94 , H01L2221/68318 , H01L2221/68327 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/274 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/294 , H01L2224/81121 , H01L2224/81208 , H01L2224/81801 , H01L2224/83855 , H01L2224/83885 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01056 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H05K3/305 , H01L2924/00 , H01L2924/3512
Abstract: 本发明提供一种用于连接相对向的电路基板的电路部件连接用粘接剂，所述电路部件连接用粘接剂包含：含有热塑性树脂、热固性树脂和固化剂的树脂组合物；以及分散于该组合物中的金属氢氧化物粒子。本发明的电路部件连接用粘接剂可实现半导体芯片与基板之间的优良的连接可靠性，同时可将用于对准半导体芯片和基板的位置的对准标记的识别性提高至充分实用水平。
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公开(公告)号：CN102977809A
公开(公告)日：2013-03-20
申请号：CN201210455724.6
申请日：2008-11-28
Applicant: 日立化成工业株式会社
IPC: C09J11/04 , H01L23/488
CPC classification number: H01L21/6835 , C08K3/22 , C09J11/04 , H01L21/563 , H01L21/6836 , H01L23/295 , H01L24/11 , H01L24/27 , H01L24/29 , H01L24/81 , H01L24/83 , H01L24/94 , H01L2221/68318 , H01L2221/68327 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/274 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/294 , H01L2224/81121 , H01L2224/81208 , H01L2224/81801 , H01L2224/83855 , H01L2224/83885 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01056 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H05K3/305 , H01L2924/00 , H01L2924/3512
Abstract: 本发明涉及电路部件连接用粘接剂以及半导体装置。本发明提供一种用于连接相对向的电路基板的电路部件连接用粘接剂，所述电路部件连接用粘接剂包含：含有热塑性树脂、热固性树脂和固化剂的树脂组合物；以及分散于该组合物中的金属氢氧化物粒子。本发明的电路部件连接用粘接剂可实现半导体芯片与基板之间的优良的连接可靠性，同时可将用于对准半导体芯片和基板的位置的对准标记的识别性提高至充分实用水平。
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公开(公告)号：CN101835866A
公开(公告)日：2010-09-15
申请号：CN200880113159.7
申请日：2008-11-28
Applicant: 日立化成工业株式会社
IPC: C09J201/00 , C09J11/04 , H01L21/60 , H05K1/14
CPC classification number: H01L21/6835 , C08K3/22 , C09J11/04 , H01L21/563 , H01L21/6836 , H01L23/295 , H01L24/11 , H01L24/27 , H01L24/29 , H01L24/81 , H01L24/83 , H01L24/94 , H01L2221/68318 , H01L2221/68327 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/274 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/294 , H01L2224/81121 , H01L2224/81208 , H01L2224/81801 , H01L2224/83855 , H01L2224/83885 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01056 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H05K3/305 , H01L2924/00 , H01L2924/3512
Abstract: 本发明提供一种用于连接相对向的电路基板的电路部件连接用粘接剂，所述电路部件连接用粘接剂包含：含有热塑性树脂、热固性树脂和固化剂的树脂组合物；以及分散于该组合物中的金属氢氧化物粒子。本发明的电路部件连接用粘接剂可实现半导体芯片与基板之间的优良的连接可靠性，同时可将用于对准半导体芯片和基板的位置的对准标记的识别性提高至充分实用水平。
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