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公开(公告)号：CN1900195A
公开(公告)日：2007-01-24
申请号：CN200610099679.X
申请日：1998-08-13
Applicant: 日立化成工业株式会社
CPC classification number: H01L2224/2919 , H01L2924/01005 , H01L2924/0665 , H01L2924/00
Abstract: 本发明提供一种电路构件连接用粘结剂，该粘结剂是介于相对的电路电极之间，加压相对的电路电极，而使加压方向的电极间进行电连接的电路构件连接用粘结剂，其含有粘结树脂组合物和无机填料，或者该粘结剂是双层结构，其具有第1粘结剂层和第2粘结剂层。本发明还提供用该粘结剂把电路构件彼此加以连接的电路板，和该电路板的制造方法。
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Patent Agency Ranking
公开(公告)号：CN1900195B
公开(公告)日：2011-06-22
申请号：CN200610099679.X
申请日：1998-08-13
Applicant: 日立化成工业株式会社
CPC classification number: H01L2224/2919 , H01L2924/01005 , H01L2924/0665 , H01L2924/00
Abstract: 本发明提供一种电路构件连接用粘结剂，该粘结剂是介于相对的电路电极之间，加压相对的电路电极，而使加压方向的电极间进行电连接的电路构件连接用粘结剂，其含有粘结树脂组合物和无机填料，或者该粘结剂是双层结构，其具有第1粘结剂层和第2粘结剂层。本发明还提供用该粘结剂把电路构件彼此加以连接的电路板，和该电路板的制造方法。
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公开(公告)号：CN100379832C
公开(公告)日：2008-04-09
申请号：CN200410097888.1
申请日：1998-08-13
Applicant: 日立化成工业株式会社
CPC classification number: H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
Abstract: 本发明提供一种，把半导体芯片和基板粘结固定，同时，使两电极彼此产生电连接而采用的电路构件连接用的粘结剂，该粘结剂为含有粘结树脂组合物和无机填料，对粘结树脂组合物100份(重量)含无机填料10～200份(重量)的粘结层，和用该粘结剂把电路构件彼此加以连接的电路板，和该电路板的制造方法。
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公开(公告)号：CN1230483C
公开(公告)日：2005-12-07
申请号：CN98814271.6
申请日：1998-08-13
Applicant: 日立化成工业株式会社
CPC classification number: H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
Abstract: 本发明提供一种，把半导体芯片和基板粘结固定，同时，使两电极彼此产生电连接而采用的电路构件连接用的粘结剂，该粘结剂为含有粘结树脂组合物和无机填料，对粘结树脂组合物100份(重量)含无机填料10～200份(重量)的粘结层，和用该粘结剂把电路构件彼此加以连接的电路板，和该电路板的制造方法。
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公开(公告)号：CN1637105A
公开(公告)日：2005-07-13
申请号：CN200410097888.1
申请日：1998-08-13
Applicant: 日立化成工业株式会社
CPC classification number: H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
Abstract: 本发明提供一种，把半导体芯片和基板粘结固定，同时，使两电极彼此产生电连接而采用的电路构件连接用的粘结剂，该粘结剂为含有粘结树脂组合物和无机填料，对粘结树脂组合物100份(重量)含无机填料10～200份(重量)的粘结层，和用该粘结剂把电路构件彼此加以连接的电路板，和该电路板的制造方法。
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公开(公告)号：CN1322229A
公开(公告)日：2001-11-14
申请号：CN98814271.6
申请日：1998-08-13
Applicant: 日立化成工业株式会社
CPC classification number: H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
Abstract: 本发明提供一种,把半导体芯片和基板粘结固定,同时,使两电极彼此产生电连接而采用的电路构件连接用的粘结剂,该粘结剂为含有粘结树脂组合物和无机填料,对粘结树脂组合物100份(重量)含无机填料10～200份(重量)的粘结层,和用该粘结剂把电路构件彼此加以连接的电路板,和该电路板的制造方法。
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