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公开(公告)号:CN1771770A
公开(公告)日:2006-05-10
申请号:CN03826515.X
申请日:2003-05-23
Applicant: 富士通株式会社
IPC: H05K3/46
CPC classification number: H01L21/6835 , H01L21/4857 , H01L21/486 , H01L23/142 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/19106 , H05K1/0231 , H05K1/0271 , H05K1/113 , H05K1/183 , H05K3/20 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4644 , H05K3/4652 , H05K3/4682 , H05K3/4697 , H05K2201/0347 , H05K2201/0355 , H05K2201/0391 , H05K2201/068 , H05K2201/0959 , H05K2201/096 , H05K2201/09781 , H05K2201/10378 , H05K2201/10545 , H05K2201/10674 , H05K2203/0156 , H05K2203/016 , H05K2203/061 , H05K2203/085 , H05K2203/1536 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49169 , H01L2224/0401
Abstract: 本发明涉及制造布线板的方法,所述布线板包括:堆积层,所述堆积层内布线图案借由绝缘层堆叠;和核心基板,所述核心基板独立于堆积层而形成,所述方法包括以下步骤:在板状支撑上独立形成堆积层;将核心基板电连接到支撑上堆积层的布线图案上;和从堆积层上去除支撑从而形成布线板,所述布线板中堆积层被连接到核心基板上。通过独立形成堆积层和核心基板,有效地展示其特性的布线板可以被生产。
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公开(公告)号:CN101409239B
公开(公告)日:2011-10-05
申请号:CN200810178297.5
申请日:2003-05-23
Applicant: 富士通株式会社
IPC: H01L21/48 , H01L23/498 , H05K3/46
CPC classification number: H01L21/6835 , H01L21/4857 , H01L21/486 , H01L23/142 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/19106 , H05K1/0231 , H05K1/0271 , H05K1/113 , H05K1/183 , H05K3/20 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4644 , H05K3/4652 , H05K3/4682 , H05K3/4697 , H05K2201/0347 , H05K2201/0355 , H05K2201/0391 , H05K2201/068 , H05K2201/0959 , H05K2201/096 , H05K2201/09781 , H05K2201/10378 , H05K2201/10545 , H05K2201/10674 , H05K2203/0156 , H05K2203/016 , H05K2203/061 , H05K2203/085 , H05K2203/1536 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49169 , H01L2224/0401
Abstract: 本发明涉及制造布线板的方法,所述布线板包括:堆积层,所述堆积层内布线图案借由绝缘层堆叠;和核心基板,所述核心基板独立于堆积层而形成,所述方法包括以下步骤:在板状支撑上独立形成堆积层;将核心基板电连接到支撑上堆积层的布线图案上;和从堆积层上去除支撑从而形成布线板,所述布线板中堆积层被连接到核心基板上。通过独立形成堆积层和核心基板,有效地展示其特性的布线板可以被生产。
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公开(公告)号:CN101409239A
公开(公告)日:2009-04-15
申请号:CN200810178297.5
申请日:2003-05-23
Applicant: 富士通株式会社
IPC: H01L21/48 , H01L23/498 , H05K3/46
CPC classification number: H01L21/6835 , H01L21/4857 , H01L21/486 , H01L23/142 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/19106 , H05K1/0231 , H05K1/0271 , H05K1/113 , H05K1/183 , H05K3/20 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4644 , H05K3/4652 , H05K3/4682 , H05K3/4697 , H05K2201/0347 , H05K2201/0355 , H05K2201/0391 , H05K2201/068 , H05K2201/0959 , H05K2201/096 , H05K2201/09781 , H05K2201/10378 , H05K2201/10545 , H05K2201/10674 , H05K2203/0156 , H05K2203/016 , H05K2203/061 , H05K2203/085 , H05K2203/1536 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49169 , H01L2224/0401
Abstract: 本发明涉及制造布线板的方法,所述布线板包括:堆积层,所述堆积层内布线图案借由绝缘层堆叠;和核心基板,所述核心基板独立于堆积层而形成,所述方法包括以下步骤:在板状支撑上独立形成堆积层;将核心基板电连接到支撑上堆积层的布线图案上;和从堆积层上去除支撑从而形成布线板,所述布线板中堆积层被连接到核心基板上。通过独立形成堆积层和核心基板,有效地展示其特性的布线板可以被生产。
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公开(公告)号:CN100475004C
公开(公告)日:2009-04-01
申请号:CN03826515.X
申请日:2003-05-23
Applicant: 富士通株式会社
IPC: H05K3/46
CPC classification number: H01L21/6835 , H01L21/4857 , H01L21/486 , H01L23/142 , H01L23/49822 , H01L23/49827 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/19106 , H05K1/0231 , H05K1/0271 , H05K1/113 , H05K1/183 , H05K3/20 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/4644 , H05K3/4652 , H05K3/4682 , H05K3/4697 , H05K2201/0347 , H05K2201/0355 , H05K2201/0391 , H05K2201/068 , H05K2201/0959 , H05K2201/096 , H05K2201/09781 , H05K2201/10378 , H05K2201/10545 , H05K2201/10674 , H05K2203/0156 , H05K2203/016 , H05K2203/061 , H05K2203/085 , H05K2203/1536 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49169 , H01L2224/0401
Abstract: 本发明涉及制造布线板的方法,所述布线板包括:堆积层,所述堆积层内布线图案借由绝缘层堆叠;和核心基板,所述核心基板独立于堆积层而形成,所述方法包括以下步骤:在板状支撑上独立形成堆积层;将核心基板电连接到支撑上堆积层的布线图案上;和从堆积层上去除支撑从而形成布线板,所述布线板中堆积层被连接到核心基板上。通过独立形成堆积层和核心基板,有效地展示其特性的布线板可以被生产。
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