Patent search ap:("台湾积体电路制造股份有限公司") AND inv:"王超昊" Page 1

1.

发明授权
包括无源电部件的封装系统有权

公开(公告)号：CN102983113B

公开(公告)日：2016-06-08

申请号：CN201210320807.4

申请日：2012-08-31

Applicant: 台湾积体电路制造股份有限公司

Inventor： 阿伦·罗思 , 索南·艾瑞克 , 王超昊

IPC: H01L23/488 , H05K3/34

CPC classification number: H02M3/158 , H01L23/5226 , H01L24/05 , H01L24/29 , H01L24/45 , H01L24/48 , H01L25/16 , H01L28/10 , H01L28/40 , H01L2224/05025 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05157 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/29025 , H01L2224/2919 , H01L2224/32265 , H01L2224/4502 , H01L2224/45111 , H01L2224/45116 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48265 , H01L2924/00014 , H01L2924/01047 , H01L2924/0479 , H01L2924/048 , H01L2924/04941 , H01L2924/04953 , H01L2924/10252 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10335 , H01L2924/10337 , H01L2924/10339 , H01L2924/10342 , H01L2924/10351 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/14252 , H01L2924/1427 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H05K1/111 , H05K1/181 , H05K1/185 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10166 , Y02P70/611 , H01L2224/45099 , H01L2924/00

Abstract: 一种封装系统包括设置在衬底上方的至少一个有源电路。钝化结构设置在所述至少一个有源电路上方。钝化结构具有至少一个开口，所述至少一个开口被配置成暴露至少一个第一电焊盘。至少一个无源电部件设置在钝化结构上方。至少一个无源电部件与至少一个第一电焊盘电耦合。本发明还提供了包括无源电部件的封装系统。

2.

发明公开
包括无源电部件的封装系统有权

公开(公告)号：CN102983113A

公开(公告)日：2013-03-20

申请号：CN201210320807.4

申请日：2012-08-31

Applicant: 台湾积体电路制造股份有限公司

Inventor： 阿伦·罗思 , 索南·艾瑞克 , 王超昊

IPC: H01L23/488 , H05K3/34

CPC classification number: H02M3/158 , H01L23/5226 , H01L24/05 , H01L24/29 , H01L24/45 , H01L24/48 , H01L25/16 , H01L28/10 , H01L28/40 , H01L2224/05025 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05157 , H01L2224/05166 , H01L2224/05181 , H01L2224/05184 , H01L2224/29025 , H01L2224/2919 , H01L2224/32265 , H01L2224/4502 , H01L2224/45111 , H01L2224/45116 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48265 , H01L2924/00014 , H01L2924/01047 , H01L2924/0479 , H01L2924/048 , H01L2924/04941 , H01L2924/04953 , H01L2924/10252 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10335 , H01L2924/10337 , H01L2924/10339 , H01L2924/10342 , H01L2924/10351 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/14252 , H01L2924/1427 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H05K1/111 , H05K1/181 , H05K1/185 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10166 , Y02P70/611 , H01L2224/45099 , H01L2924/00

Abstract: 一种封装系统包括设置在衬底上方的至少一个有源电路。钝化结构设置在所述至少一个有源电路上方。钝化结构具有至少一个开口，所述至少一个开口被配置成暴露至少一个第一电焊盘。至少一个无源电部件设置在钝化结构上方。至少一个无源电部件与至少一个第一电焊盘电耦合。本发明还提供了包括无源电部件的封装系统。

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