公开(公告)号：US10141269B2

公开(公告)日：2018-11-27

申请号：US15368583

申请日：2016-12-03

Applicant: Amkor Technology, Inc.

Inventor： Jun Ho Jeon ,  Kyeong Sool Seong ,  Seok Ho Na ,  Jeong Il Kim ,  Young Kyu Kim ,  Sung Ho Jeon ,  Deok In Lim ,  Sung Moo Hong ,  Sung Jung Kim ,  Sung Han Ryu ,  Kyung Nam Kang ,  Seong Hak Yoo

IPC: H01L23/522 ,  H01L23/552 ,  H01L21/48 ,  H01L23/00

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

公开(公告)号：US20130214402A1

公开(公告)日：2013-08-22

申请号：US13725645

申请日：2012-12-21

Applicant: Amkor Technology, Inc.

Inventor： Joon Young Park ,  Jin Suk Jeong ,  Kyeong Sool Seong ,  Seo Won Lee

IPC: H01L23/34 ,  H01L21/50

CPC classification number: H01L23/34 ,  H01L21/50 ,  H01L23/42 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29076 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/33505 ,  H01L2224/73253 ,  H01L2924/16251 ,  H01L2924/351 ,  H01L2924/00

Abstract: A semiconductor package improves reliability of heat emitting performance by maintaining a heat emitting lid stacked on a top surface of a semiconductor chip at a tightly adhered state. A highly adhesive interface material and a thermal interface material are applied to the top surface of the semiconductor chip. The highly adhesive interface material insures that the heat emitting lid is bonded to the top surface while the thermal interface material insures excellent heat transfer between the top surface and the heat emitting lid.

Abstract translation: 半导体封装通过在紧密粘附的状态下保持层叠在半导体芯片的顶表面上的发热盖来提高发热性能的可靠性。 将高粘合界面材料和热界面材料施加到半导体芯片的顶表面。 高粘合界面材料确保发热盖结合到顶表面，而热界面材料确保顶表面和发热盖之间的良好的热传递。

公开(公告)号：US09780024B2

公开(公告)日：2017-10-03

申请号：US15052219

申请日：2016-02-24

Applicant: Amkor Technology, Inc.

Inventor： In Ho Kim ,  Jae Yun Kim ,  Kyeong Sool Seong

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02235 ,  H01L2224/02351 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05012 ,  H01L2224/05014 ,  H01L2224/05015 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/0558 ,  H01L2224/05647 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01074

Abstract: A semiconductor package and a method of making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor packages, and methods of making thereof, that comprise a conductive layer that comprises an anchor portion extending through at least one dielectric layer.

公开(公告)号：US20170141046A1

公开(公告)日：2017-05-18

申请号：US15149378

申请日：2016-05-09

Applicant: Amkor Technology, Inc.

Inventor： Jin Suk Jeong ,  Kyeong Sool Seong ,  Kye Ryung Kim ,  Young Ik Kwon ,  Ki Dong Sim

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

Abstract: A method for forming a semiconductor device with an electromagnetic interference shield is disclosed and may include coupling a semiconductor die to a first surface of a substrate, encapsulating the semiconductor die and portions of the substrate using an encapsulant, placing the encapsulated substrate and semiconductor die on an adhesive tape, and forming an electromagnetic interference (EMI) shield layer on the encapsulant, on side surfaces of the substrate, and on portions of the adhesive tape adjacent to the encapsulated substrate and semiconductor die. The adhesive tape may be peeled away from the encapsulated substrate and semiconductor die, thereby leaving portions of the EMI shield layer on the encapsulant and on the side surfaces of the substrate with other portions of the EMI shield layer remaining on portions of the adhesive tape. Contacts may be formed on a second surface of the substrate opposite to the first surface of the substrate.

公开(公告)号：US10943871B2

公开(公告)日：2021-03-09

申请号：US16164733

申请日：2018-10-18

Applicant: AMKOR TECHNOLOGY INC.

Inventor： Jun Ho Jeon ,  Kyeong Sool Seong ,  Seok Ho Na ,  Jeong Il Kim ,  Young Kyu Kim ,  Sung Ho Jeon ,  Deok In Lim ,  Sung Moo Hong ,  Sung Jung Kim ,  Sung Han Ryu ,  Kyung Nam Kang ,  Seong Hak Yoo

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/48

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

公开(公告)号：US08981550B2

公开(公告)日：2015-03-17

申请号：US13725645

申请日：2012-12-21

Applicant: Amkor Technology, Inc.

Inventor： Joon Young Park ,  Jin Suk Jeong ,  Kyeong Sool Seong ,  Seo Won Lee

IPC: H01L23/34 ,  H01L21/50 ,  H01L23/00 ,  H01L23/42

CPC classification number: H01L23/34 ,  H01L21/50 ,  H01L23/42 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29076 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/33505 ,  H01L2224/73253 ,  H01L2924/16251 ,  H01L2924/351 ,  H01L2924/00

Abstract: A semiconductor package improves reliability of heat emitting performance by maintaining a heat emitting lid stacked on a top surface of a semiconductor chip at a tightly adhered state. A highly adhesive interface material and a thermal interface material are applied to the top surface of the semiconductor chip. The highly adhesive interface material insures that the heat emitting lid is bonded to the top surface while the thermal interface material insures excellent heat transfer between the top surface and the heat emitting lid.

Abstract translation: 半导体封装通过在紧密粘附的状态下保持堆叠在半导体芯片的顶表面上的发热盖来提高发热性能的可靠性。 将高粘合界面材料和热界面材料施加到半导体芯片的顶表面。 高粘合界面材料确保发热盖结合到顶表面，而热界面材料确保顶表面和发热盖之间的良好的热传递。

公开(公告)号：US20160254221A1

公开(公告)日：2016-09-01

申请号：US15052219

申请日：2016-02-24

Applicant: Amkor Technology, Inc.

Inventor： In Ho Kim ,  Jae Yun Kim ,  Kyeong Sool Seong

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02235 ,  H01L2224/02351 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05012 ,  H01L2224/05014 ,  H01L2224/05015 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/0558 ,  H01L2224/05647 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01074

Abstract: A semiconductor package and a method of making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor packages, and methods of making thereof, that comprise a conductive layer that comprises an anchor portion extending through at least one dielectric layer.

Abstract translation: 半导体封装以及制造半导体封装的方法。 作为非限制性示例，本公开的各个方面提供各种半导体封装及其制造方法，其包括导电层，该导电层包括延伸穿过至少一个电介质层的锚定部分。