公开(公告)号：US10943871B2

公开(公告)日：2021-03-09

申请号：US16164733

申请日：2018-10-18

Applicant: AMKOR TECHNOLOGY INC.

Inventor： Jun Ho Jeon ,  Kyeong Sool Seong ,  Seok Ho Na ,  Jeong Il Kim ,  Young Kyu Kim ,  Sung Ho Jeon ,  Deok In Lim ,  Sung Moo Hong ,  Sung Jung Kim ,  Sung Han Ryu ,  Kyung Nam Kang ,  Seong Hak Yoo

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/48

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

公开(公告)号：US10141269B2

公开(公告)日：2018-11-27

申请号：US15368583

申请日：2016-12-03

Applicant: Amkor Technology, Inc.

Inventor： Jun Ho Jeon ,  Kyeong Sool Seong ,  Seok Ho Na ,  Jeong Il Kim ,  Young Kyu Kim ,  Sung Ho Jeon ,  Deok In Lim ,  Sung Moo Hong ,  Sung Jung Kim ,  Sung Han Ryu ,  Kyung Nam Kang ,  Seong Hak Yoo

IPC: H01L23/522 ,  H01L23/552 ,  H01L21/48 ,  H01L23/00

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.