公开(公告)号：US11569176B2

公开(公告)日：2023-01-31

申请号：US15465307

申请日：2017-03-21

Applicant: Amkor Technology, Inc.

Inventor： Yi Seul Han ,  Tae Yong Lee ,  Ji Yeon Ryu

IPC: H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50

Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising multiple encapsulating layers and multiple signal distribution structures, and a method of manufacturing thereof.

公开(公告)号：US11024604B2

公开(公告)日：2021-06-01

申请号：US16537554

申请日：2019-08-10

Applicant: Amkor Technology Inc.

Inventor： Shaun Bowers ,  Ramakanth Alapati

IPC: H01L25/065 ,  H01L25/00

Abstract: A packaged semiconductor device includes a substrate with first and second opposing major surfaces. A stacked semiconductor device structure is connected to the first major surface and includes a plurality of semiconductor die having terminals. Conductive interconnect structures electrically connect the terminals of the semiconductor dies together. The semiconductor dies are stacked together so that the terminals are exposed, and the stacked semiconductor device structure comprises a stepped profile. The conductive interconnect structures comprise a conformal layer that substantially follows the stepped profile.

公开(公告)号：US20210082717A1

公开(公告)日：2021-03-18

申请号：US17005021

申请日：2020-08-27

Applicant: Amkor Technology, Inc.

Inventor： Tae Ho Yoon ,  Yang Gyoo Jung ,  Min Ho Kim ,  Youn Seok Song ,  Dong Soo Ryu ,  Choong Hoe Kim

IPC: H01L21/48 ,  H01L23/00 ,  G02B27/09

Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

公开(公告)号：US20210043606A1

公开(公告)日：2021-02-11

申请号：US16537554

申请日：2019-08-10

Applicant: Amkor Technology Inc.

Inventor： Shaun BOWERS ,  Ramakanth ALAPATI

IPC: H01L25/065 ,  H01L25/00

Abstract: A packaged semiconductor device includes a substrate with first and second opposing major surfaces. A stacked semiconductor device structure is connected to the first major surface and includes a plurality of semiconductor die having terminals. Conductive interconnect structures electrically connect the terminals of the semiconductor dies together. The semiconductor dies are stacked together so that the terminals are exposed, and the stacked semiconductor device structure comprises a stepped profile. The conductive interconnect structures comprise a conformal layer that substantially follows the stepped profile.

公开(公告)号：US10903190B2

公开(公告)日：2021-01-26

申请号：US15689714

申请日：2017-08-29

Applicant: Amkor Technology, Inc.

Inventor： Do Hyung Kim ,  Jung Soo Park ,  Seung Chul Han

IPC: H01L25/065 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498 ,  H01L23/538 ,  H01L25/00 ,  H01L21/683 ,  H01L23/00 ,  H01L25/10 ,  H01L21/48 ,  H01L23/544

Abstract: A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the CSDS via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the CSDS via the second bond pad. The semiconductor package may further include a metal post electrically coupled to the first surface of the CSDS, and a first encapsulant material encapsulating side surfaces and a surface opposite the first die surface of the first semiconductor die, the metal post, and a portion of the first surface of the CSDS.

公开(公告)号：US10818637B2

公开(公告)日：2020-10-27

申请号：US16363680

申请日：2019-03-25

Applicant: Amkor Technology, Inc.

Inventor： Christopher J. Berry ,  Roger D. St. Amand ,  Jin Seong Kim

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/12 ,  H01L21/56 ,  H01L23/552

Abstract: Methods and systems for a thin bonded interposer package are disclosed and may, for example, include bonding a semiconductor die to a first surface of a substrate, forming contacts on the first surface of the substrate, encapsulating the semiconductor die, formed contacts, and first surface of the substrate using a mold material while leaving a top surface of the semiconductor die not encapsulated by mold material, forming vias through the mold material to expose the formed contacts. A bond line may be dispensed on the mold material and the semiconductor die for bonding the substrate to an interposer. A thickness of the bond line may be defined by standoffs formed on the top surface of the semiconductor die.

公开(公告)号：US10818602B2

公开(公告)日：2020-10-27

申请号：US15943097

申请日：2018-04-02

Applicant: Amkor Technology, Inc.

Inventor： Corey Reichman ,  Ronald Huemoeller

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L21/66 ,  H01L23/00 ,  H01L21/48 ,  G01R31/28

Abstract: A electronic device includes an embedded ball land substrate and a semiconductor die. The embedded ball land substrate includes a top surface, a bottom surface opposite the top surface, and one or more side surfaces adjacent the top surface and the bottom surface. The embedded ball land substrate further includes a mold layer on the bottom surface, contact pads on the top surface, and ball lands embedded in the mold layer and electrically connected to the contact pads. The semiconductor die includes a first surface, a second surface opposite the first surface, one or more side surfaces adjacent the first surface and the second surface, and attachment structures along the second surface. The semiconductor die is operatively coupled to the contact pads via the attachment structures.

公开(公告)号：US20200335476A1

公开(公告)日：2020-10-22

申请号：US16774432

申请日：2020-01-28

Applicant: Amkor Technology, Inc.

Inventor： Brett Arnold Dunlap

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components. A dielectric sheet is laminated around the electronic components thus filling the spaces and forming a package body. The spaces are completely and reliably filled by the dielectric sheet and thus the package body has an absence of voids. Further, an upper surface of the package body is planar, i.e., has an absence of ripples or other non-uniformities. Further, lamination of the dielectric sheet is performed with a low cost lamination system.

公开(公告)号：US10784232B2

公开(公告)日：2020-09-22

申请号：US16700592

申请日：2019-12-02

Applicant: Amkor Technology, Inc.

Inventor： David Hiner ,  Michael Kelly ,  Ronald Huemoeller

IPC: H01L25/065 ,  H01L23/538 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L21/683 ,  H01L25/00 ,  H01L23/498 ,  H01L21/48

Abstract: A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.

公开(公告)号：US10784178B2

公开(公告)日：2020-09-22

申请号：US14931112

申请日：2015-11-03

Applicant: Amkor Technology, Inc.

Inventor： Yeong Beom Ko ,  Dong Jin Kim ,  Se Woong Cha

IPC: H01L23/31 ,  H01L21/78 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor product in the form of a stack chip package and a method of manufacturing the same, where a plurality of semiconductor chips are stacked one on another so as to enable the exchange of electrical signals between the semiconductor chips, and where a conductive layer is included for inputting and outputting signals to and from individual chips. A stack chip package having a compact size may, for example, be manufactured by stacking, on a first semiconductor chip, a second semiconductor chip having a smaller surface area by means of interconnection structures so as to enable the exchange of electrical signals between the first and second semiconductor chips, and by using a conductive layer for inputting and outputting signals to and from individual semiconductor chips, in lieu of a thick substrate. Furthermore, heat dissipation effects can be enhanced by the addition of a heat dissipation unit.