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公开(公告)号:CN100353541C
公开(公告)日:2007-12-05
申请号:CN200410061649.0
申请日:2004-06-23
Applicant: 株式会社电装
IPC: H01L23/48 , H01L23/52 , H01L21/768 , H01L21/28
CPC classification number: H01L24/33 , H01L23/482 , H01L23/485 , H01L23/488 , H01L24/32 , H01L24/48 , H01L2224/05599 , H01L2224/291 , H01L2224/29111 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/04941 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/3025 , H01L2924/351 , H01L2924/01014 , H01L2924/01028 , H01L2924/3512 , H01L2924/00 , H01L2924/014 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
Abstract: 一种塑模型半导体器件,包括:含有半导体部件的半导体芯片(1);金属层(13,13a-13c);焊料层(14);和通过金属层(13,13a-13c)和焊料层(14)与半导体芯片(1)连接的金属构件(24)。焊料层(14)由屈服应力比金属层(13,13a-13c)屈服应力小的焊料构成。即使当用树脂塑模(20)密封半导体芯片(1)时,也能防止金属层(13,13a-13c)破裂。