公开(公告)号：US20220393666A1

公开(公告)日：2022-12-08

申请号：US17842657

申请日：2022-06-16

Applicant: Resonant Inc.

Inventor： Viktor Plesski ,  Soumya Yandrapalli ,  Sean McHugh ,  Gregory L. Hey-Shipton ,  Garrett Williams ,  Ventsislav Yantchev ,  Andrew Guyette ,  Neal Fenzi ,  Jesson John ,  Bryant Garcia ,  Robert B. Hammond ,  Patrick Turner ,  Douglas Jachowski ,  Greg Dyer ,  Chris O'Brien ,  Andrew Kay ,  Albert Cardona ,  Dylan Kelly ,  Wei Yang ,  Marie Chantal Mukandatimana ,  Luke Myers

IPC: H03H9/56 ,  H03H9/02 ,  H03H9/13 ,  H03H9/17

Abstract: Filter devices are disclosed. A filter device includes a piezoelectric plate comprising a supported portion, a first diaphragm, and a second diaphragm. The supported portion is attached to a substrate and the first and second diaphragms spans respective cavities in the substrate. A first interdigital transducer (IDT) has interleaved fingers on the first diaphragm. A second interdigital transducer (IDT) has interleaved fingers on the second diaphragm. A first dielectric layer is between the interleaved fingers of the first IDT, and a second dielectric layer is between the interleaved fingers of the second IDT. A thickness of the first dielectric layer is greater than a thickness of the second dielectric layer. The piezoelectric plate and the first and second IDTs are configured such that radio frequency signals applied to first and second IDTs excite primary shear acoustic modes in the respective diaphragms.

公开(公告)号：US11381221B2

公开(公告)日：2022-07-05

申请号：US17096841

申请日：2020-11-12

Applicant: Resonant Inc.

Inventor： Sean McHugh ,  Gregory L. Hey-Shipton ,  Garrett Williams

IPC: H03H9/64 ,  H03H9/02 ,  H03H9/60 ,  H03H9/72

Abstract: Filter devices. A first chip includes a first interdigital transducer (IDT) of a first acoustic resonator formed on a surface of a first piezoelectric wafer having a first thickness, interleaved fingers of the first IDT disposed on a portion of the first piezoelectric wafer spanning a first cavity in a first base. A second chip includes a second IDT of a second acoustic resonator formed on a surface of a second piezoelectric wafer having a second thickness less than the first thickness, interleaved fingers of the second IDT disposed on a portion of the second piezoelectric wafer spanning a second cavity in a second base. A circuit card coupled to the first chip and the second chip includes at least one conductor for making an electrical connection between the first IDT and the second IDT.

公开(公告)号：US20210067140A1

公开(公告)日：2021-03-04

申请号：US17096841

申请日：2020-11-12

Applicant: Resonant Inc.

Inventor： Sean McHugh ,  Gregory L. Hey-Shipton ,  Garrett Williams

IPC: H03H9/64 ,  H03H9/60 ,  H03H9/72 ,  H03H9/02

Abstract: Filter devices. A first chip includes a first interdigital transducer (IDT) of a first acoustic resonator formed on a surface of a first piezoelectric wafer having a first thickness, interleaved fingers of the first IDT disposed on a portion of the first piezoelectric wafer spanning a first cavity in a first base. A second chip includes a second IDT of a second acoustic resonator formed on a surface of a second piezoelectric wafer having a second thickness less than the first thickness, interleaved fingers of the second IDT disposed on a portion of the second piezoelectric wafer spanning a second cavity in a second base. A circuit card coupled to the first chip and the second chip includes at least one conductor for making an electrical connection between the first IDT and the second IDT.

公开(公告)号：US10917072B2

公开(公告)日：2021-02-09

申请号：US16727304

申请日：2019-12-26

Applicant: Resonant Inc.

Inventor： Sean McHugh ,  Gregory L. Hey-Shipton ,  Garrett Williams

IPC: H03H9/64 ,  H03H9/72 ,  H03H9/60 ,  H03H9/02

Abstract: Filter devices and methods of fabricating filter devices. A filter device includes a first chip and a second chip. The first chip has a first material stack and contains one or more series resonators of a ladder filter circuit. The second chip has a second material stack and contains one or more shunt resonators of the ladder filter circuit. The first material stack and the second material stack are different.

公开(公告)号：US20220200575A1

公开(公告)日：2022-06-23

申请号：US17692112

申请日：2022-03-10

Applicant: Resonant Inc.

Inventor： Sean McHugh ,  Gregory L. Hey-Shipton ,  Garrett Williams

IPC: H03H9/64 ,  H03H9/60 ,  H03H9/02 ,  H03H9/72

Abstract: Filter devices. A first chip includes a first interdigital transducer (IDT) of a first acoustic resonator formed on a surface of a first piezoelectric wafer having a first thickness, interleaved fingers of the first IDT disposed on a portion of the first piezoelectric wafer spanning a first cavity in a first base. A second chip includes a second IDT of a second acoustic resonator formed on a surface of a second piezoelectric wafer having a second thickness less than the first thickness, interleaved fingers of the second IDT disposed on a portion of the second piezoelectric wafer spanning a second cavity in a second base. A circuit card coupled to the first chip and the second chip includes at least one conductor for making an electrical connection between the first IDT and the second IDT.

公开(公告)号：US20210091750A1

公开(公告)日：2021-03-25

申请号：US17097238

申请日：2020-11-13

Applicant: Resonant Inc.

Inventor： Sean McHugh ,  Gregory L. Hey-Shipton ,  Garrett Williams

IPC: H03H9/64 ,  H03H9/60 ,  H03H9/72 ,  H03H9/02

Abstract: Filter devices. A first chip includes a first base, a first piezoelectric membrane having a first thickness, and a first acoustic Bragg reflector sandwiched between the first piezoelectric membrane and the first base. A first interdigital transducer (IDT) of a first solidly-mounted membrane resonator is formed on a surface of the first piezoelectric membrane. A second chip includes a second base, a second piezoelectric membrane having a second thickness less than the first thickness, and a second acoustic Bragg reflector sandwiched between the second piezoelectric membrane and the second base. A second IDT of a second solidly-mounted membrane resonator is formed on a surface of the second piezoelectric membrane. A circuit card is coupled to the first chip and the second chip, the circuit card including at least one conductor for making an electrical connection between the first IDT and the second IDT.