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公开(公告)号：CN1841715A
公开(公告)日：2006-10-04
申请号：CN200610006440.3
申请日：2006-01-20
Applicant: 株式会社日立产机系统
IPC: H01L23/40
CPC classification number: H01L25/112 , B60L11/08 , B60L11/14 , B60L11/1868 , H01L23/3121 , H01L23/4093 , H01L23/473 , H01L23/4952 , H01L23/49562 , H01L23/49575 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/072 , H01L2224/0603 , H01L2224/32245 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/49111 , H01L2224/49113 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H02M7/003 , H05K7/1432 , H05K7/20927 , Y02T10/70 , Y02T10/7005 , Y02T10/7066 , Y02T10/7077 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
Abstract: 一种电路模块，由层叠的弹性部件(8)和使电流双向流通的直流正极侧布线部件(5)及直流负极侧布线部件(6)构成加压夹具，利用该加压夹具，按压第1固定夹具(1)，由第1固定夹具(1)按压半导体装置(3)，以使半导体装置(3)的散热面与散热部件(2)的侧壁面(2C、2d)面接触的状态，将半导体装置(3)固定到散热部件(2)上。提供能够提高散热部件和半导体装置之间的散热性、而且不使用新的模块构成部件就能够将半导体部件固定到散热部件上。
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公开(公告)号：CN100481411C
公开(公告)日：2009-04-22
申请号：CN200610006440.3
申请日：2006-01-20
Applicant: 株式会社日立产机系统
IPC: H01L23/40
CPC classification number: H01L25/112 , B60L11/08 , B60L11/14 , B60L11/1868 , H01L23/3121 , H01L23/4093 , H01L23/473 , H01L23/4952 , H01L23/49562 , H01L23/49575 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/072 , H01L2224/0603 , H01L2224/32245 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/49111 , H01L2224/49113 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H02M7/003 , H05K7/1432 , H05K7/20927 , Y02T10/70 , Y02T10/7005 , Y02T10/7066 , Y02T10/7077 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
Abstract: 一种电路模块，由层叠的弹性部件(8)和使电流双向流通的直流正极侧布线部件(5)及直流负极侧布线部件(6)构成加压夹具，利用该加压夹具，按压第1固定夹具(1)，由第1固定夹具(1)按压半导体装置(3)，以使半导体装置(3)的散热面与散热部件(2)的侧壁面(2C、2d)面接触的状态，将半导体装置(3)固定到散热部件(2)上。提供能够提高散热部件和半导体装置之间的散热性、而且不使用新的模块构成部件就能够将半导体部件固定到散热部件上。
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