Invention Grant
US09276082B2 Method for producing a semiconductor device comprising a Schottky diode and a high electron mobility transistor
有权
用于制造包括肖特基二极管和高电子迁移率晶体管的半导体器件的方法
- Patent Title: Method for producing a semiconductor device comprising a Schottky diode and a high electron mobility transistor
- Patent Title (中): 用于制造包括肖特基二极管和高电子迁移率晶体管的半导体器件的方法
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Application No.: US14254615Application Date: 2014-04-16
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Publication No.: US09276082B2Publication Date: 2016-03-01
- Inventor: Stefaan Decoutere , Silvia Lenci
- Applicant: IMEC
- Applicant Address: BE Leuven
- Assignee: IMEC
- Current Assignee: IMEC
- Current Assignee Address: BE Leuven
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Priority: EP13163861 20130416
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/66 ; H01L21/8252 ; H01L29/872 ; H01L29/778 ; H01L29/06 ; H01L29/10 ; H01L29/20

Abstract:
A semiconductor device includes a Schottky diode and a High Electron Mobility Transistor (HEMT) formed on a III-nitride stack. The III-nitride stack includes at least a lower and an upper III-nitride layer forming a heterojunction therebetween, so that a 2-dimensional electron gas (2DEG) layer may be formed in the lower layer. The 2DEG layer serves as a charge carrier for the diode and the HEMT. A doped III-nitride layer may be present between a portion of the anode of the diode and the III-nitride stack, and the portion may be located between the diode's Schottky junction and the cathode. A further layer of doped III-nitride material may be present between the gate electrode of the HEMT and the III-nitride stack. The thickness of the III-nitride layers is not equal, so that the turn-on voltage of the diode and the threshold voltage of the HEMT may be tuned according to specific requirements. The disclosure also involves a method of producing such a semiconductor device.
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