The invention provides an electronic apparatus which can be minimized. The electronic apparatus (100) includes a multilayered structure (2) in which a plurality of semiconductor chips (10,20,30) provided with semiconductor devices are stacked, penetrating electrodes (4,6,8) penetrating the semiconductor chips (10,20,30)and electrically connecting the semiconductor devices of the plurality of semiconductor chips (10,20,30), an MEMS chip (40) mounted on the multilayered structure (2) and provided with an MEMS device, wherein pads (42) connecting to the penetrating electrodes are provided on the MEMS chip (40).