知搜-全球专利检索

  1. Login
  2. Sign Up
Invention Grant
CN101808472B 制造电子部件单元的方法 失效 - 权利终止

制造电子部件单元的方法
Abstract:
一种制造电子部件单元的方法，所述方法包括步骤：通过回流焊接工艺将第一电子部件安装在第一衬底的第一表面上；通过回流焊接工艺将第二电子部件安装在第二衬底的第二表面上；将所述第一衬底的第二表面粘合到第三衬底的第一表面；以及将所述第二衬底的第二表面粘合到所述第三衬底的第二表面。
Abstract(English):

A method for producing an electronic part unit, the method includes: mounting a first electronic part on a first surface of a first substrate by reflow soldering; mounting a second electronic part on a second surface of a second substrate by reflow soldering; adhering a second surface of the first substrate to a first surface of a third substrate; and adhering a second surface of the second substrate to a second surface of the third substrate.

Public/Granted literature
Patent Agency Ranking
0/0