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1.发明申请MOUNTING METHOD OF ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MOUNT BODY, AND MANUFACTURING METHOD THEREOF 有权电子元件的安装方法，电子部件装配体及其制造方法公开(公告)号：US20140218881A1
公开(公告)日：2014-08-07
申请号：US14157779
申请日：2014-01-17
Applicant: Yuichi Tanida
Inventor： Yuichi Tanida
CPC classification number: H05K3/3436 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/1134 , H01L2224/1184 , H01L2224/131 , H01L2224/13147 , H01L2224/14155 , H01L2224/16105 , H01L2224/16225 , H01L2224/16227 , H01L2224/81193 , H01L2224/81194 , H05K3/303 , H05K2201/10674 , H05K2203/048 , H05K2203/166 , Y02P70/613 , H01L2924/014 , H01L2924/00014
Abstract: An electronic component is provided with two or more component terminals. A mount board is provided with two or more board terminals. The board terminal is provided with an inclined portion on a surface of the board terminal, the inclined portion being the wider as closer to a base end side toward a peripheral edge. A position of the component terminal is offset in relation to a position of the corresponding board terminal. A position of the other component terminal is offset in the opposite side to the direction of the offset in relation to a position of the corresponding board terminal. The component terminal makes contact with the inclined portion of the board terminal to bond the component terminal and the board terminal.
Abstract translation: 电子部件设置有两个或更多个部件端子。 安装板配有两个或多个电路板端子。 板端子在基板端子的表面上设置有倾斜部分，倾斜部分朝向周边边缘的基端侧更宽。 组件端子的位置相对于相应的电路板端子的位置偏移。 另一部件端子的位置在相对于相应的电路板端子的位置的偏移方向的相反侧偏移。 元件端子与板端子的倾斜部分接触以将元件端子和板端子接合。
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2.发明授权公开(公告)号：US09439300B2
公开(公告)日：2016-09-06
申请号：US14157779
申请日：2014-01-17
Applicant: Yuichi Tanida
Inventor： Yuichi Tanida
CPC classification number: H05K3/3436 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/1134 , H01L2224/1184 , H01L2224/131 , H01L2224/13147 , H01L2224/14155 , H01L2224/16105 , H01L2224/16225 , H01L2224/16227 , H01L2224/81193 , H01L2224/81194 , H05K3/303 , H05K2201/10674 , H05K2203/048 , H05K2203/166 , Y02P70/613 , H01L2924/014 , H01L2924/00014
Abstract: An electronic component is provided with two or more component terminals. A mount board is provided with two or more board terminals. The board terminal is provided with an inclined portion on a surface of the board terminal, the inclined portion being the wider as closer to a base end side toward a peripheral edge. A position of the component terminal is offset in relation to a position of the corresponding board terminal. A position of the other component terminal is offset in the opposite side to the direction of the offset in relation to a position of the corresponding board terminal. The component terminal makes contact with the inclined portion of the board terminal to bond the component terminal and the board terminal.
Abstract translation: 电子部件设置有两个或更多个部件端子。 安装板配有两个或多个电路板端子。 板端子在基板端子的表面上设置有倾斜部分，倾斜部分朝向周边边缘更靠近基端侧。 组件端子的位置相对于相应的电路板端子的位置偏移。 另一部件端子的位置在相对于相应的电路板端子的位置的偏移方向的相反侧偏移。 元件端子与板端子的倾斜部分接触以将元件端子和板端子接合。
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