Light emitting diode and fabrication method thereof

    公开(公告)号:US10411163B2

    公开(公告)日:2019-09-10

    申请号:US16101198

    申请日:2018-08-10

    Abstract: A light-emitting diode includes a light-emitting epitaxial laminated layer and an omnidirectional reflector structure. The light-emitting epitaxial laminated layer has a first surface and an opposing second surface, including an n-type semi-conductive layer, a light emitting layer and a p-type semiconductor layer. The omnidirectional reflector structure is formed on the second surface of the light-emitting epitaxial laminated layer, including: a transparent dielectric layer on the second surface of the light-emitting epitaxial laminated layer and having conductive holes therein; a first transparent adhesive layer on one side surface of the transparent dielectric layer distal from the light-emitting epitaxial laminated layer and covering side walls of the conductive holes; a second transparent adhesive layer on one side surface of the first transparent adhesive layer distal from the transparent dielectric layer; and a metal reflective layer on one side of the second transparent adhesive layer distal from the first transparent adhesive layer.

    Light emitting diode and fabrication method thereof

    公开(公告)号:US10707381B2

    公开(公告)日:2020-07-07

    申请号:US16522634

    申请日:2019-07-25

    Abstract: A light-emitting diode includes a light-emitting epitaxial laminated layer having a first surface and a second, opposing, surface, including an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer; an omnidirectional reflector structure formed on the second surface of the light-emitting epitaxial laminated layer, including a transparent dielectric layer located on the second surface of the light-emitting epitaxial laminated layer and having conductive holes therein; a first transparent adhesive layer on one side surface of the transparent dielectric layer that is distal from the light-emitting epitaxial laminated layer; a second transparent adhesive layer on one side surface of the first transparent adhesive layer that is distal from the transparent dielectric layer; and a metal reflective layer on one side surface of the second transparent adhesive layer that is distal from the first transparent adhesive layer.

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