公开(公告)号：US10520469B2

公开(公告)日：2019-12-31

申请号：US16400322

申请日：2019-05-01

Applicant: Winbond Electronics Corp.

Inventor： Jia-Chyi Pan ,  Zi-Li Kuo ,  Yu-Ting Cheng ,  Yu-Min Fu

IPC: G01N27/32 ,  G01N27/416 ,  G01N27/30 ,  C23C22/68 ,  B05D7/00 ,  B05D5/12

Abstract: A printed flexible PH sensor is provided. The printed flexible PH sensor includes a flexible substrate. A working electrode is disposed on the flexible substrate, and the working electrode includes a first silver layer formed on the flexible substrate by an ink-jet printing process, a second silver layer formed on the first silver layer by a silver mirror reaction, and a metal oxide layer disposed on the second silver layer of an end portion of the working electrode. A reference electrode is disposed on the flexible substrate, and the reference electrode includes the first silver layer and the second silver layer formed on the first silver layer, and a silver chloride layer totally covering the second silver layer. A method for fabricating the printed flexible PH sensor is also provided.

公开(公告)号：US09412692B2

公开(公告)日：2016-08-09

申请号：US14596079

申请日：2015-01-13

Applicant: Winbond Electronics Corp.

Inventor： Yu-Ting Cheng ,  Yu-Min Fu

IPC: H01L29/15 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/4985 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/562 ,  H01L24/09 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/08225 ,  H01L2224/08238 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1415 ,  H01L2224/16227 ,  H01L2924/1511 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A flexible microsystem structure is provided. The flexible microsystem structure includes a flexible substrate; and a chip disposed over the flexible substrate, wherein the chip is bonded to the flexible substrate by a plurality of bonding elements disposed over the flexible substrate; wherein the flexible substrate has at least one trench disposed under the chip and disposed along at least one side of at least one of the bonding elements.

Abstract translation: 提供了灵活的微系统结构。 灵活的微系统结构包括柔性基板; 以及设置在所述柔性基板上的芯片，其中所述芯片通过设置在所述柔性基板上的多个接合元件接合到所述柔性基板; 其中所述柔性基底具有设置在所述芯片下方的至少一个沟槽，并且沿至少一个所述结合元件的至少一侧设置。

公开(公告)号：US10345258B2

公开(公告)日：2019-07-09

申请号：US15178037

申请日：2016-06-09

Applicant: Winbond Electronics Corp.

Inventor： Jia-Chyi Pan ,  Zi-Li Kuo ,  Yu-Ting Cheng ,  Yu-Min Fu

IPC: G01N27/00 ,  G01N27/416 ,  G01N27/30 ,  C23C22/68

Abstract: A printed flexible PH sensor is provided. The printed flexible PH sensor includes a flexible substrate. A working electrode is disposed on the flexible substrate, and the working electrode includes a first silver layer formed on the flexible substrate by an ink-jet printing process, a second silver layer formed on the first silver layer by a silver mirror reaction, and a metal oxide layer disposed on the second silver layer of an end portion of the working electrode. A reference electrode is disposed on the flexible substrate, and the reference electrode includes the first silver layer and the second silver layer formed on the first silver layer, and a silver chloride layer totally covering the second silver layer. A method for fabricating the printed flexible PH sensor is also provided.