-
公开(公告)号:US20170352560A1
公开(公告)日:2017-12-07
申请号:US15609371
申请日:2017-05-31
Applicant: Tokyo Electron Limited
Inventor: Takahiko Kato , Weiting Chen
IPC: H01L21/67 , C23C16/455 , H01L21/02 , H01J37/32 , H01L21/683 , H01L21/311
CPC classification number: H01L21/67069 , C23C16/45525 , H01J37/32082 , H01J37/32091 , H01J37/3244 , H01J37/32642 , H01J37/32724 , H01J37/32834 , H01J2237/334 , H01L21/02274 , H01L21/31116 , H01L21/67017 , H01L21/6833
Abstract: A substrate processing method includes a first process of supplying a first gas to a substrate; and a second process of supplying a second gas to the substrate after the first process. When a distance from an edge of the substrate to a boundary between a processing space and a gas exhaust space is L, a cross sectional area of a space orthogonal to a flow of the second gas is S(x), a supply flow rate of the second gas is Q, a pressure within the processing space is P and a diffusion coefficient of the first gas to the second gas is D, at least one of the distance L, the cross sectional area S(x) and the supply flow rate Q in the second process is adjusted such that a Peclet number Pe calculated by expression (3) becomes larger than 1. [ Expression 3 ] Pe = Q D · P ∫ 0 L 1 S ( x ) dx ( 3 )
-
公开(公告)号:US10373846B2
公开(公告)日:2019-08-06
申请号:US15609371
申请日:2017-05-31
Applicant: Tokyo Electron Limited
Inventor: Takahiko Kato , Weiting Chen
IPC: H01L21/67 , H01J37/32 , C23C16/455 , H01L21/02 , H01L21/311 , H01L21/683
Abstract: A substrate processing method includes a first process of supplying a first gas to a substrate; and a second process of supplying a second gas to the substrate after the first process. When a distance from an edge of the substrate to a boundary between a processing space and a gas exhaust space is L, a cross sectional area of a space orthogonal to a flow of the second gas is S(x), a supply flow rate of the second gas is Q, a pressure within the processing space is P and a diffusion coefficient of the first gas to the second gas is D, at least one of the distance L, the cross sectional area S(x) and the supply flow rate Q in the second process is adjusted such that a Peclet number Pe calculated by expression (3) becomes larger than 1. [ Expression 3 ] Pe = Q D · P ∫ 0 L 1 S ( x ) dx ( 3 )
-