公开(公告)号：US20180144934A1

公开(公告)日：2018-05-24

申请号：US15528871

申请日：2015-12-01

Applicant: The University of Chicago

Inventor： Dmitriy S. Dolzhnikov ,  Hao Zhang ,  Jaeyoung Jang ,  Jae Sung Son ,  Matthew G. Panthani ,  Dmitri V. Talapin

IPC: H01L21/02 ,  H01L29/66 ,  H01L29/267

CPC classification number: H01L21/02568 ,  C01B19/002 ,  C01B19/007 ,  C01P2002/84 ,  C01P2004/02 ,  C01P2004/03 ,  C01P2004/04 ,  C01P2006/40 ,  H01L21/02628 ,  H01L29/2203 ,  H01L29/267 ,  H01L29/66969 ,  H01L29/78681

Abstract: Chalcogenidometallates of group IIB, IV and V elements and, particularly, alkali metal-containing chalcogenidometallates of cadmium, lead and bismuth are provided. Also provided are methods of using the chalcogenidometallates as molecular solders to form metal chalcogenide structures, including thin films, molded objects and bonded surfaces composed of metal chalcogenides.

公开(公告)号：US10283357B2

公开(公告)日：2019-05-07

申请号：US15528871

申请日：2015-12-01

Applicant: The University of Chicago

Inventor： Dmitriy S. Dolzhnikov ,  Hao Zhang ,  Jaeyoung Jang ,  Jae Sung Son ,  Matthew G. Panthani ,  Dmitri V. Talapin

IPC: H01L21/02 ,  H01L29/66 ,  H01L29/267 ,  C01B19/00 ,  H01L29/786 ,  H01L29/22

Abstract: Chalcogenidometallates of group IIB, IV and V elements and, particularly, alkali metal-containing chalcogenidometallates of cadmium, lead and bismuth are provided. Also provided are methods of using the chalcogenidometallates as molecular solders to form metal chalcogenide structures, including thin films, molded objects and bonded surfaces composed of metal chalcogenides.