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公开(公告)号：US09362236B2
公开(公告)日：2016-06-07
申请号：US13788135
申请日：2013-03-07
Inventor： Hsien-Liang Meng , Wei-Hung Lin , Jimmy Liang , Ming-Che Ho , Hung-Jui Kuo , Chung-Shi Liu , Mirng-Ji Lii
IPC: H01L23/00 , H01L21/78 , H01L23/31 , H01L21/56 , H01L21/683 , H01L23/498 , H01L21/48 , H01L23/538 , H01L25/18
CPC classification number: H01L21/4857 , H01L21/486 , H01L21/561 , H01L21/563 , H01L21/568 , H01L21/6835 , H01L21/7806 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/5383 , H01L23/562 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/18 , H01L2221/68345 , H01L2224/13101 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13155 , H01L2224/13184 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81005 , H01L2224/81805 , H01L2224/92125 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/18161 , H01L2924/014 , H01L2924/00014 , H01L2924/0665 , H01L2924/0715 , H01L2924/00012 , H01L2924/00
Abstract: A packaging structure and a method of forming a packaging structure are provided. The packaging structure, such as an interposer, is formed by optionally bonding two carrier substrates together and simultaneously processing two carrier substrates. The processing includes forming a sacrificial layer over the carrier substrates. Openings are formed in the sacrificial layers and pillars are formed in the openings. Substrates are attached to the sacrificial layer. Redistribution lines may be formed on an opposing side of the substrates and vias may be formed to provide electrical contacts to the pillars. A debond process may be performed to separate the carrier substrates. Integrated circuit dies may be attached to one side of the redistribution lines and the sacrificial layer is removed.
Abstract translation: 提供一种包装结构和形成包装结构的方法。 通过任意地将两个载体衬底结合在一起并同时处理两个载体衬底来形成封装结构，例如插入件。 该处理包括在载体基底上形成牺牲层。 在牺牲层中形成开口，并且在开口中形成柱。 衬底附着在牺牲层上。 可以在基板的相对侧上形成再分布线，并且可以形成通孔以提供到柱的电接触。 可以执行脱粘工艺以分离载体基材。 集成电路管芯可以附接到再分配线的一侧，并且牺牲层被去除。
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公开(公告)号：US20140252594A1
公开(公告)日：2014-09-11
申请号：US13788135
申请日：2013-03-07
Inventor： Hsien-Liang Meng , Wei-Hung Lin , Jimmy Liang , Ming-Che Ho , Hung-Jui Kuo , Chung-Shi Liu , Mirng-Ji Lii
CPC classification number: H01L21/4857 , H01L21/486 , H01L21/561 , H01L21/563 , H01L21/568 , H01L21/6835 , H01L21/7806 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/5383 , H01L23/562 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/18 , H01L2221/68345 , H01L2224/13101 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13155 , H01L2224/13184 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81005 , H01L2224/81805 , H01L2224/92125 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/18161 , H01L2924/014 , H01L2924/00014 , H01L2924/0665 , H01L2924/0715 , H01L2924/00012 , H01L2924/00
Abstract: A packaging structure and a method of forming a packaging structure are provided. The packaging structure, such as an interposer, is formed by optionally bonding two carrier substrates together and simultaneously processing two carrier substrates. The processing includes forming a sacrificial layer over the carrier substrates. Openings are formed in the sacrificial layers and pillars are formed in the openings. Substrates are attached to the sacrificial layer. Redistribution lines may be formed on an opposing side of the substrates and vias may be formed to provide electrical contacts to the pillars. A debond process may be performed to separate the carrier substrates. Integrated circuit dies may be attached to one side of the redistribution lines and the sacrificial layer is removed.
Abstract translation: 提供一种包装结构和形成包装结构的方法。 通过任意地将两个载体衬底结合在一起并同时处理两个载体衬底来形成封装结构，例如插入件。 该处理包括在载体基底上形成牺牲层。 在牺牲层中形成开口，并且在开口中形成柱。 衬底附着在牺牲层上。 可以在基板的相对侧上形成再分布线，并且可以形成通孔以提供到柱的电接触。 可以执行脱粘工艺以分离载体基材。 集成电路管芯可以附接到再分配线的一侧，并且牺牲层被去除。
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公开(公告)号：US20160268145A1
公开(公告)日：2016-09-15
申请号：US15157752
申请日：2016-05-18
Inventor： Hsien-Liang Meng , Wei-Hung Lin , Jimmy Liang , Ming-Che Ho , Hung-Jui Kuo , Chung-Shi Liu , Mirng-Ji Lii
CPC classification number: H01L21/4857 , H01L21/486 , H01L21/561 , H01L21/563 , H01L21/568 , H01L21/6835 , H01L21/7806 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/5383 , H01L23/562 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/18 , H01L2221/68345 , H01L2224/13101 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13155 , H01L2224/13184 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81005 , H01L2224/81805 , H01L2224/92125 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/18161 , H01L2924/014 , H01L2924/00014 , H01L2924/0665 , H01L2924/0715 , H01L2924/00012 , H01L2924/00
Abstract: A packaging structure and a method of forming a packaging structure are provided. The packaging structure, such as an interposer, is formed by optionally bonding two carrier substrates together and simultaneously processing two carrier substrates. The processing includes forming a sacrificial layer over the carrier substrates. Openings are formed in the sacrificial layers and pillars are formed in the openings. Substrates are attached to the sacrificial layer. Redistribution lines may be formed on an opposing side of the substrates and vias may be formed to provide electrical contacts to the pillars. A debond process may be performed to separate the carrier substrates. Integrated circuit dies may be attached to one side of the redistribution lines and the sacrificial layer is removed.
Abstract translation: 提供一种包装结构和形成包装结构的方法。 通过任意地将两个载体衬底结合在一起并同时处理两个载体衬底来形成封装结构，例如插入件。 该处理包括在载体基底上形成牺牲层。 在牺牲层中形成开口，并且在开口中形成柱。 衬底附着在牺牲层上。 可以在基板的相对侧上形成再分布线，并且可以形成通孔以提供到柱的电接触。 可以执行脱粘工艺以分离载体基材。 集成电路管芯可以附接到再分配线的一侧，并且牺牲层被去除。
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