公开(公告)号：US10770327B2

公开(公告)日：2020-09-08

申请号：US15941568

申请日：2018-03-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Mu Lin ,  Chi-Hung Liao ,  Yi-Ming Dai ,  Yueh Lin Yang

IPC: H01L21/68 ,  H04N5/225 ,  G06T7/00 ,  H01L21/67

Abstract: A scanner includes a light source configured to apply a light to a backside of a wafer. The light is reflected from the backside of the wafer. A first mirror is configured to receive the light from the backside of the wafer and reflect the light. A sensor is configured to receive the light from the first mirror and generate an output signal indicative of a backside topography of the wafer.

公开(公告)号：US11367644B2

公开(公告)日：2022-06-21

申请号：US17014659

申请日：2020-09-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Mu Lin ,  Chi-Hung Liao ,  Yi-Ming Dai ,  Yueh Lin Yang

IPC: H01L21/68 ,  G06T7/00 ,  H01L21/67 ,  H04N5/225

Abstract: A scanner includes a light source configured to apply a light to a backside of a wafer. The light is reflected from the backside of the wafer. A first mirror is configured to receive the light from the backside of the wafer and reflect the light. A sensor is configured to receive the light from the first mirror and generate an output signal indicative of a backside topography of the wafer.

公开(公告)号：US20190035664A1

公开(公告)日：2019-01-31

申请号：US15941568

申请日：2018-03-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Mu Lin ,  Chi-Hung Liao ,  Yi-Ming Dai ,  Yueh Lin Yang

IPC: H01L21/68 ,  H04N5/225 ,  G06T7/00

Abstract: A scanner includes a light source configured to apply a light to a backside of a wafer. The light is reflected from the backside of the wafer. A first mirror is configured to receive the light from the backside of the wafer and reflect the light. A sensor is configured to receive the light from the first mirror and generate an output signal indicative of a backside topography of the wafer.