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公开(公告)号：US10403614B2
公开(公告)日：2019-09-03
申请号：US16379064
申请日：2019-04-09
Applicant: Syndiant Inc.
Inventor： Chun Chiu Daniel Wong , Hiap Liew Ong , Min Hwang Michael Lyu , Liming Wang
Abstract: A micro LED display module and a manufacturing method thereof are provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.
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公开(公告)号：US10403611B2
公开(公告)日：2019-09-03
申请号：US15996809
申请日：2018-06-04
Applicant: Syndiant Inc.
Inventor： Chun Chiu Daniel Wong , Hiap Liew Ong , Min Hwang Michael Lyu , Liming Wang
Abstract: A micro LED display module and a manufacturing method thereof are provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.
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3.发明申请公开(公告)号：US20180358340A1
公开(公告)日：2018-12-13
申请号：US15996785
申请日：2018-06-04
Applicant: Syndiant Inc.
Inventor： Chun Chiu Daniel Wong , Hiap Liew Ong , Min Hwang Michael Lyu , Liming Wang
CPC classification number: H01L25/167 , G09G3/32 , G09G2300/0408 , H01L27/156 , H01L33/0079 , H01L33/42 , H01L33/44 , H01L33/502 , H01L33/504 , H01L33/508 , H01L33/62 , H01L2933/0041 , H01L2933/0066 , H01L2933/0083
Abstract: A micro LED display module having a light transmissive substrate and a manufacturing method thereof are provided. The light transmissive substrate has good transmissivity with respect to the visible band. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to pixel electrodes and the other is electrically connected to the light transmissive substrate. The trenches define a plurality of micro LED pixels arranged in an array. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.
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公开(公告)号：US11031523B2
公开(公告)日：2021-06-08
申请号：US15997861
申请日：2018-06-05
Applicant: Syndiant Inc.
Inventor： Chun Chiu Daniel Wong , Hiap Liew Ong , Min Hwang Michael Lyu , Liming Wang
IPC: H01L25/00 , H01L25/18 , H01L33/00 , H01L33/36 , H01L33/24 , H01L33/22 , H01L27/15 , H01L25/075 , H01L25/16 , H01L33/62 , H01L33/42 , H01L33/44
Abstract: A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed on the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed on the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.
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公开(公告)号：US10403613B2
公开(公告)日：2019-09-03
申请号：US16379014
申请日：2019-04-09
Applicant: Syndiant Inc.
Inventor： Chun Chiu Daniel Wong , Hiap Liew Ong , Min Hwang Michael Lyu , Liming Wang
Abstract: A micro LED display module having a light transmissive substrate and a manufacturing method thereof are provided. The light transmissive substrate has good transmissivity with respect to the visible band. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to pixel electrodes and the other is electrically connected to the light transmissive substrate. The trenches define a plurality of micro LED pixels arranged in an array. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.
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Patent Agency Ranking
公开(公告)号：US20190237451A1
公开(公告)日：2019-08-01
申请号：US16379064
申请日：2019-04-09
Applicant: Syndiant Inc.
Inventor： Chun Chiu Daniel Wong , Hiap Liew Ong , Min Hwang Michael Lyu , Liming Wang
CPC classification number: H01L25/167 , H01L25/0753 , H01L27/156 , H01L33/0079 , H01L33/505 , H01L33/62 , H01L2933/0016 , H01L2933/0033 , H01L2933/0041 , H01L2933/0066 , H01L2933/0083
Abstract: A micro LED display module and a manufacturing method thereof are provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.
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公开(公告)号：US20180358343A1
公开(公告)日：2018-12-13
申请号：US15997844
申请日：2018-06-05
Applicant: Syndiant Inc.
Inventor： Chun Chiu Daniel Wong , Hiap Liew Ong , Min Hwang Michael Lyu , Liming Wang
CPC classification number: H01L25/18 , H01L25/50 , H01L27/156 , H01L33/0079 , H01L33/0095 , H01L33/12 , H01L33/42 , H01L33/58 , H01L33/62 , H01L2933/0016 , H01L2933/0058 , H01L2933/0066
Abstract: A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, and the color layer is disposed on the light transmissive conductive layer.
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公开(公告)号：US11031380B2
公开(公告)日：2021-06-08
申请号：US15997844
申请日：2018-06-05
Applicant: Syndiant Inc.
Inventor： Chun Chiu Daniel Wong , Hiap Liew Ong , Min Hwang Michael Lyu , Liming Wang
IPC: H01L25/00 , H01L25/18 , H01L27/15 , H01L33/00 , H01L25/16 , H01L33/62 , H01L33/58 , H01L33/42 , H01L33/12 , H01L33/50
Abstract: A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, and the color layer is disposed on the light transmissive conductive layer.
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公开(公告)号：US20180358341A1
公开(公告)日：2018-12-13
申请号：US15996809
申请日：2018-06-04
Applicant: Syndiant Inc.
Inventor： Chun Chiu Daniel Wong , Hiap Liew Ong , Min Hwang Michael Lyu , Liming Wang
IPC: H01L25/16 , H01L25/075 , H01L33/50 , H01L33/62
CPC classification number: H01L25/167 , H01L25/0753 , H01L27/156 , H01L33/0079 , H01L33/505 , H01L33/62 , H01L2933/0016 , H01L2933/0033 , H01L2933/0041 , H01L2933/0066 , H01L2933/0083
Abstract: A micro LED display module and a manufacturing method thereof are provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.
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公开(公告)号：US10403610B2
公开(公告)日：2019-09-03
申请号：US15996785
申请日：2018-06-04
Applicant: Syndiant Inc.
Inventor： Chun Chiu Daniel Wong , Hiap Liew Ong , Min Hwang Michael Lyu , Liming Wang
Abstract: A micro LED display module having a light transmissive substrate and a manufacturing method thereof are provided. The light transmissive substrate has good transmissivity with respect to the visible band. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to pixel electrodes and the other is electrically connected to the light transmissive substrate. The trenches define a plurality of micro LED pixels arranged in an array. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.
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