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    Solid-state imaging device and electronic device
    1.
    发明授权
    Solid-state imaging device and electronic device 有权

    公开(公告)号：US12218167B2

    公开(公告)日：2025-02-04

    申请号：US17281452

    申请日：2019-08-16

    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

    Inventor： Kentaro Akiyama ,  Junichiro Fujimagari

    IPC: H01L27/146

    Abstract: To provide a solid-state imaging device capable of further improving quality. Provided is a solid-state imaging device including: a first semiconductor element having a first semiconductor layer provided with a first through via and a photoelectric conversion unit configured to photoelectrically convert light that has been incident, a connection part that is wider than the first through via and is provided outside a region where the photoelectric conversion unit is provided on a surface of the first semiconductor layer on a side for receiving the light, connection wiring provided on the surface and configured to connect the first through via and the connection part, and a first passivation layer formed on the surface side; a second semiconductor element mounted on the first semiconductor element by the connection part; and a first guard ring formed on an outer peripheral portion of the first semiconductor element to surround the first semiconductor element. In the solid-state imaging device, at least a part of the first guard ring is arranged outside the first semiconductor layer and above a second semiconductor layer formed in substantially the same layer as the first semiconductor layer, and the first guard ring is arranged outside the first passivation layer and below a second passivation layer formed in substantially the same layer as the first passivation layer.

    Solid-state imaging apparatus
    2.
    发明授权
    Solid-state imaging apparatus 有权

    公开(公告)号：US11004884B2

    公开(公告)日：2021-05-11

    申请号：US16499911

    申请日：2018-03-09

    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

    Inventor： Takashi Machida ,  Kentaro Akiyama ,  Tomohiro Yamazaki

    IPC: H01L27/146 ,  G02B5/30

    Abstract: An imaging device includes one or more insulating layers on a substrate; an effective region including: a polarization layer in the one or more insulating layers and including one or more polarizers that polarize light; and at least one first photoelectric conversion region in the substrate and that converts incident light polarized by the one or more polarizers into electric charge; and a peripheral region outside the effective region and including: one or more wiring layers that include a pad portion in a same layer of the one or more insulating layers as the polarization layer.

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