公开(公告)号：US10403778B2

公开(公告)日：2019-09-03

申请号：US15250673

申请日：2016-08-29

Applicant: SolAero Technologies Corp.

Inventor： Daniel Derkacs ,  Jeff Steinfeldt

IPC: H01L31/0725 ,  H01L31/0304 ,  H01L31/05 ,  H01L31/18 ,  H01L31/0687

Abstract: A multijunction solar cell assembly and its method of manufacture including first and second discrete and different semiconductor body subassemblies which are electrically interconnected to form a five junction solar cell, each semiconductor body subassembly including first, second, third and fourth lattice matched subcells; wherein the average band gap of all four cells in each subassembly is greater than 1.44 eV.

公开(公告)号：US09691930B2

公开(公告)日：2017-06-27

申请号：US14934262

申请日：2015-11-06

Applicant: SolAero Technologies Corp.

Inventor： Mark A. Stan ,  Chelsea Mackos ,  Jeff Steinfeldt

IPC: H01L31/0687 ,  H01L31/18 ,  H01L31/078 ,  H01L31/048

CPC classification number: H01L31/06875 ,  H01L31/0481 ,  H01L31/078 ,  H01L31/1892 ,  Y02E10/544 ,  Y02P70/521

Abstract: The present disclosure provides a method of manufacturing a solar cell including: providing a first substrate and a second substrate; depositing on the first substrate a sequence of layers of semiconductor material forming a solar cell including a top subcell and a bottom subcell; forming a back metal contact over the bottom subcell; applying a conductive polyimide adhesive to the second substrate; attaching the second substrate on top of the back metal contact; and removing the first substrate to expose the surface of the top subcell.

公开(公告)号：US20170110615A1

公开(公告)日：2017-04-20

申请号：US15250673

申请日：2016-08-29

Applicant: SolAero Technologies Corp.

Inventor： Daniel Derkacs ,  Jeff Steinfeldt

IPC: H01L31/0725 ,  H01L31/18 ,  H01L31/05 ,  H01L31/0304

CPC classification number: H01L31/0725 ,  H01L31/03046 ,  H01L31/0504 ,  H01L31/0687 ,  H01L31/1844 ,  Y02E10/544 ,  Y02P70/521

Abstract: A multijunction solar cell assembly and its method of manufacture including first and second discrete and different semiconductor body subassemblies which are electrically interconnected to form a five junction solar cell, each semiconductor body subassembly including first, second, third and fourth lattice matched subcells; wherein the average band gap of all four cells in each subassembly is greater than 1.44 eV.

公开(公告)号：US20220393056A1

公开(公告)日：2022-12-08

申请号：US17820509

申请日：2022-08-17

Applicant: SOLAERO TECHNOLOGIES CORP.

Inventor： Arthur B. Cornfeld ,  Jeff Steinfeldt

IPC: H01L31/0725 ,  H01L31/18 ,  H01L31/0687 ,  H01L31/0304 ,  H01L31/048

Abstract: A method of manufacturing a solar cell that includes providing a semiconductor growth substrate; depositing on said growth substrate a sequence of layers of semiconductor material forming a solar cell; applying a metal contact layer over said sequence of layers; affixing the adhesive polyimide surface of a permanent supporting substrate directly over said metal contact layer and permanently bonding it thereto by a thermocompressive technique; and removing the semiconductor growth substrate.

公开(公告)号：US09768326B1

公开(公告)日：2017-09-19

申请号：US14940555

申请日：2015-11-13

Applicant: SolAero Technologies Corp.

Inventor： Mark A. Stan ,  Chelsea Mackos ,  Jeff Steinfeldt

IPC: H01L31/02 ,  H01L31/0725 ,  H01L31/048

CPC classification number: H01L31/02008 ,  H01L31/0392 ,  H01L31/048 ,  H01L31/06875 ,  H01L31/0725 ,  H01L31/078 ,  H01L31/1892 ,  Y02E10/544

Abstract: The present disclosure provides a method of manufacturing a solar cell comprising: providing a semiconductor growth substrate; depositing on said growth substrate a sequence of layers of semiconductor material forming a solar cell; applying a metal contact layer over said sequence of layers; and affixing the surface of a permanent supporting substrate composed of a carbon fiber reinforced polymer utilizing a conductive polyimide binding resin directly over said metal contact layer and permanently bonding it thereto by a thermocompressive technique.

公开(公告)号：US11387377B2

公开(公告)日：2022-07-12

申请号：US17031130

申请日：2020-09-24

Applicant: SolAero Technologies Corp.

Inventor： Daniel Derkacs ,  Jeff Steinfeldt

IPC: H01L31/0725 ,  H01L31/0687 ,  H01L31/0304 ,  H01L31/05 ,  H01L31/18

Abstract: A multijunction solar cell assembly and its method of manufacture including first and second discrete and different semiconductor solar cells which are electrically interconnected to form a four or five junction solar cell assembly.

公开(公告)号：US10008623B2

公开(公告)日：2018-06-26

申请号：US14674627

申请日：2015-03-31

Applicant: SolAero Technologies Corp.

Inventor： Arthur Cornfeld ,  Jeff Steinfeldt

IPC: H01L31/00 ,  H01L31/0725 ,  H01L31/18 ,  H01L31/0687 ,  H01L31/0304 ,  H01L31/048

CPC classification number: H01L31/0725 ,  H01L31/0304 ,  H01L31/03046 ,  H01L31/03048 ,  H01L31/048 ,  H01L31/06875 ,  H01L31/184 ,  H01L31/1844 ,  H01L31/1848 ,  H01L31/1856 ,  H01L31/1892 ,  Y02E10/544 ,  Y02P70/521

Abstract: The present disclosure provides a method of manufacturing a solar cell that includes providing a semiconductor growth substrate; depositing on said growth substrate a sequence of layers of semiconductor material forming a solar cell; applying a metal contact layer over said sequence of layers; affixing the adhesive polyimide surface of a permanent supporting substrate directly over said metal contact layer and permanently bonding it thereto by a thermocompressive technique; and removing the semiconductor growth substrate.

公开(公告)号：US20170170355A1

公开(公告)日：2017-06-15

申请号：US15442951

申请日：2017-02-27

Applicant: SolAero Technologies Corp.

Inventor： Mark Stan ,  Chelsea Mackos ,  Jeff Steinfeldt

IPC: H01L31/0725 ,  H01L31/0352 ,  H01L31/0735 ,  H01L31/0203 ,  H01L31/0224

CPC classification number: H01L31/0725 ,  H01L31/0203 ,  H01L31/022441 ,  H01L31/035272 ,  H01L31/0392 ,  H01L31/06875 ,  H01L31/0735 ,  H01L31/078 ,  H01L31/1892 ,  Y02E10/544

Abstract: A solar cell including a sequence of layers of semiconductor material forming a solar cell; a metal contact layer over said sequence of layers; a permanent supporting substrate composed of a carbon fiber reinforced polymer utilizing a conductive polyimide binding resin disposed directly over said metal contact layer and permanently bonding thereto.

公开(公告)号：US20150207013A1

公开(公告)日：2015-07-23

申请号：US14674627

申请日：2015-03-31

Applicant: SolAero Technologies Corp.

Inventor： Arthur Cornfeld ,  Jeff Steinfeldt

IPC: H01L31/0725 ,  H01L31/18 ,  H01L31/0304 ,  H01L31/048

CPC classification number: H01L31/0725 ,  H01L31/0304 ,  H01L31/03046 ,  H01L31/03048 ,  H01L31/048 ,  H01L31/06875 ,  H01L31/184 ,  H01L31/1844 ,  H01L31/1848 ,  H01L31/1856 ,  H01L31/1892 ,  Y02E10/544 ,  Y02P70/521

Abstract: The present disclosure provides a method of manufacturing a solar cell that includes providing a semiconductor growth substrate; depositing on said growth substrate a sequence of layers of semiconductor material forming a solar cell; applying a metal contact layer over said sequence of layers; affixing the adhesive polyimide surface of a permanent supporting substrate directly over said metal contact layer and permanently bonding it thereto by a thermocompressive technique; and removing the semiconductor growth substrate.

Abstract translation: 本公开提供一种制造太阳能电池的方法，其包括提供半导体生长衬底; 在所述生长衬底上沉积形成太阳能电池的半导体材料层序列; 在所述层序上施加金属接触层; 将永久性支撑衬底的粘合聚酰亚胺表面直接固定在所述金属接触层上并通过热压技术永久地将其粘合到其上; 并移除半导体生长衬底。

公开(公告)号：US20200335649A1

公开(公告)日：2020-10-22

申请号：US16897558

申请日：2020-06-10

Applicant: SolAero Technologies Corp.

Inventor： Arthur Cornfeld ,  Jeff Steinfeldt

IPC: H01L31/0725 ,  H01L31/18 ,  H01L31/0687 ,  H01L31/0304 ,  H01L31/048

Abstract: The present disclosure provides a method of manufacturing a solar cell that includes providing a semiconductor growth substrate; depositing on said growth substrate a sequence of layers of semiconductor material forming a solar cell; applying a metal contact layer over said sequence of layers; affixing the adhesive polyimide surface of a permanent supporting substrate directly over said metal contact layer and permanently bonding it thereto by a thermocompressive technique; and removing the semiconductor growth substrate.