公开(公告)号：US20240098864A1

公开(公告)日：2024-03-21

申请号：US18513376

申请日：2023-11-17

Applicant: Skyworks Solutions, Inc.

Inventor： George Khoury ,  Leslie Paul Wallis ,  Yasser Khairat Soliman

IPC: H05B47/19 ,  F21V23/00 ,  H01L23/552 ,  H01L23/66 ,  H03F1/22 ,  H03F1/32 ,  H03F1/34 ,  H03F1/56 ,  H03F3/195 ,  H03F3/24 ,  H04B1/04 ,  H04B1/40

CPC classification number: H05B47/19 ,  F21V23/006 ,  H01L23/552 ,  H01L23/66 ,  H03F1/223 ,  H03F1/32 ,  H03F1/3205 ,  H03F1/347 ,  H03F1/565 ,  H03F3/195 ,  H03F3/245 ,  H04B1/0475 ,  H04B1/40 ,  H04W84/12

Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such front end system includes a low noise amplifier in a receive path and a multi-mode power amplifier circuit in a transmit path. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.

公开(公告)号：US11682649B2

公开(公告)日：2023-06-20

申请号：US17240661

申请日：2021-04-26

Applicant: Skyworks Solutions, Inc.

Inventor： Gregory Edward Babcock ,  Lori Ann DeOrio ,  Darren Roger Frenette ,  George Khoury ,  Anthony James LoBianco ,  Hoang Mong Nguyen ,  Leslie Paul Wallis

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/66 ,  H04B1/40 ,  H01L25/18 ,  H01L23/498 ,  H01L23/13

CPC classification number: H01L24/73 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L25/18 ,  H04B1/40 ,  H01L23/13 ,  H01L23/49805 ,  H01L2223/6677 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.

公开(公告)号：US20210217714A1

公开(公告)日：2021-07-15

申请号：US17216302

申请日：2021-03-29

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Yasser Khairat Soliman ,  Hoang Mong Nguyen ,  Anthony James LoBianco ,  Gregory Edward Babcock ,  Darren Roger Frenette ,  George Khoury ,  René Rodríguez ,  Leslie Paul Wallis

IPC: H01L23/66 ,  H03F3/24 ,  H03F1/32 ,  H01L23/552 ,  H04B1/40 ,  H03F3/195 ,  H03F1/22 ,  H03F1/34 ,  H03F1/56 ,  H04B1/04 ,  H05B47/19 ,  F21V23/00

Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such packaged module includes a multi-mode power amplifier circuit in an interior of a radio frequency shielding structure and an antenna external to the radio frequency shielding structure. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. The radio frequency shielding structure can extend above a package substrate. The antenna can be on the package substrate. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.

公开(公告)号：US10362678B2

公开(公告)日：2019-07-23

申请号：US15489631

申请日：2017-04-17

Applicant: Skyworks Solutions, Inc.

Inventor： Darren Roger Frenette ,  George Khoury ,  Leslie Paul Wallis ,  Lori Ann DeOrio

IPC: H01L23/31 ,  H01L41/047 ,  H01L41/053 ,  H03B5/32 ,  H03H9/05 ,  H05K1/18 ,  H03F3/195 ,  H03F3/213 ,  H03H7/06 ,  H01L25/18 ,  H01L23/00 ,  H01L23/66 ,  H04B1/40 ,  H01L25/16 ,  H01L41/113 ,  H03H1/00

Abstract: A packaged module for use in a wireless communication device has a substrate supporting a crystal assembly and a first die that implements at least a portion of a radio frequency baseband subsystem. The crystal assembly, positioned between the first die and the substrate, includes a crystal, an input terminal configured to receive a first signal, an output terminal configured to output a second signal, a conductive pillar, and an enclosure configured to enclose the crystal, where the conductive pillar is formed at least partially within a side of the enclosure and extends from a top surface to a bottom surface of the enclosure. The conductive pillar conducts a third signal distinct from the first and second signals.

公开(公告)号：US20190214354A1

公开(公告)日：2019-07-11

申请号：US16354923

申请日：2019-03-15

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Yasser Khairat Soliman ,  Leslie Paul Wallis

IPC: H01L23/66 ,  H03F3/24 ,  H04B1/04 ,  H03F1/32 ,  H03F1/22 ,  H03F3/195 ,  H03F1/34 ,  H03F1/56 ,  H01L23/552 ,  H04B1/40

CPC classification number: H01L23/66 ,  F21V23/006 ,  H01L23/552 ,  H01L2223/665 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/19104 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q9/42 ,  H03F1/223 ,  H03F1/32 ,  H03F1/3205 ,  H03F1/347 ,  H03F1/565 ,  H03F3/195 ,  H03F3/245 ,  H03F2200/222 ,  H03F2200/294 ,  H03F2200/451 ,  H03F2200/534 ,  H04B1/0475 ,  H04B1/40 ,  H04B2001/0433 ,  H04W84/12 ,  H05B37/0272 ,  H01L2924/00014

Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such front end system includes a low noise amplifier in a receive path and a power amplifier in a transmit path. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The power amplifier includes an injection-locked oscillator driver stage. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.

公开(公告)号：US10276521B2

公开(公告)日：2019-04-30

申请号：US15857217

申请日：2017-12-28

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Gregory Edward Babcock ,  Lori Ann DeOrio ,  Darren Roger Frenette ,  George Khoury ,  Anthony James LoBianco ,  Hoang Mong Nguyen ,  Yasser Khairat Soliman ,  Leslie Paul Wallis ,  René Rodríguez

IPC: H01L23/66 ,  H03F3/24 ,  H03F1/32 ,  H01L23/552 ,  H04B1/40 ,  H03F3/195 ,  F21V23/00 ,  H05B37/02 ,  H03F1/22 ,  H03F1/34 ,  H03F1/56 ,  H04W84/12 ,  H01Q1/38 ,  H01Q1/22 ,  H01Q9/42

Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such front end system includes a low noise amplifier in a receive path and a multi-mode power amplifier circuit in a transmit path. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.

公开(公告)号：US20180261566A1

公开(公告)日：2018-09-13

申请号：US15916571

申请日：2018-03-09

Applicant: Skyworks Solutions, Inc.

Inventor： Gregory Edward Babcock ,  Lori Ann DeOrio ,  Darren Roger Frenette ,  George Khoury ,  Anthony James LoBianco ,  Hoang Mong Nguyen ,  Leslie Paul Wallis

IPC: H01L23/00 ,  H01L23/66 ,  H01L23/552 ,  H04B1/40 ,  H01L25/18

Abstract: Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.

公开(公告)号：US20180255643A1

公开(公告)日：2018-09-06

申请号：US15889491

申请日：2018-02-06

Applicant: Skyworks Solutions, Inc.

Inventor： Darren Roger Frenette ,  George Khoury ,  Leslie Paul Wallis ,  Lori Ann DeOrio

IPC: H05K1/18 ,  H03F3/195 ,  H03H7/06 ,  H01L25/18 ,  H01L23/31 ,  H01L23/00 ,  H01L23/66 ,  H04B1/40 ,  H03F3/213

CPC classification number: H05K1/181 ,  H01L23/3107 ,  H01L23/66 ,  H01L24/16 ,  H01L24/48 ,  H01L25/16 ,  H01L25/18 ,  H01L41/0475 ,  H01L41/113 ,  H01L2223/6644 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48195 ,  H01L2224/48225 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/146 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19107 ,  H03B5/32 ,  H03F3/195 ,  H03F3/213 ,  H03F2200/451 ,  H03H7/06 ,  H03H9/0547 ,  H03H2001/0021 ,  H04B1/40 ,  H05K2201/1006 ,  H05K2201/10098 ,  H05K2201/10674 ,  H01L2224/45099

Abstract: A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.

公开(公告)号：US20180026592A1

公开(公告)日：2018-01-25

申请号：US15654050

申请日：2017-07-19

Applicant: Skyworks Solutions, Inc.

Inventor： Leslie Paul Wallis

IPC: H03F3/195 ,  H04B1/00 ,  H01L23/66 ,  H04B1/16 ,  H03F1/56

CPC classification number: H03F3/195 ,  H01L23/5227 ,  H01L23/60 ,  H01L23/66 ,  H01L2223/6611 ,  H01L2223/6655 ,  H01L2224/04042 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H03F1/223 ,  H03F1/347 ,  H03F1/523 ,  H03F1/565 ,  H03F2200/294 ,  H03F2200/426 ,  H04B1/005 ,  H04B1/1607 ,  H01L2924/00014

Abstract: Aspects of this disclosure relate to an impedance transformation circuit and overload protection for a low noise amplifier. A low noise amplifier can include a first inductor, an amplification circuit configured to amplify a radio frequency signal, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. A switch can be coupled to the amplification circuit of the low noise amplifier. An overload protection circuit can adjust an impedance of the switch based on a signal level associated with the radio frequency signal to provide overload protection for the low noise amplifier.

公开(公告)号：US20250159787A1

公开(公告)日：2025-05-15

申请号：US19025936

申请日：2025-01-16

Applicant: Skyworks Solutions, Inc.

Inventor： Darren Roger Frenette ,  George Khoury ,  Leslie Paul Wallis ,  Lori Ann DeOrio ,  Yasser Khairat Soliman

IPC: H05B47/19 ,  F21V23/00 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q9/42 ,  H03F1/22 ,  H03F1/32 ,  H03F1/34 ,  H03F1/56 ,  H03F3/195 ,  H03F3/24 ,  H04B1/04 ,  H04B1/40 ,  H04W84/12

Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such front end system includes a low noise amplifier in a receive path and a multi-mode power amplifier circuit in a transmit path. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.