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公开(公告)号:US10937770B2
公开(公告)日:2021-03-02
申请号:US16248820
申请日:2019-01-16
Applicant: Stanley Electric Co., Ltd.
Inventor: Mitsunori Harada , Kaori Tachibana , Satoshi Ando
Abstract: A light-emitting device having light-emitting elements with high operation stability and light extraction efficiency is provided. The light-emitting device includes: a substrate; light-emitting elements aligned and arranged on the substrate in an arrangement direction; wavelength conversion layers each disposed on each of the light-emitting elements with a light-transmitting adhesive interposed therebetween, each of the wavelength conversion layers having an upper surface smaller than a bottom surface, and a side surface shape in which a length in a lateral direction parallel to the bottom surface and perpendicular to the arrangement direction decreases from the bottom surface toward the upper surface; a light-transmitting plate disposed over the wavelength conversion layers; and a reflective resin covering side surfaces of the light-emitting elements, the wavelength conversion layers, and the light-transmitting plate. A side surface of the wavelength conversion layer facing to another adjacent wavelength conversion layer extends in a direction perpendicular to the substrate.
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公开(公告)号:US11545473B2
公开(公告)日:2023-01-03
申请号:US17207481
申请日:2021-03-19
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor: Kyotaro Koike , Ji-Hao Liang , Mitsunori Harada , Shunya Ide , Hiroshi Kotani , Soji Owada , Satoshi Ando
IPC: H01L25/075 , H01L33/54 , H01L33/60 , H01L33/50
Abstract: A light-emitting device according to the present invention comprises: a mounting board; a plurality of light-emitting elements that each include a supporting substrate and a semiconductor structure layer, the supporting substrate being disposed on the mounting board, and the semiconductor structure layer being formed on the supporting substrate and including a light-emitting layer, a wavelength conversion member that covers the plurality of light-emitting elements above the light-emitting elements and converts a wavelength of a light emitted from the light-emitting layer; a translucent member that covers a lower surface of the wavelength conversion member and covers the semiconductor structure layer on the supporting substrate; and a resin member filled between the plurality of light-emitting elements, the resin member being formed of a resin material containing particles having a light reflectivity. The translucent member includes a thin film portion having a constant film thickness between the wavelength conversion member and the resin member in a region between the plurality of light-emitting elements, and the constant film thickness is smaller than a distance between a top surface of the supporting substrate and a lower surface of the wavelength conversion member.
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3.
公开(公告)号:US20190312187A1
公开(公告)日:2019-10-10
申请号:US16373317
申请日:2019-04-02
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor: Mitsunori Harada , Kaori Tachibana , Satoshi Ando
IPC: H01L33/60 , H01L25/075
Abstract: A semiconductor light-emitting apparatus is constructed by a wiring substrate, at least one semiconductor light-emitting element provided on the wiring substrate, at least one wavelength-converting member provided on the semiconductor light-emitting element, and a light reflection adjusting member directly covering a sidewall of the semiconductor light-emitting element and a sidewall of the wavelength-converting member. The light reflection adjusting member is formed of gray resin including light reflecting fillers and light absorbing fillers for visible light.
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公开(公告)号:US12224383B2
公开(公告)日:2025-02-11
申请号:US17675668
申请日:2022-02-18
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor: Satoshi Ando , Ji-Hao Liang
Abstract: A light-emitting device includes a substrate, a frame body, a light-emitting element, a wavelength converter, and a light reflecting portion. The light-emitting element includes a semiconductor light-emitting layer on a support substrate. The wavelength converter is disposed on an upper surface of the light-emitting element. The light reflecting portion covers side surfaces of the light-emitting element and the wavelength converter and is formed of a translucent resin containing light reflective particulate fillers. The light reflecting portion includes a first region extending along an upper surface of the light reflecting portion, a second region that is disposed under the first region and has a content rate of the particulate fillers lower than a content rate of the first region, and a third region that is disposed under the second region and has a content rate of the particulate fillers lower than the content rate of the second region.
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公开(公告)号:US10825972B2
公开(公告)日:2020-11-03
申请号:US16373317
申请日:2019-04-02
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor: Mitsunori Harada , Kaori Tachibana , Satoshi Ando
IPC: H01L33/60 , H01L25/075 , H01L33/50
Abstract: A semiconductor light-emitting apparatus is constructed by a wiring substrate, at least one semiconductor light-emitting element provided on the wiring substrate, at least one wavelength-converting member provided on the semiconductor light-emitting element, and a light reflection adjusting member directly covering a sidewall of the semiconductor light-emitting element and a sidewall of the wavelength-converting member. The light reflection adjusting member is formed of gray resin including light reflecting fillers and light absorbing fillers for visible light.
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