公开(公告)号：US20140329336A1

公开(公告)日：2014-11-06

申请号：US14358639

申请日：2012-11-16

Applicant: Sony Corporation

Inventor： Yusuke Moriya ,  Nobuyuki Matsuzawa ,  Kensaku Maeda

IPC: G01N21/55

CPC classification number: G01N21/553 ,  G01J3/4406 ,  G01N21/6454 ,  G01N2021/6471

Abstract: [Object] To provide a chemical sensor provided with a spectral filter excellent in spectral characteristic, a chemical sensor module, a chemical substance detection apparatus, and a chemical substance detection method.[Solving Means] A chemical sensor according to the present technology is provided with a substrate and a plasmon absorption layer. On the substrate, the photodetection unit is formed. The plasmon absorption layer is laminated on the substrate and has a metal nanostructure that generates plasmon absorbency.

Abstract translation: 本发明提供一种具有光谱特性优异的光谱滤波器，化学传感器模块，化学物质检测装置和化学物质检测方法的化学传感器。 [解决方案]根据本技术的化学传感器具有基板和等离子体激元吸收层。 在基板上形成光检测单元。 等离子体激元吸收层层压在基底上并具有产生等离子体激元吸收性的金属纳米结构。

公开(公告)号：US11594563B2

公开(公告)日：2023-02-28

申请号：US17144947

申请日：2021-01-08

Applicant: SONY CORPORATION

Inventor： Atsushi Yamamoto ,  Shinji Miyazawa ,  Yutaka Ooka ,  Kensaku Maeda ,  Yusuke Moriya ,  Naoki Ogawa ,  Nobutoshi Fujii ,  Shunsuke Furuse ,  Masaya Nagata ,  Yuichi Yamamoto

IPC: H01L27/146 ,  H01L31/0203

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip.
Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

公开(公告)号：US10608028B2

公开(公告)日：2020-03-31

申请号：US16045973

申请日：2018-07-26

Applicant: SONY CORPORATION

Inventor： Atsushi Yamamoto ,  Shinji Miyazawa ,  Yutaka Ooka ,  Kensaku Maeda ,  Yusuke Moriya ,  Naoki Ogawa ,  Nobutoshi Fujii ,  Shunsuke Furuse ,  Masaya Nagata ,  Yuichi Yamamoto

IPC: H01L27/00 ,  H01L31/00 ,  H01L27/146 ,  H01L31/0203

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip.Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

公开(公告)号：US10475837B2

公开(公告)日：2019-11-12

申请号：US15579261

申请日：2016-06-09

Applicant: SONY CORPORATION

Inventor： Yusuke Moriya ,  Kunihiko Hikichi ,  Hiroyuki Itou ,  Atsushi Yamamoto ,  Masahiko Shimizu

IPC: H01L27/146 ,  H04N5/369 ,  H04N5/225 ,  H01L31/0232 ,  G02B3/00 ,  G02B5/00

Abstract: An electronic device has a mounted image sensor including a light shielding body having light shielding walls and light transmitting portions each formed in an opening between the light shielding walls, a first light-shielding layer formed on a light incident surface side of the light shielding body and having an opening narrower than the opening of the light shielding body for each of the openings of the light shielding body, a microlens provided for each of the openings of the first light-shielding layer on the light incident surface side of the light shielding body, and a light receiving element layer with an array of a large number of light receiving elements. The present disclosure can be used for, for example, a compound-eye optical system.

公开(公告)号：US20140210032A1

公开(公告)日：2014-07-31

申请号：US14228648

申请日：2014-03-28

Applicant: Sony Corporation

Inventor： Kensaku Maeda ,  Hiroyasu Matsugai ,  Yusuke Moriya

IPC: H01L27/146

CPC classification number: H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14685 ,  H01L31/02327

Abstract: The present invention relates to a solid-state imaging device having good focusing properties, a method for manufacturing such a solid-state imaging device, and an electronic apparatus. The solid-state imaging device has a semiconductor substrate 11 and a photoelectric conversion part formed in the semiconductor substrate 11. In the solid-state imaging device, a laminate including an organic material layer and an inorganic material layer is formed on the semiconductor substrate with at least one stress relaxation layer 22 interposed between the organic and inorganic material layers. This technology is applicable to, for example, solid-state imaging devices having pixels and microlenses placed thereon.

Abstract translation: 本发明涉及具有良好聚焦性质的固态成像装置，这种固态成像装置的制造方法以及电子装置。 固态成像装置具有形成在半导体基板11中的半导体基板11和光电转换部。在固态成像装置中，在半导体基板上形成有机材料层和无机材料层的层叠体， 插入有机层和无机材料层之间的至少一个应力松弛层22。 该技术适用于例如具有放置在其上的像素和微透镜的固态成像装置。

公开(公告)号：US10332924B2

公开(公告)日：2019-06-25

申请号：US15910274

申请日：2018-03-02

Applicant: SONY CORPORATION

Inventor： Takaaki Hirano ,  Shinji Miyazawa ,  Kensaku Maeda ,  Yusuke Moriya ,  Shunsuke Furuse ,  Yutaka Ooka

IPC: H04N5/374 ,  H01L27/146

Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.

公开(公告)号：US10038021B2

公开(公告)日：2018-07-31

申请号：US15476629

申请日：2017-03-31

Applicant: SONY CORPORATION

Inventor： Atsushi Yamamoto ,  Shinji Miyazawa ,  Yutaka Ooka ,  Kensaku Maeda ,  Yusuke Moriya ,  Naoki Ogawa ,  Nobutoshi Fujii ,  Shunsuke Furuse ,  Masaya Nagata ,  Yuichi Yamamoto

IPC: H01L27/00 ,  H01L27/146 ,  H01L31/0203

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip.Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

公开(公告)号：US09991301B2

公开(公告)日：2018-06-05

申请号：US15111003

申请日：2015-01-26

Applicant: SONY CORPORATION

Inventor： Atsushi Yamamoto ,  Shinji Miyazawa ,  Yutaka Ooka ,  Kensaku Maeda ,  Yusuke Moriya ,  Naoki Ogawa ,  Nobutoshi Fujii ,  Shunsuke Furuse ,  Masaya Nagata ,  Yuichi Yamamoto

IPC: H01L27/00 ,  H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/0203 ,  H01L2224/11

Abstract: The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.

公开(公告)号：US09670532B2

公开(公告)日：2017-06-06

申请号：US14348988

申请日：2012-10-11

Applicant: Sony Corporation

Inventor： Nobuyuki Matsuzawa ,  Kensaku Maeda ,  Yusuke Moriya ,  Ken Ozawa

IPC: C12Q1/68 ,  G01N21/64 ,  G01N33/543 ,  G01N33/58

CPC classification number: C12Q1/6834 ,  G01N21/6454 ,  G01N33/54373 ,  G01N33/582

Abstract: A chemical sensor including a substrate, an on-chip lens layer, and a flattening layer. On the substrate, a plurality of photodiodes are formed and arranged in a planar form. The on-chip lens layer collects incident light to the photodiodes and is provided on the substrate. The flattening layer covers and planarizes the on-chip lens to form a probe holding surface for holding a probe material.

公开(公告)号：US11037975B2

公开(公告)日：2021-06-15

申请号：US16389052

申请日：2019-04-19

Applicant: SONY CORPORATION

Inventor： Takaaki Hirano ,  Shinji Miyazawa ,  Kensaku Maeda ,  Yusuke Moriya ,  Shunsuke Furuse ,  Yutaka Ooka

IPC: H01L27/146 ,  H04N5/374

Abstract: Provided is a semiconductor device including: a multilayer substrate including an optical element; a light-transmitting plate provided on the substrate to cover the optical element; and a lens of an inorganic material provided between the substrate and the light-transmitting plate. A structure having a same strength as a strength per unit area of the lens is provided at a portion outside an effective photosensitive region where the optical element is formed, when the substrate is viewed in plan.