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    Camera module, method of manufacturing camera module, imaging apparatus, and electronic apparatus
    1.
    发明授权
    Camera module, method of manufacturing camera module, imaging apparatus, and electronic apparatus 有权

    公开(公告)号：US11595551B2

    公开(公告)日：2023-02-28

    申请号：US16923914

    申请日：2020-07-08

    Applicant: SONY CORPORATION

    Inventor： Toshiaki Iwafuchi

    IPC: H04N5/225 ,  H04N5/374 ,  G03B11/00 ,  H01L27/146 ,  G03B17/02 ,  H04N5/357 ,  H04N5/369

    Abstract: The present disclosure relates to a camera module capable of achieving a smaller height, a method of manufacturing a camera module, an imaging apparatus, and an electronic apparatus. An imaging device having its imaging surface bonded to a provisional substrate is attached, and the imaging device in that state is joined to a substrate via an electrode having a TSV structure. After the provisional substrate is detached, an IR cut filter (IRCF) on which a light blocking film is printed or jet-dispensed in a region other than the effective pixel region is bonded to the imaging surface via a transparent resin. Because of this, there is no need to provide any sealing glass in the stage before the imaging surface, and the optical length of the lens can be shortened. Thus, a smaller height can be achieved. The present disclosure can be applied to camera modules.

    Camera module, method of manufacturing camera module, imaging apparatus, and electronic apparatus
    2.
    发明授权
    Camera module, method of manufacturing camera module, imaging apparatus, and electronic apparatus 有权

    公开(公告)号：US10750060B2

    公开(公告)日：2020-08-18

    申请号：US16086495

    申请日：2017-03-17

    Applicant: SONY CORPORATION

    Inventor： Toshiaki Iwafuchi

    IPC: H04N5/225 ,  H04N5/374 ,  G03B11/00 ,  H01L27/146 ,  G03B17/02 ,  H04N5/357

    Abstract: The present disclosure relates to a camera module capable of achieving a smaller height, a method of manufacturing a camera module, an imaging apparatus, and an electronic apparatus. An imaging device having its imaging surface bonded to a provisional substrate is attached, and the imaging device in that state is joined to a substrate via an electrode having a TSV structure. After the provisional substrate is detached, an IR cut filter (IRCF) on which a light blocking film is printed or jet-dispensed in a region other than the effective pixel region is bonded to the imaging surface via a transparent resin. Because of this, there is no need to provide any sealing glass in the stage before the imaging surface, and the optical length of the lens can be shortened. Thus, a smaller height can be achieved. The present disclosure can be applied to camera modules.

    Solid-state imaging apparatus
    3.
    发明授权
    Solid-state imaging apparatus 有权

    公开(公告)号：US10128290B2

    公开(公告)日：2018-11-13

    申请号：US15961250

    申请日：2018-04-24

    Applicant: Sony Corporation

    Inventor： Toshiaki Iwafuchi ,  Masahiko Shimizu ,  Hirotaka Kobayashi

    IPC: H01L31/14 ,  G02B27/00 ,  H01L27/146 ,  G02B5/20

    Abstract: A solid-state imaging apparatus includes: a solid-state imaging device photoelectrically converting light taken by a lens; and a light shielding member shielding part of light incident on the solid-state imaging device from the lens, wherein an angle made between an edge surface of the light shielding member and an optical axis direction of the lens is larger than an incident angle of light to be incident on an edge portion of the light shielding member.

    Solid state image pickup device and production method, semiconductor wafer, and electronic apparatus
    6.
    发明授权
    Solid state image pickup device and production method, semiconductor wafer, and electronic apparatus 有权

    公开(公告)号：US10991743B2

    公开(公告)日：2021-04-27

    申请号：US15554637

    申请日：2016-02-26

    Applicant: SONY CORPORATION

    Inventor： Toshiaki Iwafuchi

    IPC: H01L27/146 ,  H01L23/544 ,  H01L23/532 ,  H01L23/58 ,  H04N5/369 ,  H04N5/374 ,  H01L21/66

    Abstract: The present technology relates to a solid state image pickup device and a production method, a semiconductor wafer, and an electronic apparatus by which the yield can be improved. On a semiconductor wafer, a chip region in which pixels and so forth that configure a solid state image pickup device are formed and a scribe region are formed. In the scribe region, a measuring region in which an inspection circuit for measuring a property of the chip region and measurement pads are formed and a dicing line to be cut upon fragmentation of the semiconductor wafer are provided. The measuring region is positioned between the dicing line and the chip region. The present technology can be applied to a solid state image pickup device.

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