公开(公告)号：US11569192B2

公开(公告)日：2023-01-31

申请号：US16615816

申请日：2018-05-24

Applicant: SHINKAWA LTD. ,  TOHOKU UNIVERSITY

Inventor： Yuji Eguchi ,  Kohei Seyama ,  Tomonori Nakamura ,  Hiroshi Kikuchi ,  Takehito Shimatsu ,  Miyuki Uomoto

IPC: H01L23/00

Abstract: This method for producing a structure wherein base materials are bonded by atomic diffusion comprises: a step for applying a liquid resin on the base material; a step for smoothing the surface of the liquid resin by surface tension; a step for forming a resin layer by curing; a step for forming a metal thin film on the resin layer; a step for forming a metal thin film on the base material; and a step for bringing the metal thin film of the base material and the metal thin film of the base material into close contact with each other, thereby bonding the metal thin film of the resin layer and the metal thin film of the base material with each other by atomic diffusion.

公开(公告)号：US11749541B2

公开(公告)日：2023-09-05

申请号：US17602279

申请日：2020-04-07

Applicant: SHINKAWA LTD.

Inventor： Shigeyuki Sekiguchi ,  Yuji Eguchi ,  Kohei Seyama

IPC: H01L21/67 ,  H05K13/04 ,  H01L23/00 ,  H01L21/683

CPC classification number: H01L21/67144 ,  H01L21/67132 ,  H01L24/75 ,  H05K13/0419 ,  H01L21/6838 ,  H01L2224/7565 ,  H05K13/0409

Abstract: This bonding apparatus is provided with: a tape feeder module which takes out an electronic component from a carrier tape and transfers the electronic component thus taken out; a die supply module which has a die pick-up mechanism for picking up a semiconductor die from a semiconductor wafer bonded to a dicing sheet by pushing up the semiconductor die and which transfers the semiconductor die thus picked up; and a bonding module which arranges, on a circuit substrate, the semiconductor die supplied by the die supply module and/or the electronic component supplied by the tape feeder module.

公开(公告)号：US11508688B2

公开(公告)日：2022-11-22

申请号：US16087087

申请日：2017-03-24

Applicant: SHINKAWA LTD.

Inventor： Kohei Seyama ,  Yuji Eguchi ,  Shoji Wada

IPC: H01L23/00 ,  H01L21/52 ,  H01L25/065 ,  H01L25/10

Abstract: The present invention has: a heater; and a bonding tool having a lower surface on which a memory chip is adsorbed; and an upper surface attached to the heater, and is provided with a bonding tool which presses the peripheral edge of the memory chip to a solder ball in a first peripheral area of the lower surface and which presses the center of the memory chip (60) to a DAF having a heat resistance temperature lower than that of the solder ball in a first center area. The amount of heat transmitted from the first center area to the center of the memory chip is smaller than that transmitted from the first peripheral area (A) to the peripheral edge of the memory chip. Thus, the bonding apparatus in which the center of a bonding member can be heated to a temperature lower than that at the peripheral edge can be provided.