公开(公告)号：US10553677B2

公开(公告)日：2020-02-04

申请号：US16035170

申请日：2018-07-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeon-sook Kim ,  In-ji Lee ,  Doek-gil Ko ,  Woo-seung Jung

IPC: H01L23/58 ,  H01L29/06

Abstract: A semiconductor wafer is provided. The semiconductor wafer includes a wafer body including a first surface and a second surface opposite the first surface; and a bevel portion disposed along an outer circumference of the wafer body and including an inclined surface, an outermost point, a first surface end portion connecting the bevel portion to the first surface and a second surface end portion connecting the bevel portion to the second surface. A first bevel angle between a first tangential direction of the inclined surface and the first surface corresponds to a capillary force of a fluid on the first surface, and a first bevel length between the first surface end portion and the outermost point along a first direction substantially parallel to the first surface corresponds to a first surface flatness.

公开(公告)号：US20200043728A1

公开(公告)日：2020-02-06

申请号：US16292566

申请日：2019-03-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In-ji Lee ,  Doek-gil Ko ,  Yeon-sook Kim

IPC: H01L21/02 ,  H01L29/78 ,  H01L29/04 ,  H01L29/66

Abstract: A semiconductor substrate includes a main surface inclined by a first off-angle greater than 0° from a first direction parallel to a crystal plane, with respect to the crystal plane, in a first radial direction of the main surface, and a notch disposed toward the first direction, at an edge of the main surface in the first radial direction.