公开(公告)号：US10470295B2

公开(公告)日：2019-11-05

申请号：US15912907

申请日：2018-03-06

Applicant: Rohm Co., Ltd.

Inventor： Shingo Hashiguchi ,  Shoichi Harada

IPC: H05K1/02 ,  H03K17/16 ,  G05F1/10 ,  H01L27/02

Abstract: A printed circuit board has: a first wiring pattern laid in a first layer such that, when a predetermined component is mounted in a predetermined mounting region, a first current path in an open ring shape leading from a first end to a second end is formed; a second wiring pattern laid in a second layer different from the first layer such that a second current path in an open ring shape leading from a third end to a fourth end is formed; a first conductive member formed between the second and third ends; and a second conductive member formed between the first and fourth ends. The first and second wiring patterns are so laid that, as seen in their respective plan views, the directions of the currents flowing across the first and second current paths, respectively, are opposite to each other.

公开(公告)号：US10980109B2

公开(公告)日：2021-04-13

申请号：US16855068

申请日：2020-04-22

Applicant: Rohm Co., Ltd.

Inventor： Shingo Hashiguchi ,  Shoichi Harada

IPC: H05K1/02 ,  H03K17/16 ,  G05F1/10 ,  H01L27/02

Abstract: A printed circuit board has: a first wiring pattern laid in a first layer such that, when a predetermined component is mounted in a predetermined mounting region, a first current path in an open ring shape leading from a first end to a second end is formed; a second wiring pattern laid in a second layer different from the first layer such that a second current path in an open ring shape leading from a third end to a fourth end is formed; a first conductive member formed between the second and third ends; and a second conductive member formed between the first and fourth ends. The first and second wiring patterns are so laid that, as seen in their respective plan views, the directions of the currents flowing across the first and second current paths, respectively, are opposite to each other.

公开(公告)号：US10667383B2

公开(公告)日：2020-05-26

申请号：US16581098

申请日：2019-09-24

Applicant: Rohm Co., Ltd.

Inventor： Shingo Hashiguchi ,  Shoichi Harada

IPC: H05K1/02 ,  H01L27/02 ,  H03K17/16 ,  G05F1/10

Abstract: A printed circuit board has: a first wiring pattern laid in a first layer such that, when a predetermined component is mounted in a predetermined mounting region, a first current path in an open ring shape leading from a first end to a second end is formed; a second wiring pattern laid in a second layer different from the first layer such that a second current path in an open ring shape leading from a third end to a fourth end is formed; a first conductive member formed between the second and third ends; and a second conductive member formed between the first and fourth ends. The first and second wiring patterns are so laid that, as seen in their respective plan views, the directions of the currents flowing across the first and second current paths, respectively, are opposite to each other.