公开(公告)号：US10431532B2

公开(公告)日：2019-10-01

申请号：US14708962

申请日：2015-05-11

Applicant: ROHM CO., LTD.

Inventor： Kota Ise

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor device is provided with a semiconductor element, a main lead on which the semiconductor element is disposed, and a resin package that covers the semiconductor element and the main lead. A notch that is recessed toward the center of the main lead in plan view as seen in the thickness direction of the semiconductor element is formed in the main lead.

公开(公告)号：USD993201S1

公开(公告)日：2023-07-25

申请号：US29806373

申请日：2021-09-02

Applicant: ROHM CO., LTD.

Designer： Koshun Saito ,  Kota Ise

Abstract: FIG. 1 is a front, top and right side perspective view of a semiconductor module showing our new design;
FIG. 2 is a rear, bottom and left side perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a right side view thereof; and,
FIG. 8 is a left side view thereof.
The broken lines illustrate portions of the semiconductor module that form no part of the claimed design.

公开(公告)号：US11742279B2

公开(公告)日：2023-08-29

申请号：US17166102

申请日：2021-02-03

Applicant: Rohm Co., Ltd.

Inventor： Kota Ise ,  Koshun Saito

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L23/495

CPC classification number: H01L23/49861 ,  H01L23/3114 ,  H01L23/49811 ,  H01L24/45 ,  H01L23/49562 ,  H01L2924/12 ,  H01L2924/1304

Abstract: A semiconductor device includes a semiconductor element, a first lead supporting the semiconductor element, a second lead separated from the first lead, and a connection lead electrically connecting the semiconductor element to the second lead. The connection lead has an end portion soldered to the second lead. This connection-lead end portion has a first surface facing the semiconductor element and a second surface opposite to the first surface. The second lead is formed with a recess that is open toward the semiconductor element. The recess has a side surface facing the second surface of the connection-lead end portion. A solder contact area of the second surface of the connection-lead end portion is larger than a solder contact area of the first surface of the connection-lead end portion.

公开(公告)号：US10943861B2

公开(公告)日：2021-03-09

申请号：US16694470

申请日：2019-11-25

Applicant: Rohm Co., Ltd.

Inventor： Kota Ise ,  Koshun Saito

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor device includes a semiconductor element, a first lead supporting the semiconductor element, a second lead separated from the first lead, and a connection lead electrically connecting the semiconductor element to the second lead. The connection lead has an end portion soldered to the second lead. This connection-lead end portion has a first surface facing the semiconductor element and a second surface opposite to the first surface. The second lead is formed with a recess that is open toward the semiconductor element. The recess has a side surface facing the second surface of the connection-lead end portion. A solder contact area of the second surface of the connection-lead end portion is larger than a solder contact area of the first surface of the connection-lead end portion.