-
公开(公告)号：US08706228B2
公开(公告)日：2014-04-22
申请号：US12750687
申请日：2010-03-30
Applicant: Rajesh V. Iyer , Lea A. Nygren , Stephanie L. McCracken , Mukul Jain , Steven M Dufon , Christine Gale Kronich
Inventor： Rajesh V. Iyer , Lea A. Nygren , Stephanie L. McCracken , Mukul Jain , Steven M Dufon , Christine Gale Kronich
IPC: A61N1/00
CPC classification number: A61N1/3754
Abstract: An electronic module assembly (EMA) for an implantable medical device is disclosed. The EMA includes conductive strips connected to a non-conductive block. The non-conductive block possesses, a top side, a bottom side, a front side and a back side. A seamless non-conductive barrier extends from the bottom side and between the front side and the back side. The barrier prevents a pin from contacting another pin and eliminates welding of the ground pin to the side of the ferrule.
Abstract translation: 公开了一种用于可植入医疗装置的电子模块组件（EMA）。 EMA包括连接到非导电块的导电条。 非导电块具有顶侧，底侧，前侧和后侧。 无缝的非导电屏障从底侧延伸，在前侧和后侧之间延伸。 屏障防止销钉接触另一个销钉，并消除接地销焊接到套圈侧面。
-
公开(公告)号：US20130070423A1
公开(公告)日：2013-03-21
申请号：US13239037
申请日：2011-09-21
Applicant: Rajesh V. Iyer , Michael G. Marinkov , Lea A. Nygren , Jeffrey J. Clayton , James Strom , Thomas E. Meyer , Steven T. Deininger , Wayne R. Kuechenmeister
Inventor： Rajesh V. Iyer , Michael G. Marinkov , Lea A. Nygren , Jeffrey J. Clayton , James Strom , Thomas E. Meyer , Steven T. Deininger , Wayne R. Kuechenmeister
CPC classification number: A61N1/3754 , H01R24/68 , H01R43/20 , H01R2107/00
Abstract: A connector assembly for an implantable medical device includes a plurality of feedthroughs mounted in a conductive array plate, each feedthrough in the plurality of feedthroughs including a feedthrough pin electrically isolated from the conductive array plate by an insulator and an electronic module assembly including a plurality of conductive strips set in a non-conductive block. The plurality of conductive strips is in physical and electrical contact with the feedthrough pins at an angle of less than 135 degrees. The connector assembly further includes at least one circuit, the circuit including a plurality of conductors corresponding to the plurality of feedthroughs. The plurality of conductors of the circuit is in physical and electrical contact with a corresponding one of the conductive strips of the plurality of conductive strips of the electronic module assembly at an angle of less than 135 degrees.
Abstract translation: 用于可植入医疗装置的连接器组件包括安装在导电阵列板中的多个馈通，多个馈通中的每个馈通包括通过绝缘体与导电阵列板电绝缘的馈通引脚，以及包括多个 导电条设置在非导电块中。 多个导电条以小于135度的角度与馈通销物理和电接触。 连接器组件还包括至少一个电路，该电路包括对应于多个馈通的多个导体。 电路的多个导体以小于135度的角度物理和电接触电子模块组件的多个导电条中的相应导电条之一。
-
公开(公告)号：US08373965B2
公开(公告)日：2013-02-12
申请号：US12368847
申请日：2009-02-10
Applicant: Rajesh V. Iyer
Inventor： Rajesh V. Iyer
IPC: H01G4/00
CPC classification number: H01G4/35 , A61N1/3754 , H01G4/236 , Y10T29/43
Abstract: A system and method for sealing a capacitor bottom in a filtered feedthrough. The feedthrough comprises a ferrule, a capacitor, at least one terminal pin and a support structure. The support structure includes at least one projection that extends into an aperture of the capacitor. The projection includes an opening through which the at least one terminal pin extends such that, in an assembled state, the terminal pin extends through the opening of the projection and the aperture of the capacitor.
-
公开(公告)号：US20100284124A1
公开(公告)日：2010-11-11
申请号：US12436392
申请日：2009-05-06
Applicant: Rajesh V. Iyer
Inventor： Rajesh V. Iyer
IPC: H01G4/35
CPC classification number: H01G2/20 , A61N1/3754 , H01G2/106 , H01G4/236 , H01G4/35 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49004
Abstract: A capacitor assembly for use in, and a method of assembling, a filtered feedthrough. The capacitor includes an insulative member fixedly attached to its bottom portion to inhibit high voltage arcing. The termination material present on the inner and outer diameters of the capacitor is absent from a portion of the capacitor proximate the bottom portion, e.g., at the insulative member.
Abstract translation: 一种电容器组件，用于组装滤波后的馈通。 电容器包括固定地附接到其底部的绝缘构件，以抑制高电压电弧。 存在于电容器的内径和外径上的端接材料不存在靠近底部的电容器的一部分，例如在绝缘构件上。
-
公开(公告)号：US20100179606A1
公开(公告)日：2010-07-15
申请号：US12571051
申请日：2009-09-30
Applicant: Rajesh V. Iyer
Inventor： Rajesh V. Iyer
CPC classification number: A61N1/3754 , H01G4/35 , Y10T29/49002
Abstract: A filtered feedthrough assembly includes a capacitor comprising a top portion, a bottom portion, an outer diameter portion and an inner diameter portion. The inner diameter portion defines at least one aperture extending from the top portion to the bottom portion. A conductive annular member is placed onto the top portion around the at least one aperture. A feedthrough pin extends through each of the apertures and is soldered to the inner diameter portion of the capacitor by application of a solder preform upon the conductive pad of conductive material.
Abstract translation: 滤波后的馈通组件包括一个包括顶部，底部，外径部分和内径部分的电容器。 内径部分限定从顶部延伸到底部的至少一个孔。 导电环形构件被放置在围绕所述至少一个孔的顶部上。 馈通销延伸穿过每个孔，并且通过在导电材料的导电焊盘上施加焊料预制件而被焊接到电容器的内径部分。
-
Patent Agency Ranking
公开(公告)号：US20100177458A1
公开(公告)日：2010-07-15
申请号：US12351946
申请日：2009-01-12
Applicant: Rajesh V. Iyer
Inventor： Rajesh V. Iyer
CPC classification number: H01G4/35 , A61N1/3754 , Y10T29/43
Abstract: A filtered feedthrough assembly includes a capacitor comprising a top portion, a bottom portion, an outer diameter portion and an inner diameter portion. The inner diameter portion defines at least one aperture extending from the top portion to the bottom portion. An conductive pad of conductive material is applied to the top portion around the at least one aperture. A feedthrough pin extends through each of the apertures and is soldered to the inner diameter portion of the capacitor by application of a solder preform upon the conductive pad of conductive material.
Abstract translation: 滤波后的馈通组件包括一个包括顶部，底部，外径部分和内径部分的电容器。 内径部分限定从顶部延伸到底部的至少一个孔。 导电材料的导电垫被施加到围绕所述至少一个孔的顶部。 馈通销延伸穿过每个孔，并且通过在导电材料的导电焊盘上施加焊料预制件而被焊接到电容器的内径部分。
-
公开(公告)号：US07499817B2
公开(公告)日：2009-03-03
申请号：US11235944
申请日：2005-09-27
Applicant: Rajesh V. Iyer , Ryan J. Jensen , Curtis E. Burgardt , Susan A. Tettemer , Daniel J. Koch , Simon E. Goldman
Inventor： Rajesh V. Iyer , Ryan J. Jensen , Curtis E. Burgardt , Susan A. Tettemer , Daniel J. Koch , Simon E. Goldman
IPC: G06F19/00
CPC classification number: H04B15/00
Abstract: A determination of an equivalent series resistance (ESR) effect for high frequency filtering performance of a filtered feed-through assembly is described. A low frequency signal is introduced to a filtered feed-through assembly. ESR limit of the filtered feed-through is determined based on the low frequency signal.
Abstract translation: 描述了对过滤的馈通组件的高频滤波性能的等效串联电阻（ESR）效应的确定。 将低频信号引入过滤的馈通组件。 基于低频信号确定滤波后的馈通的ESR限制。
-
公开(公告)号：US08849404B2
公开(公告)日：2014-09-30
申请号：US13308144
申请日：2011-11-30
Applicant: Rajesh V. Iyer , Simon E. Goldman , Thomas P. Miltich
Inventor： Rajesh V. Iyer , Simon E. Goldman , Thomas P. Miltich
CPC classification number: A61N1/3754 , A61N1/3968 , H03H7/0138 , H03H2001/0042 , H05K13/00 , Y10T29/43 , Y10T29/435 , Y10T29/49002 , Y10T29/49165 , Y10T29/49171 , Y10T29/49208
Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and a lead frame assembly. The feedthrough may include at least one feedthrough conductive pathway and the capacitive filter array may include at least one filter array conductive pathway. The lead frame assembly may include an electrically conductive lead electrically connecting the at least one feedthrough conductive pathway and the at least one filter array conductive pathway.
Abstract translation: 馈通组件可以包括限定套圈开口的套圈，至少部分地设置在套圈开口内的馈通，至少部分地设置在套圈开口内的电容式滤波器阵列，以及引线框架组件。 馈通可以包括至少一个馈通导电路径，并且电容滤波器阵列可以包括至少一个滤波器阵列导电路径。 引线框架组件可以包括电连接至少一个馈通导电路径和至少一个滤波器阵列导电路径的导电引线。
-
9.发明申请公开(公告)号：US20140043739A1
公开(公告)日：2014-02-13
申请号：US13981264
申请日：2012-01-20
Applicant: Steven T. Deininger , Michael J. Baade , Rajesh V. Iyer
Inventor： Steven T. Deininger , Michael J. Baade , Rajesh V. Iyer
IPC: H05K7/02
CPC classification number: A61N1/3754 , A61N1/375 , H01G4/35 , H01R4/029 , H01R13/516 , H01R13/5224 , H01R24/58 , H01R43/26 , H01R2107/00 , H01R2201/12 , H05K7/02 , H05K7/1427 , Y10T29/4913 , Y10T29/49208
Abstract: Implantable medical devices include connector enclosure assemblies that utilize conductors electrically coupled to feedthrough pins that extend into a can where electrical circuitry is housed. The conductors may be coupled to the feedthrough pins and to capacitor plates within a filter capacitor by an electrically conductive bonding material and as a single bonding event during manufacturing. The base plate of the connector enclosure assembly may also include a ground pin. Ground capacitor plates may be present at a ground aperture of the filter capacitor where the ground pin passes through so that the ground pin, a ground conductor, and the ground capacitor plate may be coupled. A protective cover may be provided for the connector enclosure assembly to enclose the conductors intended to extend into the can prior to the assembly being joined to the can. Conductors may be attached to a common tab that is subsequently removed.
Abstract translation: 可植入医疗设备包括连接器外壳组件，其使用电耦合到馈通引脚的导体，所述引脚延伸到容纳电路的罐中。 导体可以通过导电接合材料和制造期间的单一接合事件耦合到馈通引脚和滤波电容器内的电容器板。 连接器外壳组件的基板还可以包括接地引脚。 接地电容器板可能存在于接地引脚穿过的滤波电容器的接地孔，使得接地引脚，接地导体和接地电容器板可以耦合。 可以为连接器外壳组件提供保护盖，以在组件连接到罐之前封闭旨在延伸到罐中的导体。 导体可以附接到随后被去除的公共标签上。
-
10.发明申请公开(公告)号：US20130176658A1
公开(公告)日：2013-07-11
申请号：US13346424
申请日：2012-01-09
Applicant: Rajesh V. Iyer , Simon E. Goldman , Thomas P. Miltich
Inventor： Rajesh V. Iyer , Simon E. Goldman , Thomas P. Miltich
IPC: H01G4/35
Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and a feedthrough at least partially disposed within the ferrule opening. In some examples, the capacitive filter array includes a filter array ground conductive pathway. In some examples, the feedthrough includes a feedthrough ground conductive via. The feedthrough ground conductive via may be electrically coupled to the filter array ground conductive pathway, and the feedthrough ground conductive via may be electrically coupled to the ferrule.
Abstract translation: 馈通组件可以包括限定套圈开口的套圈，至少部分地设置在套圈开口内的电容式过滤器阵列，以及至少部分地设置在套圈开口内的馈通。 在一些示例中，电容滤波器阵列包括滤波器阵列接地导电路径。 在一些示例中，馈通包括馈通地导电通孔。 馈通地导电通孔可以电耦合到过滤器阵列接地导电通路，并且馈通地导电通孔可以电耦合到套圈。
-
-
-
-
-
-
-
-
-
Search Results
49
records
(took 0.021 seconds)
