公开(公告)号：US09673178B2

公开(公告)日：2017-06-06

申请号：US14970558

申请日：2015-12-16

Applicant: Powertech Technology Inc.

Inventor： Chia-Hsiang Yuan ,  Chia-Wei Chang ,  Kuo-Ting Lin ,  Yong-Cheng Chuang

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L24/03 ,  H01L24/06 ,  H01L24/20 ,  H01L24/45 ,  H01L24/85 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/06505 ,  H01L2224/12105 ,  H01L2224/214 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92224 ,  H01L2225/06506 ,  H01L2225/06562 ,  H01L2225/1035 ,  H01L2225/1058

Abstract: Provided is a package structure including a substrate, N dies, N first pads, N vertical wires, and a second pad. The N dies are stacked alternatively on the substrate, so as to form a multi-die stack structure. The N dies include, from bottom to top, first to Nth dies, wherein N is an integer greater than 1. The first die is a bottom die, and the Nth die is a top die. The first pads are disposed on an active surface of the dies respectively. The vertical wires are disposed on the first pads respectively. The second pad is disposed on the top die.

公开(公告)号：US20170110439A1

公开(公告)日：2017-04-20

申请号：US14970558

申请日：2015-12-16

Applicant: Powertech Technology Inc.

Inventor： Chia-Hsiang Yuan ,  Chia-Wei Chang ,  Kuo-Ting Lin ,  Yong-Cheng Chuang

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L24/03 ,  H01L24/06 ,  H01L24/20 ,  H01L24/45 ,  H01L24/85 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/06505 ,  H01L2224/12105 ,  H01L2224/214 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92224 ,  H01L2225/06506 ,  H01L2225/06562 ,  H01L2225/1035 ,  H01L2225/1058

Abstract: Provided is a package structure including a substrate, N dies, N first pads, N vertical wires, and a second pad. The N dies are stacked alternatively on the substrate, so as to form a multi-die stack structure. The N dies include, from bottom to top, first to Nth dies, wherein N is an integer greater than 1. The first die is a bottom die, and the Nth die is a top die. The first pads are disposed on an active surface of the dies respectively. The vertical wires are disposed on the first pads respectively. The second pad is disposed on the top die.