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公开(公告)号：US11367709B2
公开(公告)日：2022-06-21
申请号：US15734772
申请日：2018-06-05
Applicant: PAC TECH—PACKAGING TECHNOLOGIES GMBH
Inventor： Matthias Fettke , Andrej Kolbasow
IPC: H01L25/065 , H01L23/36 , H01L23/498 , H01L23/00
Abstract: A semiconductor-chip stack package includes a plurality of semiconductor chips disposed in a stack arrangement and at least one connecting substrate which connects the semiconductor chips. The semiconductor chips include a chip terminal face on a chip edge extending at least partially as a side terminal face in a side surface of the semiconductor chip. The side surfaces of the semiconductor chips provided with the side terminal face are arranged in a shared side surface plane S of the semiconductor-chip stack arrangement. The connecting substrate is arranged with a contact surface parallel to the side surface plane S of the semiconductor chips. Substrate terminal faces are formed on the contact surface for connecting a connection conductor structure formed in the connecting substrate and which are connected to the side terminal faces via a connecting material in a connection plane V1 parallel to the contact surface.
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公开(公告)号：US20220132714A1
公开(公告)日：2022-04-28
申请号：US17507684
申请日：2021-10-21
Applicant: Pac Tech - Packaging Technologies GmbH
Inventor： Matthias Fettke , Andrej Kolbasow
Abstract: A device for removing or repositioning defective and erroneously placed electronic components from circuit boards includes a vacuum suction nozzle, a laser beam and a temperature sensor. The vacuum nozzle has an adaptor tip at which suction is generated. The adaptor tip is larger than the defective or erroneously positioned electronic component. The laser beam is emitted out of the suction opening towards the electronic component on the circuit board. The temperature sensor measures the temperature of the electronic component based on infrared radiation emitted from around the electronic component. A method for removing or repositioning the defective or erroneously placed electronic component from the circuit board positions the adaptor tip over the electronic component and directs the laser beam through the suction opening and onto the electronic component so as to heat and detach the electronic component, which is then removed or repositioned and remounted on the circuit board.
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公开(公告)号：US20220126398A1
公开(公告)日：2022-04-28
申请号：US17164159
申请日：2021-02-01
Applicant: Pac Tech - Packaging Technologies GmbH
Inventor： Matthias Fettke , Andrej Kolbasow
IPC: B23K26/12 , H01L25/075 , B23K26/03 , B23K26/38 , H05K3/30
Abstract: A device for removing a defective electronic component from a circuit board includes a vacuum suction nozzle, a laser beam emitter and an infrared temperature sensor. The vacuum suction nozzle has a suction opening at which suction is generated. The suction opening is dimensioned to be larger than the defective electronic component. The laser beam emitter is oriented so as to emit a laser beam out the suction opening towards the electronic component on the circuit board. The temperature sensor measures the temperature of the electronic component based on infrared radiation emitted from around the electronic component. A method for removing the defective electronic component from the circuit board includes positioning the suction opening over the electronic component and directing the laser beam through the suction opening and onto the electronic component so as to heat and detach the electronic component, which is then sucked into the vacuum suction nozzle.
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公开(公告)号：US20250038468A1
公开(公告)日：2025-01-30
申请号：US18770958
申请日：2024-07-12
Applicant: Pac Tech - Packaging Technologies GmbH
Inventor： Matthias Fettke , Andrej Kolbasow , Thorsten Krause
Abstract: A package comprises at least two contacts for microtechnology, the contacts each having a contact surface, the contacts being connected to at least one support structure and the contacts being spaced apart from each other and disposed in such a manner that the contact surfaces are disposed in one plane and are oriented in the same direction. The support structure is made of a connective material being separable and/or destroyable by a laser. Furthermore, a method for handling such a package and a tool for implementing such a method are provided.
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公开(公告)号：US12171066B2
公开(公告)日：2024-12-17
申请号：US17507684
申请日：2021-10-21
Applicant: Pac Tech—Packaging Technologies GmbH
Inventor： Matthias Fettke , Andrej Kolbasow
Abstract: A device for removing or repositioning defective and erroneously placed electronic components from circuit boards includes a vacuum suction nozzle, a laser beam and a temperature sensor. The vacuum nozzle has an adaptor tip at which suction is generated. The adaptor tip is larger than the defective or erroneously positioned electronic component. The laser beam is emitted out of the suction opening towards the electronic component on the circuit board. The temperature sensor measures the temperature of the electronic component based on infrared radiation emitted from around the electronic component. A method for removing or repositioning the defective or erroneously placed electronic component from the circuit board positions the adaptor tip over the electronic component and directs the laser beam through the suction opening and onto the electronic component so as to heat and detach the electronic component, which is then removed or repositioned and remounted on the circuit board.
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Patent Agency Ranking
公开(公告)号：US12028987B2
公开(公告)日：2024-07-02
申请号：US17734031
申请日：2022-04-30
Applicant: Pac Tech—Packaging Technologies GmbH
Inventor： Matthias Fettke , Andrej Kolbasow , Nico Lange
IPC: B23K1/00 , B23K31/00 , B23K31/12 , H05K3/34 , B23K101/42
CPC classification number: H05K3/3468 , B23K1/0016 , B23K31/125 , H05K3/3415 , H05K3/3447 , B23K2101/42 , H05K2203/041 , H05K2203/086 , H05K2203/108 , H05K2203/111 , H05K2203/163
Abstract: A method for soldering an electronic component to a circuit board involves jetting liquefied solder. A laser beam melts a solid solder ball to produce a liquefied solder ball before the ball is jetted. The liquefied solder ball is jetted towards a through hole in the circuit board such that a portion of the liquefied solder ball flows into an annular gap between a pin and sides of the through hole. The pin is attached to the electronic component and passes through the through hole. As the liquefied solder ball is jetted towards the through hole, the laser beam is directed at the ball so as to keep it liquefied. How much of the solder ball remains outside the through hole after liquefied solder has flowed into the annular gap is determined. The filling degree of the annular gap is determined based on how much solder remains outside the hole.
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公开(公告)号：US20210193619A1
公开(公告)日：2021-06-24
申请号：US15734772
申请日：2018-06-05
Applicant: PAC TECH - PACKAGING TECHNOLOGIES GMBH
Inventor： Matthias Fettke , Andrej Kolbasow
IPC: H01L25/065 , H01L23/00 , H01L23/498 , H01L23/36
Abstract: A semiconductor-chip stack package includes a plurality of semiconductor chips disposed in a stack arrangement and at least one connecting substrate which connects the semiconductor chips. The semiconductor chips include a chip terminal face on a chip edge extending at least partially as a side terminal face in a side surface of the semiconductor chip. The side surfaces of the semiconductor chips provided with the side terminal face are arranged in a shared side surface plane S of the semiconductor-chip stack arrangement. The connecting substrate is arranged with a contact surface parallel to the side surface plane S of the semiconductor chips. Substrate terminal faces are formed on the contact surface for connecting a connection conductor structure formed in the connecting substrate and which are connected to the side terminal faces via a connecting material in a connection plane V1 parallel to the contact surface.
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公开(公告)号：US20240359272A1
公开(公告)日：2024-10-31
申请号：US18202881
申请日：2023-05-26
Applicant: Pac Tech - Packaging Technologies GmbH
Inventor： Matthias Fettke , Andrej Kolbasow , Thorsten Krause , Svetlana Milz
CPC classification number: B23K37/0408 , B23K26/20 , B23K26/702 , B23Q3/088 , B23K2101/42
Abstract: A bonding head for holding a substrate to be soldered includes a laser source, a vacuum source, a main body and a holding nozzle. A laser duct extends through the main body to a laser exit. The vacuum source creates a vacuum in the laser duct. The laser source directs the laser beam through the laser duct towards the laser exit. The holding nozzle is connected to the main body. A nozzle duct extends through the holding nozzle from a nozzle entry to a nozzle exit. The nozzle entry is adjacent to the laser exit. The holding nozzle is configured to hold the substrate at the nozzle exit when the vacuum source creates the vacuum in the laser duct. The laser beam passes through the nozzle duct and is directed towards the substrate. The holding nozzle is configured to hold the substrate over a mounting face of a second substrate.
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公开(公告)号：US20240109144A1
公开(公告)日：2024-04-04
申请号：US18375525
申请日：2023-10-01
Applicant: Pac Tech - Packaging Technologies GmbH
Inventor： Matthias Fettke , Andrej Kolbasow , Jan Hoffmann
CPC classification number: B23K1/0056 , B23K3/0623 , B23K3/082
Abstract: A soldering apparatus includes an application device, a conveying device and an application nozzle. The application device has a laser duct extending straight from a laser entry at the top to a laser exit at the bottom and a drop duct that extends from a drop entry at the top to a drop exit at the bottom of the application device. The conveying device separately conveys solder bodies to the drop entry. The application nozzle temporarily holds solder bodies received from the drop exit. The laser and drop ducts are interconnected over their entire lengths from the top to the bottom of the application device. The drop entry and laser entry are side by side and form a common entry. The drop exit and laser exit are spatially coincident and form a common exit that is smaller than the common entry. The application nozzle is connected to the common exit.
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公开(公告)号：US11217558B2
公开(公告)日：2022-01-04
申请号：US16623723
申请日：2018-03-15
Applicant: PAC TECH—PACKAGING TECHNOLOGIES GMBH
Inventor： Andrej Kolbasow , Jan Hoffmann , Matthias Fettke
IPC: H01L23/00 , B23K1/005 , B23K3/06 , B23K101/38
Abstract: A method and a device for establishing a wire connection between a first contact surface and at least one further contact surface. A contact end of a wire is positioned in a contact position relative to the first contact surface with a wire guiding tool. Subsequently, a mechanical, electrically conductive connection is established between the first contact surface and the contact end with a first solder material connection, and subsequently the wire guiding tool is moved to the further contact surface thus forming a wire section and establishing a further mechanical, electrically conductive connection between the wire section end and the further contact surface with a further solder material connection.
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